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VSP7500ZWVR

Texas Instruments

VSP7500ZWVR by Texas Instruments

VSP7500ZWVR by Texas Instruments is a 1.65-1.95V CCD image sensor with 8mm body length, suitable for applications requiring digital voltage output in temperatures ranging from -25 to 85°C. Its surface mount housing and tin/silver/copper terminal finish make it ideal for compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,639 parts In-Stock

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Digiode

USA . 107 parts In-Stock

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Parana Technologies

USA . 385 parts In-Stock

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$1.890

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$2.432

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385

$1.890

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$2.432

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DigiPath Technology Company

USA . 1,195 parts In-Stock

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$2.082

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$1.915

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$2.082

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IDEA Electronic Components Group

UK . 2,039 parts In-Stock

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$2.124

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$1.912

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$2.124

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ChromeModa Solutions

Germany . 1,923 parts In-Stock

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$2.124

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$1.742

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Ampacity Inc.

Singapore . 1,432 parts In-Stock

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$2.750

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AZTECH Wire

Italy . 255 parts In-Stock

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$12.407

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One Stop Electronics

USA . 920 parts In-Stock

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$22.750

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920

$22.750

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Semicontronic

India . 1,190 parts In-Stock

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$45.750

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$44.606

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$44.378

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$45.750

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Corphita

USA . 2,443 parts In-Stock

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Microchip USA

USA . 200 parts In-Stock

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Corohmni

South Africa . 80 parts In-Stock

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Overview

Capture every detail with the VSP7500ZWVR image sensor by Texas Instruments. As a leader in innovative technology, Texas Instruments delivers top-of-the-line products that exceed expectations. Ideal for a wide range of applications, this image sensor offers unparalleled value and benefits. Whether you're looking to enhance your surveillance system, improve your medical imaging equipment, or elevate your automotive safety features, the VSP7500ZWVR is the perfect solution. Trust Texas Instruments to provide the quality and reliability you need for all your imaging needs.

Feature Benefit Bullets

Maximum Supply Voltage: 1.95 V

Provides a high maximum supply voltage, ensuring that the image sensor can handle a wide range of input voltages.

Body Width: 8 inch

The compact size of 8 inches makes it easier to integrate this image sensor into various devices and systems.

Sensors or Transducers Type: IMAGE SENSOR, CCD

Being a CCD image sensor, it offers high-quality image capture and low noise performance.

Body Height: 1.2 mm

The low body height of 1.2 mm allows for a slim design and easy integration into compact devices.

Package Shape or Style: SQUARE

The square shape of the package provides stability and ease of mounting for the image sensor.

Minimum Supply Voltage: 1.65 V

With a low minimum supply voltage requirement, this image sensor can operate efficiently even at lower power levels.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures up to 85°C, making it suitable for a wide range of environments.

Output Range: 1.50-2.10V

The output voltage range of 1.50-2.10V provides flexibility in signal processing and compatibility with different systems.

Output Type: DIGITAL VOLTAGE

Provides digital output voltage, which can be easily interfaced with microcontrollers and other digital circuits.

Minimum Operating Temperature: -25 °C

Capable of operating at low temperatures down to -25°C, ensuring reliability in cold environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of multiple terminal finishes like tin, silver, and copper ensures reliable and durable connections for the image sensor.

Maximum Operating Current: 0.001 mA

Consumes very low operating current of 0.001 mA, making it energy-efficient and suitable for battery-powered devices.

Housing: PLASTIC

The plastic housing offers a lightweight solution while still providing adequate protection to the image sensor.

Body Length/Diameter: 8 mm

With a length/diameter of 8 mm, this image sensor is compact and suitable for integration in small devices or systems.

Termination Type: SOLDER

The solder termination type offers a secure and reliable connection for the image sensor during installation or assembly.

Mounting Feature: SURFACE MOUNT

The surface mount feature allows for easy and secure mounting of the image sensor on PCBs or other surfaces.

Technical Specifications

Image Sensors VSP7500ZWVR attributes and parameters. Explore more Image Sensors devices from Texas Instruments

Specs

Additional Features:

ITS ALSO OPERATES IN 2.7 TO 3.6V

Body Width:

8 inch

Body Height:

1.2 mm

Body Length/Diameter:

8 mm

Housing:

PLASTIC

JESD-609 Code:

e1

Mounting Feature:

Maximum Operating Current:

.001 mA

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Output Range:

Output Type:

Package Shape or Style:

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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