Loading...

MT9M021IA3XTM-DPBR1

Onsemi

MT9M021IA3XTM-DPBR1 by Onsemi

MT9M021IA3XTM-DPBR1 by Onsemi is a 1/3" CMOS image sensor with 1280x960 resolution. It operates at 50 MHz, offers 64 dB dynamic range, and has a sensitivity of 5.3 V/lx.s. Ideal for applications requiring high-quality digital imaging at up to 60 fps.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,195 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,195

-

-

-

-

Digiode

USA . 1,536 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,536

-

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,307 parts In-Stock

1+ parts

$0.750

100+ parts

-

1k+ parts

-

10k+ parts

-

1,307

$0.750

-

-

-

Aztec Data Supply Inc.

USA . 4,651 parts In-Stock

1+ parts

$3.100

100+ parts

-

1k+ parts

-

10k+ parts

-

4,651

$3.100

-

-

-

AZTECH Wire

Italy . 871 parts In-Stock

1+ parts

$10.381

100+ parts

-

1k+ parts

-

10k+ parts

-

871

$10.381

-

-

-

A-Z Elektronik GmbH

Germany . 7,308 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,308

-

-

-

-

TANS Electronics

Latvia . 7,018 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,018

-

-

-

-

Kulean Microsystems

USA . 6,797 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,797

-

-

-

-

SupplyDigital Components

Austria . 3,439 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,439

-

-

-

-

Problanco Electronics

Mexico . 3,346 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,346

-

-

-

-

Argo Parts USA

USA . 2,272 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,272

-

-

-

-

Corphita

USA . 1,695 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,695

-

-

-

-

UHIMA Technologies

Türkiye . 786 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

786

-

-

-

-

Futuretech Components

Singapore . 755 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

755

-

-

-

-

Continental Prestige Electronics

USA . 623 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

623

-

-

-

-

Kepictronics

USA . 438 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

438

-

-

-

-

Corohmni

South Africa . 367 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

367

-

-

-

-

Bastille Electronics

Australia . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Overview

Capture life's moments with the MT9M021IA3XTM-DPBR1 by Onsemi. This high-quality image sensor offers unrivaled performance and reliability, making it the perfect choice for a wide range of applications. Whether you're capturing stunning pictures or recording crystal-clear videos, this sensor delivers exceptional results every time. Trust in Onsemi's expertise in producing top-of-the-line imaging solutions, and experience the value and benefits that this product brings to your projects. Elevate your imaging experience with the MT9M021IA3XTM-DPBR1.

Feature Benefit Bullets

Pixel Size (um): 3.75

Small pixel size allows for higher resolution images with finer details.

Maximum Supply Voltage: 1.95 V

Higher supply voltage provides flexibility in power input.

Master Clock: 50 MHz

High master clock frequency enables fast data processing.

Body Width: 10 inch

Compact body size for easy integration into various devices.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensors are known for low power consumption and high integration capabilities.

Body Height: 1.38 mm

Slim body profile for space-constrained applications.

Package Shape or Style: SQUARE

Square package shape provides easy mounting and alignment.

Minimum Supply Voltage: 1.7 V

Low minimum supply voltage helps in power efficiency.

Maximum Operating Temperature: 70 °C

Wide operating temperature range for versatile usage in different environments.

Horizontal Pixel: 1280

High horizontal pixel count for detailed and sharp images.

Output Type: DIGITAL VOLTAGE

Digital output for easy connectivity with other digital devices.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature for use in extreme cold conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Quality terminal finish for reliable connections and durability.

Maximum Operating Current: 55 mA

Low operating current for energy efficiency.

Dynamic Range: 64 dB

High dynamic range for capturing a wide range of light intensities.

Vertical Pixel: 960

Sufficient vertical pixel count for good image quality.

Body Length/Diameter: 10 mm

Compact body size for easy integration and mounting.

Optical Format (inch): 1/3

Common optical format for compatibility with various lenses.

Termination Type: SOLDER

Solder termination for secure and stable connections.

Output Interface Type: 2-WIRE INTERFACE

Simple 2-wire interface for easy communication with host devices.

Frame Rate: 60 fps

High frame rate for capturing fast-moving objects with clarity.

Array Type: FRAME

Frame array type for organized and efficient image capture.

Sensitivity (V/lx.s): 5.3 V/lx.s

High sensitivity for capturing clear images even in low light conditions.

Mounting Feature: SURFACE MOUNT

Surface mount capability for easy and secure installation.

Technical Specifications

Image Sensors MT9M021IA3XTM-DPBR1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

GLOBAL SHUTTER; IT ALSO OPERATES AT ANALOG VOLTAGE OF 2.5 V TO 3.1 V

Array Type:

FRAME

Body Width:

10 inch

Body Height:

1.38 mm

Body Length/Diameter:

10 mm

Dynamic Range:

64 dB

Frame Rate:

60 fps

Horizontal Pixel:

1280

JESD-609 Code:

e1

Master Clock:

50 MHz

Mounting Feature:

Maximum Operating Current:

55 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Type:

Package Shape or Style:

Pixel Size (um):

3.75

Sensitivity (V/lx.s):

5.3 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

960

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19