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XCZU15EG-1FFVC900E

Xilinx

XCZU15EG-1FFVC900E by Xilinx

XCZU15EG-1FFVC900E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. This GRID ARRAY package is ideal for applications requiring high-performance processing in compact form factors.

Median Price

$4,191.370

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Nova Conductors

Japan . 500 parts In-Stock

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Semicontronic

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One Stop Electronics

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Ampacity Inc.

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AZTECH Wire

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Modulus Dynamics

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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Qasali Group International

UK . 12,304 parts In-Stock

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Microchip USA

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Bastille Electronics

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Overview

Unlock unprecedented performance and reliability with the XCZU15EG-1FFVC900E by Xilinx. As a trusted industry leader, Xilinx brings cutting-edge technology to the forefront of innovation. This versatile microprocessor circuit offers endless possibilities for applications in various industries. With a robust package body material and superior surface mount capabilities, this product ensures seamless integration and optimal performance. Experience the power of Xilinx technology and elevate your projects to new heights with the XCZU15EG-1FFVC900E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable casing for the product, ideal for portability and long-term use.

Surface Mount: YES

Enables easy installation and replacement on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 0.876 V

Offers a high supply voltage capacity, allowing for stable and efficient operation of the product.

Package Shape: RECTANGULAR

Facilitates space-efficient placement on circuit boards, optimizing the layout for better functionality.

No. of Terminals: 900

Provides a high number of connection points, allowing for versatile integration and compatibility with various systems.

Package Style (Meter): GRID ARRAY

Enables a grid-like arrangement of terminals for organized and systematic connection within the product.

Minimum Supply Voltage: 0.825 V

Ensures reliable operation even at low supply voltages, enhancing the product's efficiency and performance.

Maximum Operating Temperature: 100 °C

Supports high temperature tolerance, making the product suitable for use in challenging environments or under heavy loads.

Minimum Operating Temperature: 0 °C

Maintains functionality even in low temperature conditions, enhancing the product's reliability and versatility.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Provides corrosion resistance and excellent conductivity for stable connections, ensuring long-lasting performance of the product.

Terminal Position: BOTTOM

Facilitates easy access and connection of terminals during installation and maintenance of the product.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for quick and efficient soldering processes, reducing production time and ensuring high-quality connections.

Peak Reflow Temperature °C: 245

Supports high-temperature reflow soldering, enhancing the product's durability and stability in demanding operating conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Features advanced processing capabilities, making the product suitable for complex tasks and applications requiring high computational power.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed operation, enhancing the product's energy efficiency and performance.

Terminal Form: BALL

Utilizes ball terminals for efficient and reliable connections, ensuring secure signal transmission within the product.

Nominal Supply Voltage: 0.85 V

Maintains a stable supply voltage level for consistent performance, contributing to the product's reliability and efficiency.

Moisture Sensitivity Level (MSL): 4

Indicates high resistance to moisture damage, ensuring the product's longevity and reliability in humid or damp environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU15EG-1FFVC900E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU15EG-1FFVC900E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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