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TMS320DM365ZCEZ

Texas Instruments

TMS320DM365ZCEZ by Texas Instruments

TMS320DM365ZCEZ by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width. It operates b/w 0-85 °C, with supply voltage range of 1.28-1.42 V. Ideal for applications requiring I2C, SPI, UART, USB bus compatibility in a compact GRID ARRAY package style.

Median Price

$24.312

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$24.312

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$24.312

-

-

-

Vyrian

USA . 8,554 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,554

-

-

-

-

Digiode

USA . 2,574 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,574

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,343 parts In-Stock

1+ parts

$12.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,343

$12.000

-

-

-

One Stop Electronics

USA . 469 parts In-Stock

1+ parts

$14.000

100+ parts

-

1k+ parts

-

10k+ parts

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469

$14.000

-

-

-

AZTECH Wire

Italy . 463 parts In-Stock

1+ parts

$15.064

100+ parts

-

1k+ parts

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10k+ parts

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463

$15.064

-

-

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Netroflash

USA . 100 parts In-Stock

1+ parts

$24.312

100+ parts

-

1k+ parts

$23.096

10k+ parts

$22.610

100

$24.312

-

$23.096

$22.610

Corohmni

South Africa . 3,104 parts In-Stock

1+ parts

$25.795

100+ parts

-

1k+ parts

-

10k+ parts

-

3,104

$25.795

-

-

-

Parana Technologies

USA . 1,978 parts In-Stock

1+ parts

$48.209

100+ parts

$4,476.903

1k+ parts

$43.388

10k+ parts

-

1,978

$48.209

$4,476.903

$43.388

-

DigiPath Technology Company

USA . 56 parts In-Stock

1+ parts

$53.084

100+ parts

$48.837

1k+ parts

-

10k+ parts

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56

$53.084

$48.837

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-

ChromeModa Solutions

Germany . 693 parts In-Stock

1+ parts

$54.167

100+ parts

$44.417

1k+ parts

-

10k+ parts

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693

$54.167

$44.417

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-

IDEA Electronic Components Group

UK . 214 parts In-Stock

1+ parts

$54.167

100+ parts

$51.459

1k+ parts

$48.750

10k+ parts

-

214

$54.167

$51.459

$48.750

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Microchip USA

USA . 1,675 parts In-Stock

1+ parts

$55.917

100+ parts

-

1k+ parts

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10k+ parts

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1,675

$55.917

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Corphita

USA . 3,739 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,739

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Overview

Experience the power of cutting-edge technology with the TMS320DM365ZCEZ by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products that exceed expectations. The TMS320DM365ZCEZ falls under the category of Other Function uPs,uCs & Peripheral ICs, offering a wide range of applications for various projects. With its advanced features and reliable performance, this product provides exceptional value to customers, ensuring seamless operation and unmatched benefits. Trust Texas Instruments to provide you with the best in innovative technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable electronics.

Surface Mount: YES

The surface mount feature allows for easy installation on PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.42 V

With a high maximum supply voltage, this product can handle various power sources, providing flexibility in design.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB, optimizing layout and reducing footprint.

No. of Terminals: 338

The high number of terminals provides ample connectivity options, enabling complex circuit designs.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style ensures reliable connections and efficient heat dissipation.

Minimum Supply Voltage: 1.28 V

The low minimum supply voltage allows for operation in energy-efficient and low-power applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in harsh environments or under heavy loads.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature makes this product suitable for both indoor and outdoor applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper offers excellent conductivity and corrosion resistance, enhancing the product's longevity.

Terminal Position: BOTTOM

The bottom terminal position allows for easy connection to the PCB and simplifies routing of traces for efficient signal flow.

Maximum Seated Height: 1.3 mm

The low maximum seated height minimizes the overall profile of the product, making it suitable for compact designs.

Width: 13 mm

The 13mm width provides a balance between compactness and accessibility, fitting easily into standard PCB layouts.

External Data Bus Width: 32

The 32-bit external data bus width allows for high-speed data transfer, improving overall system performance.

Maximum Time At Peak Reflow Temperature: 30s

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and prevents damage to the product during assembly.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature capability allows for reliable solder joints in lead-free assembly processes.

Length: 13 mm

The 13mm length complements the width and height of the product, creating a compact and balanced form factor.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The microprocessor circuit type offers advanced processing capabilities, making this product suitable for demanding applications.

Technology: CMOS

The use of CMOS technology provides low power consumption and high noise immunity, enhancing the product's efficiency and reliability.

Terminal Form: BALL

The ball terminal form simplifies installation and rework processes, ensuring easy maintenance and repair of the product.

Nominal Supply Voltage: 1.35 V

The nominal supply voltage of 1.35V offers a stable operating range, enabling consistent performance in a variety of conditions.

Bus Compatibility: I2C; SPI; UART; USB

The compatibility with multiple bus protocols allows for flexible interfacing with other devices and systems.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm provides high-density packaging capability, enabling compact and feature-rich designs.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates a moderate level of sensitivity to moisture, making proper handling and storage essential for product longevity.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM365ZCEZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bus Compatibility:

I2C; SPI; UART; USB

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B338

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

338

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

TMS320DM365ZCEZ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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