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CC3000YFVT

Texas Instruments

CC3000YFVT by Texas Instruments

The Texas Instruments CC3000YFVT is a MICROPROCESSOR CIRCUIT with 126 terminals in a GRID ARRAY package. It operates b/w -20°C to 70°C, with supply voltage range of 2.7V to 4.8V. Ideal for applications requiring high-performance uPs and uCs in a compact SQUARE package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,666 parts In-Stock

1+ parts

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7,666

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Digiode

USA . 2,826 parts In-Stock

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2,826

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 792 parts In-Stock

1+ parts

$4.894

100+ parts

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792

$4.894

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Native Components

USA . 877 parts In-Stock

1+ parts

$7.860

100+ parts

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877

$7.860

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Northwest PG Solutions

USA . 1,310 parts In-Stock

1+ parts

$8.646

100+ parts

$7.781

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1,310

$8.646

$7.781

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Parana Technologies

USA . 2,260 parts In-Stock

1+ parts

$19.859

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$19.816

10k+ parts

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2,260

$19.859

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$19.816

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DigiPath Technology Company

USA . 282 parts In-Stock

1+ parts

$21.868

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282

$21.868

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ChromeModa Solutions

Germany . 6,341 parts In-Stock

1+ parts

$22.314

100+ parts

$18.297

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6,341

$22.314

$18.297

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IDEA Electronic Components Group

UK . 388 parts In-Stock

1+ parts

$22.314

100+ parts

$21.198

1k+ parts

$20.083

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388

$22.314

$21.198

$20.083

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One Stop Electronics

USA . 1,574 parts In-Stock

1+ parts

$32.000

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1,574

$32.000

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Corohmni

South Africa . 91 parts In-Stock

1+ parts

$41.965

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91

$41.965

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Corphita

USA . 4,516 parts In-Stock

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4,516

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Overview

Discover the innovative CC3000YFVT by Texas Instruments, a cutting-edge microprocessor circuit that offers unmatched quality and reliability. With a package body material made of durable plastic/epoxy and a wide operating temperature range, this product is perfect for a variety of applications in the Other Function uPs,uCs & Peripheral ICs category. Texas Instruments' reputation for superior manufacturing ensures that customers receive top-notch performance and value. Experience seamless integration and exceptional functionality with the CC3000YFVT, the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount technology allows for easy assembly onto circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 4.8 V

With a maximum supply voltage of 4.8 V, this product can handle a wide range of power inputs, making it versatile for various applications.

Package Shape: SQUARE

The square package shape helps in efficient space utilization on the circuit board, especially for designs with limited space.

No. of Terminals: 126

Having 126 terminals allows for more connectivity options and functionality, making the product versatile for complex electronic designs.

Package Style (Meter): GRID ARRAY

The grid array package style provides better thermal performance and electrical characteristics compared to other package styles.

Minimum Supply Voltage: 2.7 V

With a minimum supply voltage of 2.7 V, the product can operate efficiently even with lower power sources, increasing its compatibility.

Maximum Operating Temperature: 70 °C

The product can withstand high temperatures up to 70°C, ensuring reliable performance in demanding environmental conditions.

Minimum Operating Temperature: -20 °C

With a minimum operating temperature of -20°C, the product remains operational even in cold environments, enhancing its reliability.

Terminal Position: BOTTOM

The bottom terminal position provides a secure connection to the circuit board, reducing the risk of disconnection or damage during use.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit peripheral IC type, this product offers advanced processing capabilities for efficient operation in complex electronic systems.

Technology: CMOS

CMOS technology ensures low power consumption, high speed, and reliability, making the product suitable for energy-efficient electronic devices.

Terminal Form: BALL

The ball terminal form provides excellent electrical connectivity and thermal performance, making the product reliable and efficient in operation.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC3000YFVT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B126

No. of Terminals:

126

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Supply Voltage:

4.8 V

Minimum Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

CC3000YFVT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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