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SLRC61002HN,518

NXP Semiconductors

SLRC61002HN,518 by NXP Semiconductors

SLRC61002HN,518 by NXP Semiconductors is a versatile microprocessor circuit in a square chip carrier package. It operates at 3.3/5V with a max temp of 85 °C and features 32 terminals. Ideal for compact applications requiring efficient power management and surface mount design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,860 parts In-Stock

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7,860

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Digiode

USA . 3,369 parts In-Stock

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3,369

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Anansix

USA . 1,755 parts In-Stock

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1,755

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Distributors (Availability)

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One Stop Electronics

USA . 1,529 parts In-Stock

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$16.000

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1,529

$16.000

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AZTECH Wire

Italy . 863 parts In-Stock

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$19.380

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863

$19.380

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Corohmni

South Africa . 2,724 parts In-Stock

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$61.991

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2,724

$61.991

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QUARKTWIN TECHNOLOGY LTD

USA . 14,907 parts In-Stock

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14,907

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UNI Independent Distributors

Spain . 6,605 parts In-Stock

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6,605

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Corphita

USA . 1,122 parts In-Stock

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Overview

Unlock the potential of your designs with the SLRC61002HN,518 from NXP Semiconductors. Renowned for their commitment to quality and innovation, NXP delivers a versatile microprocessor circuit that excels in reliability across diverse applications. Experience enhanced performance and efficiency, whether it’s for IoT devices or advanced automation systems. Elevate your projects with this compact solution that combines durability and cutting-edge technology for seamless integration.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and resistance to environmental factors, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for more compact design and easier integration into circuit boards, providing flexibility in product design.

Package Shape: SQUARE

The square package shape simplifies stacking and improves space efficiency on PCBs, facilitating high-density designs.

Power Supplies (V): 3.3/5

Supports common voltage levels, ensuring compatibility with a wide range of applications and reducing design complexity.

No. of Terminals: 32

With 32 terminals, this microprocessor circuit can connect to multiple peripherals, enabling complex functionalities in embedded systems.

Package Style (Meter): CHIP CARRIER

Chip carrier style provides robust connectivity and ease of handling, ensuring reliable performance in electronic assemblies.

Maximum Operating Temperature: 85 °C

Capable of operating at elevated temperatures, this product is suitable for high-temperature environments, ensuring reliability and longevity.

Minimum Operating Temperature: -25 °C

With a low operating temperature, the product is able to function in extreme cold, broadening its application scope in diverse climates.

Terminal Position: QUAD

Quad terminal positioning facilitates efficient connectivity and helps in maintaining a compact form factor, reducing layout complexity.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

As a microprocessor circuit, it supports advanced processing capabilities, making it ideal for applications requiring complex computation and control.

Terminal Form: NO LEAD

No lead terminals enhance solderability and enable a more compact design, contributing to reduced size and improved performance.

Maximum Supply Current: 20 mA

With a maximum supply current of 20 mA, the product is optimized for energy efficiency, making it suitable for battery-operated devices.

Terminal Pitch: 0.5 mm

A small terminal pitch of 0.5 mm allows for higher density mounting options, which is essential for modern compact electronic designs.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SLRC61002HN,518 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N32

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

20 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

SLRC61002HN,518 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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