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PR601HL/C1,557

NXP Semiconductors

PR601HL/C1,557 by NXP Semiconductors

PR601HL/C1,557 by NXP Semiconductors is a microprocessor circuit in a square flatpack with 100 gull-wing terminals. It operates b/w -25 °C and 70 °C and supports power supplies of 3.3V and 5V. Ideal for various embedded applications, it features surface mount technology for efficient integration.

Median Price

$10.992

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 35 parts In-Stock

1+ parts

-

100+ parts

$9.770

1k+ parts

$8.740

10k+ parts

$8.220

35

-

$9.770

$8.740

$8.220

Verical

USA . 35 parts In-Stock

1+ parts

-

100+ parts

$12.213

1k+ parts

$10.925

10k+ parts

$10.275

35

-

$12.213

$10.925

$10.275

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,912 parts In-Stock

1+ parts

$10.326

100+ parts

-

1k+ parts

-

10k+ parts

-

4,912

$10.326

-

-

-

Vyrian

USA . 2,481 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,481

-

-

-

-

Anansix

USA . 2,105 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,105

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,240 parts In-Stock

1+ parts

$9.783

100+ parts

-

1k+ parts

-

10k+ parts

-

1,240

$9.783

-

-

-

AZTECH Wire

Italy . 483 parts In-Stock

1+ parts

$20.220

100+ parts

-

1k+ parts

-

10k+ parts

-

483

$20.220

-

-

-

Corohmni

South Africa . 3,004 parts In-Stock

1+ parts

$67.528

100+ parts

-

1k+ parts

-

10k+ parts

-

3,004

$67.528

-

-

-

UNI Independent Distributors

Spain . 4,009 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,009

-

-

-

-

Overview

Unlock innovation with the PR601HL/C1,557 from NXP Semiconductors, where quality meets performance. Designed for versatility, this microprocessor circuit thrives in diverse applications, ensuring reliability from -25 °C to 70 °C. With its compact square design and enhanced surface mount capabilities, it seamlessly integrates into your projects, delivering exceptional value and efficiency. Trust NXP, a leader in semiconductor solutions, to power your next breakthrough!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental stress, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space, which is ideal for modern electronic devices.

Package Shape: SQUARE

The square shape provides a standardized footprint, facilitating better heat distribution and improved layout flexibility on PCBs.

Power Supplies (V): 3.3, 5

Support for multiple voltage levels enhances versatility, allowing the microprocessor to be used in a wide range of systems and power configurations.

No. of Terminals: 100

The high number of terminals allows for extensive connectivity options, enabling complex functionalities and enhanced performance.

Package Style (Meter): FLATPACK

Flatpack design promotes a low profile which is beneficial for space-constrained applications, making it easier to integrate into various systems.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C offers reliability in moderate to warm environments, ensuring the device can function effectively without overheating.

Minimum Operating Temperature: -25 °C

Operating effectively at -25 °C makes this product suitable for outdoor or industrial applications, enhancing its usability in diverse environments.

Terminal Position: QUAD

Quad terminal positioning allows for efficient signal routing and enhanced performance, making it a robust choice for various electronic applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

As a microprocessor circuit, it delivers powerful processing capabilities, making it suitable for complex tasks such as data processing and control functions.

Terminal Form: GULL WING

Gull wing terminals provide an effective soldering surface, ensuring reliable connections and reducing the risk of mechanical failure during operation.

Terminal Pitch: 0.5 mm

A small terminal pitch of 0.5 mm allows for a high-density connection layout, which is essential for creating compact and efficient circuitry.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs PR601HL/C1,557 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQFP-G100

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Sub-Category:

Other Microprocessor ICs

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

PR601HL/C1,557 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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