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AR0330CM1C12SHAA0-DR

Onsemi

AR0330CM1C12SHAA0-DR by Onsemi

The Onsemi AR0330CM1C12SHAA0-DR is a 1/3-inch CMOS image sensor with 2304x1296 pixels, offering a pixel size of 2.2x2.2 um and a max supply voltage of 1.9V. With an output range of 0.40-1.40V and frame rate of 60 fps, it is ideal for applications requiring high-resolution imaging in devices such as surveillance cameras and industrial inspection systems.

Median Price

$14.262

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 1,534 parts In-Stock

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$17.490

100+ parts

$13.494

1k+ parts

$12.636

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$17.490

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$12.636

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Rochester

USA . 22,944 parts In-Stock

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-

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$11.410

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$10.210

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$9.610

22,944

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$11.410

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$9.610

Verical

USA . 9,240 parts In-Stock

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$14.262

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$12.762

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$12.012

9,240

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$14.262

$12.762

$12.012

Flip Electronics (Authorized)

USA . 1,905 parts In-Stock

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Digiode

USA . 56 parts In-Stock

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$12.074

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56

$12.074

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Vyrian

USA . 1,982 parts In-Stock

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$12.710

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Flip Electronics

USA . 1,905 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 857 parts In-Stock

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$10.067

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857

$10.067

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Northwest PG Solutions

USA . 275 parts In-Stock

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$11.074

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$9.966

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275

$11.074

$9.966

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Corphita

USA . 1,628 parts In-Stock

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$11.439

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Corohmni

South Africa . 196 parts In-Stock

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$12.710

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Perfect Parts

USA . 9,520 parts In-Stock

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TANS Electronics

Latvia . 6,815 parts In-Stock

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Problanco Electronics

Mexico . 5,824 parts In-Stock

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SupplyDigital Components

Austria . 3,135 parts In-Stock

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Authorized Procurement Solutions

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Kulean Microsystems

USA . 2,816 parts In-Stock

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UHIMA Technologies

Türkiye . 682 parts In-Stock

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Kepictronics

USA . 237 parts In-Stock

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Overview

Capture stunning images with the AR0330CM1C12SHAA0-DR image sensor by Onsemi. Known for its quality and reliability, Onsemi delivers cutting-edge technology in the field of image sensors. This sensor is perfect for a wide range of applications, from security cameras to automotive systems. With its high performance and advanced features, this sensor offers customers exceptional value, superior benefits, and unmatched advantages. Upgrade your imaging experience with the AR0330CM1C12SHAA0-DR and see the difference for yourself.

Feature Benefit Bullets

Pixel Size (um): 2.2X2.2

The small pixel size allows for high resolution images to be captured with this image sensor.

Maximum Supply Voltage: 1.9 V

The low maximum supply voltage means that this image sensor is power efficient.

Master Clock: 27 MHz

The high master clock frequency allows for fast data processing and high frame rates.

Body Width: 11.43 inch

The compact body width makes this image sensor suitable for space-constrained applications.

Output Range: 0.40-1.40V

The wide output range provides flexibility in output voltage levels for different applications.

Array Type: FRAME

The frame array type allows for capturing full frames of images, making this image sensor versatile for various imaging needs.

Technical Specifications

Image Sensors AR0330CM1C12SHAA0-DR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER, IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 2.7-2.9V

Array Type:

FRAME

Body Width:

11.43 inch

Body Height:

2.275 mm

Body Length/Diameter:

11.43 mm

Dynamic Range:

69.5 dB

Frame Rate:

60 fps

Horizontal Pixel:

2304

Housing:

CERAMIC

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

137 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

2.2X2.2

Sensitivity (V/lx.s):

2 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Termination Type:

SOLDER

Vertical Pixel:

1296

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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