Loading...

MT9M413C36STC

Onsemi

MT9M413C36STC by Onsemi

The Onsemi MT9M413C36STC is a CMOS image sensor with 12x12 um pixel size, 1280H x 1024V resolution, and 66 MHz master clock. It operates at a voltage range of 3-3.6V, with a max current of 165mA. Ideal for high-speed imaging applications requiring digital output in industrial settings.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,440 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,440

-

-

-

-

Digiode

USA . 849 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

849

-

-

-

-

North Shore Components

USA . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TANS Electronics

Latvia . 7,368 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,368

-

-

-

-

SupplyDigital Components

Austria . 6,129 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,129

-

-

-

-

Kulean Microsystems

USA . 6,047 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,047

-

-

-

-

Perfect Parts

USA . 2,240 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,240

-

-

-

-

Corphita

USA . 2,023 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,023

-

-

-

-

Problanco Electronics

Mexico . 1,091 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,091

-

-

-

-

UHIMA Technologies

Türkiye . 222 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

222

-

-

-

-

Corohmni

South Africa . 183 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

183

-

-

-

-

Overview

Unlock a world of stunning visual experiences with the MT9M413C36STC by Onsemi. As a leading manufacturer in image sensors, Onsemi delivers top-notch quality and innovation. This sensor boasts a wide range of applications, from security cameras to industrial imaging. With its high-resolution capabilities and advanced technology, customers can expect unparalleled performance and reliability. Elevate your projects with the MT9M413C36STC and experience the difference in image quality and precision.

Feature Benefit Bullets

Pixel Size (um) 12X12

Higher pixel size allows for better image quality and resolution, making this image sensor a great choice for high-definition applications.

Maximum Supply Voltage 3.6 V

The higher maximum supply voltage ensures stable and reliable operation, providing consistent performance in various usage scenarios.

Master Clock 66 MHz

The fast master clock speed of 66 MHz enables quick data processing and high-speed image capture, essential for demanding imaging tasks.

Power Supplies (V) 3.3

The standard power supply voltage of 3.3V ensures compatibility with a wide range of electronic devices and systems, making this sensor versatile and easy to integrate.

Sensors or Transducers Type IMAGE SENSOR, CMOS

Utilizing CMOS technology allows for low power consumption, high sensitivity, and excellent noise performance, making this image sensor an efficient and reliable choice for imaging applications.

Minimum Supply Voltage 3 V

The low minimum supply voltage of 3V minimizes power consumption and extends battery life, making this image sensor an energy-efficient option for portable devices.

Maximum Operating Temperature 60 °C

The high maximum operating temperature of 60 °C ensures reliable performance in extreme environments, making this sensor suitable for a wide range of industrial and outdoor applications.

Horizontal Pixel 1280

The high horizontal pixel count of 1280 ensures detailed and sharp image capture, making this sensor ideal for applications requiring precise imaging and analysis.

Output Type DIGITAL VOLTAGE

The digital voltage output simplifies signal processing and integration with digital systems, offering efficient and accurate data transmission for various imaging applications.

Minimum Operating Temperature -5 °C

The low minimum operating temperature of -5 °C ensures consistent performance in cold environments, making this sensor suitable for applications in refrigerated or outdoor settings.

Maximum Operating Current 165 mA

The low maximum operating current of 165mA minimizes power consumption and heat generation, contributing to energy efficiency and long-term reliability of this image sensor.

Housing CERAMIC

The ceramic housing provides durability, thermal stability, and protection against environmental factors, making this sensor suitable for rugged and long-lasting applications.

Dynamic Range 59 dB

The high dynamic range of 59dB allows for accurate capture of both bright and dark areas in an image, ensuring excellent contrast and detail representation for various imaging tasks.

Vertical Pixel 1024

The vertical pixel count of 1024 offers a balanced resolution for capturing detailed images in both horizontal and vertical orientations, making this sensor versatile for various imaging requirements.

Termination Type SOLDER

The solder termination type provides a reliable and secure connection to circuit boards, ensuring stable operation and long-term performance of this image sensor in electronic devices.

Frame Rate 500 fps

The high frame rate of 500 frames per second enables smooth and high-speed image capture, making this sensor suitable for applications requiring fast-motion analysis and real-time imaging.

Array Type FRAME

The frame array type allows for organized and efficient pixel arrangement, ensuring consistent image quality and data processing for accurate and reliable imaging results with this sensor.

Mounting Feature SURFACE MOUNT

The surface mounting feature enables easy and secure installation on circuit boards, facilitating quick integration and compact design for space-constrained applications using this image sensor.

Technical Specifications

Image Sensors MT9M413C36STC attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC SHUTTER

Array Type:

FRAME

Dynamic Range:

59 dB

Frame Rate:

500 fps

Horizontal Pixel:

1280

Housing:

CERAMIC

Master Clock:

66 MHz

Mounting Feature:

Maximum Operating Current:

165 mA

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-5 Cel

Optical Format (inch):

1

Output Type:

Pixel Size (um):

12X12

Power Supplies (V):

3.3

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Termination Type:

SOLDER

Vertical Pixel:

1024

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20