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AR0331SRSC00SUCA0-DRBR1

Onsemi

AR0331SRSC00SUCA0-DRBR1 by Onsemi

The Onsemi AR0331SRSC00SUCA0-DRBR1 is a 2.2x2.2 um CMOS image sensor with 2048 (H) x 1536 (V) pixels, offering a dynamic range of 100 dB and sensitivity of 1.9 V/lx.s. It operates at temperatures ranging from -30 to 85 °C, with a max supply voltage of 1.95 V and frame rate of 60 fps, making it ideal for high-resolution imaging applications.

Median Price

$21.586

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Farnell

UK . 415 parts In-Stock

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$19.110

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$19.110

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Rochester

USA . 306 parts In-Stock

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-

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$18.370

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$16.440

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$15.470

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$15.470

DigiKey

USA . 306 parts In-Stock

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$25.330

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$25.330

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Verical

USA . 225 parts In-Stock

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$24.063

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$21.525

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$20.262

225

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$21.525

$20.262

Distributors (In-Stock)

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Digiode

USA . 2,207 parts In-Stock

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$20.368

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Vyrian

USA . 5,585 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 339 parts In-Stock

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$19.110

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$19.110

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Corphita

USA . 2,499 parts In-Stock

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$19.296

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SupplyDigital Components

Austria . 6,865 parts In-Stock

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Kulean Microsystems

USA . 6,831 parts In-Stock

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Northwest PG Solutions

USA . 2,223 parts In-Stock

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TANS Electronics

Latvia . 2,212 parts In-Stock

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Perfect Parts

USA . 2,061 parts In-Stock

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Problanco Electronics

Mexico . 1,885 parts In-Stock

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GreenTree Electronics

Israel . 460 parts In-Stock

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UHIMA Technologies

Türkiye . 332 parts In-Stock

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Continental Prestige Electronics

USA . 225 parts In-Stock

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Native Components

USA . 57 parts In-Stock

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Overview

Capture every moment with the AR0331SRSC00SUCA0-DRBR1 Image Sensor by Onsemi, a cutting-edge technology that delivers unrivaled quality and precision. Designed for a wide range of applications, this sensor provides exceptional performance and reliability, making it the perfect choice for your imaging needs. With its impressive features and advanced capabilities, this product offers value, benefits, and advantages that will exceed your expectations. Trust Onsemi for superior quality and innovation in image sensors.

Feature Benefit Bullets

Pixel Size (um): 2.2X2.2

Small pixel size allows for high resolution images to be captured with great detail.

Maximum Supply Voltage: 1.95 V

Allows for efficient power usage and avoids damage to the sensor.

Master Clock: 48 MHz

High master clock frequency enables fast image processing and data transfer.

Body Width: 10 inch

Compact body width makes it easy to integrate into various devices or systems.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensor technology provides high image quality and low power consumption.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for use in various environmental conditions.

Output Type: DIGITAL CURRENT

Digital current output simplifies interfacing with other electronic components.

Frame Rate: 60 fps

High frame rate enables smooth and detailed video capture.

Sensitivity (V/lx.s): 1.9 V/lx.s

High sensitivity allows for accurate image capture even in low light conditions.

Mounting Feature: SURFACE MOUNT

Surface mount capability makes installation and maintenance easy and convenient.

Technical Specifications

Image Sensors AR0331SRSC00SUCA0-DRBR1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER; IT ALSO REQUIRES 2.8V NOMINAL SUPPLY

Array Type:

FRAME

Body Width:

10 inch

Body Height:

1.25 mm

Body Length/Diameter:

10 mm

Dynamic Range:

100 dB

Frame Rate:

60 fps

Horizontal Pixel:

2048

Master Clock:

48 MHz

Mounting Feature:

Maximum Operating Current:

358 mA

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

2.2X2.2

Sensitivity (V/lx.s):

1.9 V/lx.s

Sensors or Transducers Type:

Spectral Response (nm):

350-1150

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Termination Type:

SOLDER

Vertical Pixel:

1536

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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