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XCZU11EG-L2FFVC1156E

Xilinx

XCZU11EG-L2FFVC1156E by Xilinx

The Xilinx XCZU11EG-L2FFVC1156E is a CMOS microprocessor circuit with 1156 terminals in a grid array package. It operates b/w 0-110°C, with supply voltage range of 0.698-0.742 V. Ideal for applications requiring high-performance processing in compact form factors.

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Vyrian

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Ampacity Inc.

Singapore . 500 parts In-Stock

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AZTECH Wire

Italy . 806 parts In-Stock

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One Stop Electronics

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Corohmni

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Semicontronic

India . 1,245 parts In-Stock

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MARBEL Systems

Belgium . 2,732 parts In-Stock

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Texas Native Microelectronics

USA . 500 parts In-Stock

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Kenton Components

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Aztec Data Supply Inc.

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Modulus Dynamics

Lithuania . 997 parts In-Stock

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Microchip USA

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Qasali Group International

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Supply Digital

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Overview

Unlock the power of cutting-edge technology with the XCZU11EG-L2FFVC1156E by Xilinx. As a leader in the industry, Xilinx ensures top-notch quality and reliability in their products. This versatile microprocessor circuit offers endless possibilities for various applications, providing customers with unmatched value and performance. Whether you're in need of superior processing capabilities or advanced functionality, the XCZU11EG-L2FFVC1156E delivers exceptional benefits that set it apart from the competition. Experience innovation at its finest with Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface-mount technology allows for compact and efficient circuit design, saving space and improving performance.

Maximum Supply Voltage: 0.742 V

The maximum supply voltage ensures safe operation without risk of damage to the ICs.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various electronic designs.

No. of Terminals: 1156

High number of terminals provide flexibility for connecting the ICs to other components in a circuit.

Package Style (Meter): GRID ARRAY

Grid array package style offers increased connections and better heat dissipation for improved performance.

Minimum Supply Voltage: 0.698 V

Low minimum supply voltage allows for energy-efficient operation of the ICs.

Maximum Operating Temperature: 110 °C

Wide operating temperature range ensures reliability in various environmental conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

This finish provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position allows for easy mounting on PCBs and efficient heat dissipation.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time ensures fast manufacturing processes and reduces the risk of component damage.

Peak Reflow Temperature °C: 245

High peak reflow temperature ensures proper soldering and reliability during assembly.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit integration offers advanced processing capabilities and versatility for various applications.

Technology: CMOS

CMOS technology provides low power consumption and high-speed performance for efficient operation.

Terminal Form: BALL

Ball terminal form allows for precise and reliable connections in the circuit.

Nominal Supply Voltage: 0.72 V

Stable nominal supply voltage ensures consistent performance and safe operation of the ICs.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates that the product has moderate sensitivity to moisture, requiring proper handling and storage procedures.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU11EG-L2FFVC1156E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

Additional Features:

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

JESD-30 Code:

R-PBGA-B1156

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.742 V

Minimum Supply Voltage:

.698 V

Nominal Supply Voltage:

.72 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU11EG-L2FFVC1156E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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