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CC3000MODR

Texas Instruments

CC3000MODR by Texas Instruments

CC3000MODR by Texas Instruments is a surface-mount microprocessor circuit with 46 terminals. It operates b/w -20°C to 70°C, with a supply voltage range of 1.8V to 3.6V and max current draw of 275mA. Ideal for IoT devices, wearables, and smart home applications due to its compact size and low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,987 parts In-Stock

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Chip Stock

USA . 2,672 parts In-Stock

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Digiode

USA . 2,271 parts In-Stock

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SPM Sales

USA . 4 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 687 parts In-Stock

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$1.042

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687

$1.042

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Northwest PG Solutions

USA . 130 parts In-Stock

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$1.146

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$1.146

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AZTECH Wire

Italy . 625 parts In-Stock

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$9.761

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$9.761

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One Stop Electronics

USA . 930 parts In-Stock

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$33.000

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930

$33.000

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Corohmni

South Africa . 56 parts In-Stock

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$33.521

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$33.521

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Parana Technologies

USA . 1,727 parts In-Stock

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$58.571

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ChromeModa Solutions

Germany . 2,770 parts In-Stock

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$65.810

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$53.964

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IDEA Electronic Components Group

UK . 153 parts In-Stock

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$65.810

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$62.520

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$59.229

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Component Stockers USA

USA . 449 parts In-Stock

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$99.990

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Lixinc

USA . 12,079 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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Corphita

USA . 1,818 parts In-Stock

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DigiPath Technology Company

USA . 1,229 parts In-Stock

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$59.334

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$59.334

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Overview

Enhance your product's connectivity with the top-of-the-line CC3000MODR by Texas Instruments. With a reputation for excellence in the industry, Texas Instruments delivers high-quality products that are reliable and efficient. The CC3000MODR falls into the category of Other Function uPs,uCs & Peripheral ICs, offering versatility and performance for a wide range of applications. Experience seamless integration and increased functionality with this cutting-edge microprocessor circuit. Upgrade your devices today with the CC3000MODR and unlock a world of possibilities.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and secure mounting of the product on a PCB, ensuring efficient assembly and improved reliability.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage of 3.6V provides flexibility in powering the product, making it suitable for a variety of applications.

Package Shape: RECTANGULAR

The rectangular package shape offers efficient use of space on the PCB, allowing for compact and streamlined designs.

Power Supplies (V): 3.6

The power supply voltage of 3.6V ensures stable and reliable operation of the product under different load conditions.

No. of Terminals: 46

The large number of terminals (46) provides ample connectivity options, enabling the product to interface with multiple external components.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

The microelectronic assembly package style offers high integration possibilities, enabling the product to contain multiple functionalities within a small form factor.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage of 1.8V allows for efficient power consumption, making the product suitable for battery-powered applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures the product can operate reliably in harsh environments and under demanding conditions.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature of -20°C allows the product to function in cold climates or industrial applications where temperatures can drop significantly.

Maximum Seated Height: 2 mm

The low maximum seated height of 2mm ensures the product can be mounted in compact spaces without causing interference with other components on the PCB.

Width: 13.5 mm

The narrow width of 13.5mm allows for space-efficient placement of the product on the PCB, enabling high-density mounting and improved routing capability.

Length: 16.3 mm

The moderate length of 16.3mm provides a balanced form factor, allowing the product to fit comfortably within the layout of the PCB while still providing adequate room for connections.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The use of a microprocessor circuit as the peripheral IC type enables the product to perform advanced processing tasks, making it suitable for applications requiring high computational power.

Technology: CMOS

The CMOS technology enables low power consumption and high-speed operation, making the product energy-efficient and responsive in handling complex tasks.

Terminal Form: NO LEAD

The use of no-lead terminals eliminates the risk of solder joints cracking or breaking, ensuring reliable connectivity and improved durability of the product.

Maximum Supply Current: 275 mA

The maximum supply current of 275mA indicates the product can handle moderate power demands without compromising performance, making it suitable for a wide range of applications.

Nominal Supply Voltage: 2.7 V

The nominal supply voltage of 2.7V provides a stable operating voltage for the product, ensuring consistent performance and reliability in different operating conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC3000MODR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

SEATED HGT-NOM

JESD-30 Code:

R-XXMA-N46

Length:

16.3 mm

No. of Terminals:

46

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

UNSPECIFIED

Package Equivalence Code:

LGA46(UNSPEC)

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Power Supplies (V):

3.6

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

275 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

UNSPECIFIED

Width:

13.5 mm

Peripheral IC Type:

Trade Compliance

CC3000MODR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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