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VSP2590ZWVR

Texas Instruments

VSP2590ZWVR by Texas Instruments

VSP2590ZWVR by Texas Instruments is an 8mm square CCD image sensor with a data rate of 42 Mbps. It operates b/w -25°C to 85°C, with supply voltage ranging from 2.7V to 3.3V. Ideal for applications requiring analog voltage output in plastic housing.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,523 parts In-Stock

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Digiode

USA . 2,313 parts In-Stock

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Parana Technologies

USA . 2,147 parts In-Stock

1+ parts

$1.713

100+ parts

$159.101

1k+ parts

$1.542

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2,147

$1.713

$159.101

$1.542

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DigiPath Technology Company

USA . 322 parts In-Stock

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$1.886

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$1.736

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322

$1.886

$1.736

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ChromeModa Solutions

Germany . 5,174 parts In-Stock

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$1.925

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$1.578

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$1.925

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IDEA Electronic Components Group

UK . 1,398 parts In-Stock

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$1.925

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$1.732

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$1.925

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AZTECH Wire

Italy . 856 parts In-Stock

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$8.207

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856

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One Stop Electronics

USA . 647 parts In-Stock

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$20.750

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$20.750

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Ampacity Inc.

Singapore . 1,454 parts In-Stock

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$38.750

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Semicontronic

India . 1,216 parts In-Stock

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$53.750

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$52.406

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$52.138

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QUARKTWIN TECHNOLOGY LTD

USA . 26,620 parts In-Stock

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,798 parts In-Stock

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Corphita

USA . 1,989 parts In-Stock

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Microchip USA

USA . 437 parts In-Stock

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Corohmni

South Africa . 200 parts In-Stock

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Overview

Elevate your imaging capabilities with the VSP2590ZWVR by Texas Instruments. Crafted with precision and expertise, this image sensor offers unparalleled quality and reliability for a wide range of applications. Whether you're in the field of photography, surveillance, or medical imaging, this sensor delivers exceptional performance to meet your needs. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this product will exceed your expectations. Experience the value, benefits, and advantages that the VSP2590ZWVR brings to the table, and see your projects come to life like never before.

Feature Benefit Bullets

Maximum Supply Voltage: 3.3 V

Allows for reliable and safe operation within standard electronic circuits.

Body Width: 8 inch

Compact size makes it easy to integrate into various devices and systems.

Sensors or Transducers Type: IMAGE SENSOR,CCD

High-quality image sensor technology provides clear and accurate image capture.

Body Height: 0.9 mm

Low profile design allows for discreet placement in devices.

Package Shape or Style: SQUARE

Square shape makes it easy to mount and align within a device.

Minimum Supply Voltage: 2.7 V

Allows for flexible power supply options while maintaining performance.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for a variety of environments.

Output Type: ANALOG VOLTAGE

Analog output provides compatibility with a wide range of systems and applications.

Minimum Operating Temperature: -25 °C

Operates effectively in cold temperatures, increasing its versatility.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Ensures good connectivity and reliability for long-term use.

Maximum Operating Current: 10 mA

Low operating current helps conserve power and reduces heat generation.

Housing: PLASTIC

Lightweight and durable housing material for protection and ease of handling.

Body Length/Diameter: 8 mm

Compact size and shape for seamless integration into devices.

Data Rate: 42 Mbps

High data rate enables fast and smooth image data transmission.

Termination Type: SOLDER

Secure solder termination for reliable electrical connections.

Technical Specifications

Image Sensors VSP2590ZWVR attributes and parameters. Explore more Image Sensors devices from Texas Instruments

Specs

Body Width:

8 inch

Body Height:

.9 mm

Body Length/Diameter:

8 mm

Data Rate:

42 Mbps

Housing:

PLASTIC

JESD-609 Code:

e1

Maximum Operating Current:

10 mA

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Output Type:

Package Shape or Style:

Sensors or Transducers Type:

Maximum Supply Voltage:

3.3 V

Minimum Supply Voltage:

2.7 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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