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SLRC61002HN,151

NXP Semiconductors

SLRC61002HN,151 by NXP Semiconductors

SLRC61002HN,151 by NXP Semiconductors is a microprocessor circuit in a 32-terminal chip carrier package. It operates at 3.3/5V with a max temp of 85 °C and supports surface mount technology. Ideal for compact applications requiring reliable performance in harsh environments.

Median Price

$6.780

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 447 parts In-Stock

1+ parts

$6.780

100+ parts

$4.240

1k+ parts

$3.730

10k+ parts

-

447

$6.780

$4.240

$3.730

-

DigiKey

USA . 287 parts In-Stock

1+ parts

$6.780

100+ parts

$5.126

1k+ parts

$4.514

10k+ parts

$4.418

287

$6.780

$5.126

$4.514

$4.418

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,421 parts In-Stock

1+ parts

$3.876

100+ parts

-

1k+ parts

-

10k+ parts

-

1,421

$3.876

-

-

-

Vyrian

USA . 2,026 parts In-Stock

1+ parts

$4.080

100+ parts

-

1k+ parts

-

10k+ parts

-

2,026

$4.080

-

-

-

Anansix

USA . 2,116 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,116

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 3,108 parts In-Stock

1+ parts

$3.303

100+ parts

-

1k+ parts

-

10k+ parts

-

3,108

$3.303

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-

-

Corphita

USA . 679 parts In-Stock

1+ parts

$3.672

100+ parts

-

1k+ parts

-

10k+ parts

-

679

$3.672

-

-

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UNI Independent Distributors

Spain . 3,649 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,649

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Overview

Unlock unparalleled performance with the SLRC61002HN,151 from NXP Semiconductors—a trusted leader in innovative semiconductor solutions. This advanced microprocessor circuit excels in a variety of applications, offering unmatched reliability and efficiency in even the most demanding environments. With its robust design and superior thermal resistance, it ensures consistent operation across a broad temperature range, delivering exceptional value and benefits that empower your projects to thrive. Upgrade your technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and effective protection against environmental factors, making this product suitable for various applications.

Surface Mount: YES

Surface mount technology facilitates compact designs and high-density circuit layouts, enabling efficient use of board space.

Package Shape: SQUARE

The square package shape allows for uniform thermal dissipation and simplifies placement on the PCB, ensuring ease of manufacturing.

Power Supplies (V): 3.3/5

Compatible with both 3.3V and 5V power supplies, this product offers versatility for various electronic designs and applications.

No. of Terminals: 32

With 32 terminals, this IC can accommodate a wide range of input/output functions, enhancing its capability in complex systems.

Package Style (Meter): CHIP CARRIER

The chip carrier style is conducive to high-speed signal transmission, making it ideal for high-performance applications.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures reliability in environments with high heat, which is important for industrial applications.

Minimum Operating Temperature: -25 °C

With a minimum operating temperature of -25 °C, this product can function in colder temperatures, expanding its usability in various climates.

Terminal Position: QUAD

Quad terminal positioning allows for more flexible layouts and connections, facilitating easier integration into existing designs.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum reflow time is optimized for soldering processes, minimizing the risk of thermal damage during assembly.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures compatibility with lead-free soldering processes, accommodating modern manufacturing standards.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

As a microprocessor circuit, this IC can execute complex computations, making it ideal for advanced applications requiring processing power.

Terminal Form: NO LEAD

The no-lead terminal form is advantageous for enhancing electrical performance while reducing overall footprint, suitable for space-constrained designs.

Maximum Supply Current: 20 mA

A maximum supply current of 20 mA means this IC operates efficiently, helping to conserve energy in battery-powered applications.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for finer PCB designs, accommodating higher density circuitry without compromising performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SLRC61002HN,151 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N32

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

20 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

SLRC61002HN,151 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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