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XCC3000MOD

Texas Instruments

XCC3000MOD by Texas Instruments

XCC3000MOD by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -20°C to 70°C, with supply voltage ranging from 1.8V to 3.6V. This RECTANGULAR package has 46 terminals and is ideal for IoT applications due to its compact size and low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,796 parts In-Stock

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Digiode

USA . 912 parts In-Stock

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AZTECH Wire

Italy . 859 parts In-Stock

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$11.240

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859

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One Stop Electronics

USA . 1,385 parts In-Stock

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$26.000

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$26.000

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Corohmni

South Africa . 176 parts In-Stock

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$40.312

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Parana Technologies

USA . 592 parts In-Stock

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$73.400

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592

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ChromeModa Solutions

Germany . 4,464 parts In-Stock

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$82.472

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$67.627

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$82.472

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IDEA Electronic Components Group

UK . 966 parts In-Stock

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$82.472

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$78.348

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$74.225

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966

$82.472

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$74.225

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DigiPath Technology Company

USA . 1,187 parts In-Stock

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$74.357

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Corphita

USA . 919 parts In-Stock

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Overview

Unlock the power of innovation with the XCC3000MOD by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and reliability in their products. The XCC3000MOD falls under the category of Other Function uPs,uCs & Peripheral ICs, making it versatile for a wide range of applications. This surface mount device offers a maximum supply voltage of 3.6V and a minimum supply voltage of 1.8V, providing flexibility in various operating conditions. With its compact package shape and no lead terminal form, this microprocessor circuit is perfect for space-constrained designs. Experience seamless performance and efficiency with the XCC3000MOD – a game-changer for your next project.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

Ability to operate at a higher supply voltage provides flexibility and compatibility with various power sources.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient utilization of space on the PCB, enhancing overall design flexibility.

No. of Terminals: 46

Having a higher number of terminals allows for more connectivity options and functionality within the circuit.

Minimum Operating Temperature: -20 °C

Wide operating temperature range ensures reliability and performance in various environmental conditions, even in colder temperatures.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Inclusion of microprocessor circuit enhances the processing capabilities of the device, enabling advanced functionality and performance.

Nominal Supply Voltage: 2.7 V

Operating at a nominal supply voltage of 2.7V ensures efficient power consumption and compatibility with common power sources.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCC3000MOD attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

SEATED HGT-NOM

JESD-30 Code:

R-XXMA-N46

Length:

16.3 mm

No. of Terminals:

46

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

UNSPECIFIED

Width:

13.5 mm

Peripheral IC Type:

Trade Compliance

XCC3000MOD Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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