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CC3000YFVR

Texas Instruments

CC3000YFVR by Texas Instruments

CC3000YFVR by Texas Instruments is a MICROPROCESSOR CIRCUIT with 126 terminals in a RECTANGULAR package. It operates b/w -20 to 70 °C and supports supply voltages from 2.7V to 4.8V, making it ideal for IoT applications requiring low power consumption and high performance.

Median Price

$8.700

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 85,000 parts In-Stock

1+ parts

-

100+ parts

$6.960

1k+ parts

$6.230

10k+ parts

$5.860

85,000

-

$6.960

$6.230

$5.860

DigiKey

USA . 85,000 parts In-Stock

1+ parts

-

100+ parts

$9.160

1k+ parts

-

10k+ parts

-

85,000

-

$9.160

-

-

Verical

USA . 85,000 parts In-Stock

1+ parts

-

100+ parts

$8.700

1k+ parts

$7.787

10k+ parts

$7.325

85,000

-

$8.700

$7.787

$7.325

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,094 parts In-Stock

1+ parts

$7.344

100+ parts

-

1k+ parts

-

10k+ parts

-

1,094

$7.344

-

-

-

Vyrian

USA . 1,212 parts In-Stock

1+ parts

$7.730

100+ parts

-

1k+ parts

-

10k+ parts

-

1,212

$7.730

-

-

-

DigiKey Marketplace

USA . 85,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

85,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 1,952 parts In-Stock

1+ parts

$6.890

100+ parts

-

1k+ parts

-

10k+ parts

-

1,952

$6.890

-

-

-

Corphita

USA . 4,749 parts In-Stock

1+ parts

$6.957

100+ parts

-

1k+ parts

-

10k+ parts

-

4,749

$6.957

-

-

-

Parana Technologies

USA . 1,250 parts In-Stock

1+ parts

$43.180

100+ parts

$4,009.930

1k+ parts

$38.862

10k+ parts

-

1,250

$43.180

$4,009.930

$38.862

-

DigiPath Technology Company

USA . 877 parts In-Stock

1+ parts

$47.547

100+ parts

-

1k+ parts

-

10k+ parts

-

877

$47.547

-

-

-

ChromeModa Solutions

Germany . 5,501 parts In-Stock

1+ parts

$48.517

100+ parts

$39.784

1k+ parts

-

10k+ parts

-

5,501

$48.517

$39.784

-

-

IDEA Electronic Components Group

UK . 282 parts In-Stock

1+ parts

$48.517

100+ parts

$46.091

1k+ parts

$43.665

10k+ parts

-

282

$48.517

$46.091

$43.665

-

Authorized Procurement Solutions

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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12,000

-

-

-

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A-Z Elektronik GmbH

Germany . 5,447 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,447

-

-

-

-

Alle Elektronik GmbH

Germany . 3,631 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,631

-

-

-

-

Lixinc

USA . 2,309 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,309

-

-

-

-

Northwest PG Solutions

USA . 2,306 parts In-Stock

1+ parts

-

100+ parts

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2,306

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-

-

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Native Components

USA . 288 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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288

-

-

-

-

Kepictronics

USA . 211 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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211

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-

Overview

Elevate your projects with the CC3000YFVR by Texas Instruments, a top-of-the-line peripheral IC that promises reliability and high performance. Crafted with precision by industry leader Texas Instruments, this product is designed for maximum efficiency and seamless integration. Whether you're working on IoT devices, consumer electronics, or industrial applications, the CC3000YFVR offers unparalleled value and benefits. Say goodbye to technical headaches and hello to smooth operation with this cutting-edge solution.

Feature Benefit Bullets

Surface Mount: YES

This allows for easy and efficient mounting onto a circuit board, saving time and effort during assembly.

Maximum Supply Voltage: 4.8V

Provides flexibility in powering the product, accommodating a wide range of voltage inputs.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient space utilization on the circuit board, optimizing design layout.

No. of Terminals: 126

Having a high number of terminals allows for multiple connections and functionalities, enhancing the capabilities of the product.

Minimum Supply Voltage: 2.7V

Ensures proper functionality even with lower voltage inputs, making the product versatile in various power supply scenarios.

Maximum Operating Temperature: 70° Cel

Withstand high operating temperatures, ensuring reliability and stability under demanding conditions.

Minimum Operating Temperature: -20° Cel

Capable of functioning in low-temperature environments, expanding the range of applications where the product can be used.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporating a microprocessor circuit enhances the processing power and capabilities of the product, enabling complex functions and tasks to be performed efficiently.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to the efficiency and reliability of the product's operation.

Terminal Form: BALL

The ball terminal form provides reliable and secure connections, ensuring stable performance and durability of the product.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC3000YFVR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XBGA-B126

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

126

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Supply Voltage:

4.8 V

Minimum Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

CC3000YFVR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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