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TMS320DM369ZCEF

Texas Instruments

TMS320DM369ZCEF by Texas Instruments

TMS320DM369ZCEF by Texas Instruments is a 32-bit microprocessor with 32768 RAM words. It operates at temperatures from -40 to 85 °C and supports Ethernet, I2C, SPI, UART, and USB buses. This low-profile IC in a square package is ideal for applications requiring high-speed data processing.

Median Price

$32.317

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,470 parts In-Stock

1+ parts

$32.317

100+ parts

$28.726

1k+ parts

$21.122

10k+ parts

-

2,470

$32.317

$28.726

$21.122

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 160 parts In-Stock

1+ parts

$25.023

100+ parts

$22.135

1k+ parts

$20.518

10k+ parts

-

160

$25.023

$22.135

$20.518

-

Digiode

USA . 2,200 parts In-Stock

1+ parts

$30.701

100+ parts

-

1k+ parts

-

10k+ parts

-

2,200

$30.701

-

-

-

Vyrian

USA . 2,115 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,115

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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160

-

-

-

-

Dan-Mar Components

USA . 160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

160

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 351 parts In-Stock

1+ parts

$12.810

100+ parts

-

1k+ parts

-

10k+ parts

-

351

$12.810

-

-

-

Corphita

USA . 1,396 parts In-Stock

1+ parts

$29.085

100+ parts

-

1k+ parts

-

10k+ parts

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1,396

$29.085

-

-

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Corohmni

South Africa . 1,923 parts In-Stock

1+ parts

$61.254

100+ parts

-

1k+ parts

-

10k+ parts

-

1,923

$61.254

-

-

-

Parana Technologies

USA . 1,452 parts In-Stock

1+ parts

$66.220

100+ parts

-

1k+ parts

-

10k+ parts

-

1,452

$66.220

-

-

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DigiPath Technology Company

USA . 728 parts In-Stock

1+ parts

$72.916

100+ parts

-

1k+ parts

-

10k+ parts

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728

$72.916

-

-

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Microchip USA

USA . 1,601 parts In-Stock

1+ parts

$73.960

100+ parts

$72.680

1k+ parts

$72.030

10k+ parts

$71.390

1,601

$73.960

$72.680

$72.030

$71.390

ChromeModa Solutions

Germany . 1,591 parts In-Stock

1+ parts

$74.404

100+ parts

$61.011

1k+ parts

-

10k+ parts

-

1,591

$74.404

$61.011

-

-

IDEA Electronic Components Group

UK . 755 parts In-Stock

1+ parts

$74.404

100+ parts

$70.684

1k+ parts

$66.964

10k+ parts

-

755

$74.404

$70.684

$66.964

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,500

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Overview

Experience the power of cutting-edge technology with the Texas Instruments TMS320DM369ZCEF. This high-quality microprocessor circuit offers unmatched performance and reliability, perfect for a wide range of applications. With a wide array of features and benefits, including a 32-bit bus compatibility and low profile package style, this innovative product provides customers with exceptional value and advantages. Trust in Texas Instruments to deliver top-of-the-line solutions for all your processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is cost-effective and lightweight, making this product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, making this product a convenient choice for manufacturers.

Package Shape: SQUARE

The square package shape offers efficient use of board space, making this product suitable for compact designs.

Bit Size: 32

With a 32-bit size, this product offers high processing power and efficiency for various tasks and applications.

Power Supplies (V): 1.35,1.8,3.3

Support for multiple power supply voltages provides flexibility and compatibility with different system requirements.

No. of Terminals: 338

The high number of terminals allows for a wide range of input and output connections, making this product versatile and adaptable.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low-profile, and fine pitch package styles offer enhanced performance and reliability in various environments.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh conditions and maintain consistent performance.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature ensures reliable operation in both extreme cold and hot environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and durability, ensuring long-term performance and reliability.

RAM Words: 32768

The generous RAM capacity of 32768 words allows for efficient data storage and processing, making this product suitable for complex applications.

Width: 13 mm

With a compact width of 13mm, this product can easily fit into tight spaces and small devices.

External Data Bus Width: 32

A 32-bit external data bus width enables high-speed data transfer and processing, enhancing the overall performance of the product.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds ensures efficient and reliable soldering during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper soldering and reliability of the product during manufacturing processes.

Length: 13 mm

With a compact length of 13mm, this product is suitable for space-constrained applications and designs.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this product offers advanced computing capabilities, making it suitable for a wide range of applications requiring complex processing tasks.

Technology: CMOS

The CMOS technology employed in this product offers low power consumption and high-speed operation, making it energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form ensures secure and reliable connections, enhancing the overall performance and durability of the product.

Bus Compatibility: ETHERNET; I2C; SPI; UART; USB

Support for multiple bus compatibility standards such as Ethernet, I2C, SPI, UART, and USB allows for seamless integration with various systems and devices.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm enables high-density packaging and efficient use of board space, making this product suitable for compact designs.

Format: FIXED POINT

The fixed-point format offers precise and efficient numerical calculations, making this product suitable for applications requiring high accuracy and performance.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product is resistant to moisture-induced damage, ensuring long-term reliability in humid environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM369ZCEF attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

32

Bus Compatibility:

ETHERNET; I2C; SPI; UART; USB

External Data Bus Width:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B338

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

338

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA338,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.35,1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

TMS320DM369ZCEF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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