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KAF-4320E

Onsemi

KAF-4320E by Onsemi

The Onsemi KAF-4320E is a 24x24 um CCD image sensor with 1084x1084 pixels. It operates at a max supply voltage of 21V and has a spectral response range of 350-1000 nm. Ideal for high-resolution imaging applications, it features a data rate of 3 Mbps and through-hole mounting capability.

Median Price

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Lifecycle Status

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Digiode

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Vyrian

USA . 269 parts In-Stock

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TANS Electronics

Latvia . 8,008 parts In-Stock

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Problanco Electronics

Mexico . 5,795 parts In-Stock

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Corphita

USA . 1,816 parts In-Stock

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SupplyDigital Components

Austria . 1,715 parts In-Stock

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Corohmni

South Africa . 488 parts In-Stock

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Kulean Microsystems

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UHIMA Technologies

Türkiye . 156 parts In-Stock

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Overview

Capture every moment in stunning detail with the KAF-4320E Image Sensor by Onsemi. Known for their superior quality and cutting-edge technology, Onsemi delivers exceptional performance and reliability. Ideal for a wide range of applications, this CCD sensor offers high resolution and fast data rates, ensuring crisp and clear images every time. Experience the value and benefits of the KAF-4320E, where quality meets innovation for all your imaging needs.

Feature Benefit Bullets

Pixel Size (um): 24X24

The small pixel size of 24x24 um allows for high resolution image capture and detailed image quality.

Maximum Supply Voltage: 21 V

The high maximum supply voltage of 21 V ensures stable and reliable operation of the image sensor.

Body Width: 71.12 inch

The compact body width of 71.12 inch allows for easy integration and installation in a variety of devices or systems.

Sensors or Transducers Type: IMAGE SENSOR,CCD

The use of CCD image sensor technology ensures high-quality images with low noise levels and excellent light sensitivity.

Body Height: 3.91 mm

The slim body height of 3.91 mm enables the image sensor to be used in applications where space is limited.

Package Shape or Style: SQUARE

The square package shape or style allows for easy alignment and mounting of the image sensor in a variety of orientations.

Horizontal Pixel: 1084

With a high horizontal pixel count of 1084, this image sensor can capture detailed images with sharp clarity.

Vertical Pixel: 1084

The vertical pixel count of 1084 ensures that the image sensor can capture high-resolution images with excellent depth and detail.

Body Length/Diameter: 73.66 mm

The moderate body length/diameter of 73.66 mm provides a good balance between compact size and functionality for various applications.

Spectral Response (nm): 350-1000

The wide spectral response range of 350-1000 nm allows the image sensor to capture images across different wavelengths of light for versatile use.

Data Rate: 3 Mbps

The high data rate of 3 Mbps enables fast and efficient transfer of image data for real-time processing and analysis.

Termination Type: SOLDER

The solder termination type provides a secure and reliable connection for the image sensor, ensuring stable performance in various environments.

Array Type: FULL FRAME

The full-frame array type offers a larger imaging area for capturing more information in each frame, resulting in high-quality images with accurate details.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature allows for secure and stable installation of the image sensor on a PCB or other surfaces for reliable operation.

Technical Specifications

Image Sensors KAF-4320E attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

SENSITIVITY 10 UV/ELECTRON, ELECTRONIC SHUTTER

Array Type:

FULL FRAME

Body Width:

71.12 inch

Body Height:

3.91 mm

Body Length/Diameter:

73.66 mm

Data Rate:

3 Mbps

Horizontal Pixel:

1084

Mounting Feature:

Package Shape or Style:

Pixel Size (um):

24X24

Sensors or Transducers Type:

Spectral Response (nm):

350-1000

Maximum Supply Voltage:

21 V

Termination Type:

SOLDER

Vertical Pixel:

1084

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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