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XCZU15EG-1FFVB1156E

Xilinx

XCZU15EG-1FFVB1156E by Xilinx

XCZU15EG-1FFVB1156E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1156 terminals in a GRID ARRAY package style. Operating b/w 0-100 °C, it's ideal for applications requiring high performance and low power consumption.

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Vyrian

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One Stop Electronics

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Ampacity Inc.

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AZTECH Wire

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Semicontronic

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MARBEL Systems

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Corohmni

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Texas Native Microelectronics

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Kenton Components

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Modulus Dynamics

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Qasali Group International

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Vigor

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Microchip USA

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Overview

Unlock unparalleled performance and efficiency with the XCZU15EG-1FFVB1156E by Xilinx, a cutting-edge microprocessor circuit that revolutionizes the way you approach digital design. Xilinx's reputation for innovation and reliability ensures top-notch quality, while the XCZU15EG-1FFVB1156E's versatile applications in Other Function uPs,uCs & Peripheral ICs guarantee endless possibilities for your projects. Experience seamless operation, enhanced productivity, and unmatched value with this game-changing technology - upgrade to the XCZU15EG-1FFVB1156E today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for smaller and more compact designs, making the product suitable for applications where space is limited.

Maximum Supply Voltage: 0.876 V

Higher maximum supply voltage provides flexibility in power requirements and compatibility with a wide range of systems.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space and easy integration into a variety of electronic devices.

No. of Terminals: 1156

Large number of terminals enable the product to connect to multiple components, increasing functionality and versatility.

Package Style (Meter): GRID ARRAY

Grid array package style offers better thermal performance and lower resistance, improving overall reliability and performance.

Minimum Operating Temperature: 0 °C

Wide operating temperature range allows the product to function effectively in various environments and conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit provides high processing power and efficient operation, making the product suitable for complex computational tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving energy efficiency and reliability of the product.

Nominal Supply Voltage: 0.85 V

Stable nominal supply voltage ensures consistent performance and reliable operation of the product over time.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU15EG-1FFVB1156E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1156

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU15EG-1FFVB1156E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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