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SLRC61002HN,118

NXP Semiconductors

SLRC61002HN,118 by NXP Semiconductors

SLRC61002HN,118 by NXP Semiconductors is a microprocessor circuit in a square chip carrier package. It operates at 3.3/5V with a max temp of 85 °C and features 32 terminals. Ideal for compact applications requiring reliable performance in harsh environments.

Median Price

$6.780

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 19,776 parts In-Stock

1+ parts

$6.780

100+ parts

$5.126

1k+ parts

$4.510

10k+ parts

$4.108

19,776

$6.780

$5.126

$4.510

$4.108

Mouser Electronics

USA . 333 parts In-Stock

1+ parts

$6.780

100+ parts

$4.710

1k+ parts

$4.000

10k+ parts

$3.930

333

$6.780

$4.710

$4.000

$3.930

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.736

6,000

-

-

-

$3.736

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,840 parts In-Stock

1+ parts

$5.956

100+ parts

-

1k+ parts

-

10k+ parts

-

4,840

$5.956

-

-

-

Vyrian

USA . 2,809 parts In-Stock

1+ parts

$6.270

100+ parts

-

1k+ parts

-

10k+ parts

-

2,809

$6.270

-

-

-

IBS Electronics

USA . 168,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$4.312

168,000

-

-

-

$4.312

NAC Semi

USA . 54,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$5.130

54,000

-

-

-

$5.130

Anansix

USA . 2,464 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,464

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 1,052 parts In-Stock

1+ parts

$4.133

100+ parts

-

1k+ parts

-

10k+ parts

-

1,052

$4.133

-

-

-

Corphita

USA . 448 parts In-Stock

1+ parts

$5.643

100+ parts

-

1k+ parts

-

10k+ parts

-

448

$5.643

-

-

-

UNI Independent Distributors

Spain . 1,008 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,008

-

-

-

-

Overview

Unlock unparalleled performance with the SLRC61002HN,118 from NXP Semiconductors. Renowned for their commitment to quality and innovation, NXP delivers a versatile microprocessor that excels in demanding applications. With robust operating ranges and exceptional reliability, this chip is perfect for advanced systems in automation, IoT, and beyond. Experience enhanced efficiency and seamless integration, empowering your projects to reach new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures reliability and resistance to environmental factors, making this product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy integration into modern circuit designs, enabling compact layouts and efficient manufacturing processes.

Package Shape: SQUARE

A square package shape aids in symmetrical mounting and efficient space utilization on the PCB, facilitating versatile design options.

Power Supplies (V): 3.3/5

Supports multiple supply voltages, allowing flexibility for various applications and ease of interfacing with existing systems.

No. of Terminals: 32

With 32 terminals, this device offers ample connectivity for various functionalities, enabling diverse application capabilities.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging enhances thermal performance and provides robust mechanical support, ensuring reliable operation in challenging environments.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85 °C allows the product to function effectively in high-temperature applications, enhancing reliability.

Minimum Operating Temperature: -25 °C

The ability to operate at -25 °C ensures functionality in cold environmental conditions, expanding its applicability across different industries.

Terminal Position: QUAD

The quad terminal configuration enables a compact footprint and simplifies PCB layout while increasing connection options.

Maximum Time At Peak Reflow Temperature: 30s

A peak reflow time of 30 seconds helps maintain solder joint integrity during manufacturing, ensuring long-lasting connections.

Peak Reflow Temperature: 260 °C

Withstanding peak reflow temperatures up to 260 °C ensures compatibility with modern soldering processes, making it suitable for high-volume production.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

As a microprocessor circuit, this product is versatile for various applications, enhancing performance and enabling complex processing tasks.

Terminal Form: NO LEAD

No lead design contributes to smaller package dimensions and reduced weight, making it ideal for space-constrained applications.

Maximum Supply Current: 20 mA

A maximum supply current of 20 mA allows for efficient power consumption, making it ideal for battery-operated devices.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch facilitates high-density assembly on PCBs, essential for compact electronic designs.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SLRC61002HN,118 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N32

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

20 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

SLRC61002HN,118 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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