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AR0130CSSM00SPCA0-DRBR1

Onsemi

AR0130CSSM00SPCA0-DRBR1 by Onsemi

The Onsemi AR0130CSSM00SPCA0-DRBR1 is a 1/3 inch CMOS image sensor with 1280x960 pixels, offering a pixel size of 3.75um. It operates at a max supply voltage of 1.95V and features a master clock of 50MHz. Ideal for applications requiring high-resolution imaging in devices such as surveillance cameras and industrial inspection systems.

Median Price

$18.592

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 147 parts In-Stock

1+ parts

-

100+ parts

$12.960

1k+ parts

$11.590

10k+ parts

$10.910

147

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$12.960

$11.590

$10.910

Verical

USA . 76 parts In-Stock

1+ parts

-

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$24.225

1k+ parts

$21.675

10k+ parts

$20.400

76

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$24.225

$21.675

$20.400

Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$14.878

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50

$14.878

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Digiode

USA . 2,411 parts In-Stock

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$20.501

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2,411

$20.501

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Vyrian

USA . 7,125 parts In-Stock

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VNN

France . 4,509 parts In-Stock

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Flip Electronics

USA . 39 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 319 parts In-Stock

1+ parts

$14.581

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-

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319

$14.581

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Continental Prestige Electronics

USA . 3,511 parts In-Stock

1+ parts

$14.878

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$14.581

3,511

$14.878

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$14.581

Netroflash

USA . 100 parts In-Stock

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$14.878

100+ parts

-

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$14.135

10k+ parts

$13.837

100

$14.878

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$14.135

$13.837

Ampacity Inc.

Singapore . 112 parts In-Stock

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$18.340

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$18.340

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Semicontronic

India . 112 parts In-Stock

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$18.340

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$17.882

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$17.790

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112

$18.340

$17.882

$17.790

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AZTECH Wire

Italy . 565 parts In-Stock

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$19.206

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Corphita

USA . 257 parts In-Stock

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$19.422

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Problanco Electronics

Mexico . 6,325 parts In-Stock

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SupplyDigital Components

Austria . 1,923 parts In-Stock

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Kulean Microsystems

USA . 1,503 parts In-Stock

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Argo Parts USA

USA . 1,407 parts In-Stock

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UHIMA Technologies

Türkiye . 211 parts In-Stock

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TANS Electronics

Latvia . 173 parts In-Stock

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Overview

Capture stunning images with the AR0130CSSM00SPCA0-DRBR1 Image Sensor by Onsemi, a leading manufacturer known for top-quality products. Perfect for a wide range of applications, this CMOS sensor delivers exceptional performance and reliability. With a dynamic range of 82 dB and a high-resolution pixel array, it ensures crisp and clear images every time. Whether you're in the automotive industry, security surveillance, or consumer electronics, this sensor offers unparalleled value and benefits that will take your projects to the next level. Trust Onsemi for cutting-edge technology that makes a difference.

Feature Benefit Bullets

Pixel Size (um): 3.75

Provides high resolution images, making it ideal for capturing detailed images.

Maximum Supply Voltage: 1.95 V

Ensures stable performance and prevents damage from overvoltage.

Master Clock: 50 MHz

Enables fast and efficient data processing for quick image capture.

Body Width: 10 inch

Compact size allows for easy integration into various devices.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

Utilizes advanced CMOS technology for high-quality image sensing.

Body Height: 1.38 mm

Slim profile makes it suitable for compact electronic devices.

Package Shape or Style: SQUARE

Offers a versatile form factor for flexible installation options.

Minimum Supply Voltage: 1.7 V

Allows for low power consumption and efficient energy usage.

Maximum Operating Temperature: 70 °C

Withstands high temperatures for reliable performance in various environments.

Horizontal Pixel: 1280

Provides high-resolution horizontal image capture for detailed visuals.

Output Range: 0.40-1.50V

Offers a wide range of output voltage signals for compatibility with different systems.

Output Type: DIGITAL VOLTAGE

Delivers precise digital voltage output for accurate image data transfer.

Minimum Operating Temperature: -30 °C

Functions effectively in low-temperature conditions for versatile use.

Maximum Operating Current: 65 mA

Supports efficient current flow for optimized performance.

Housing: PLASTIC

Lightweight and durable housing material for long-lasting usage.

Dynamic Range: 82 dB

Provides high dynamic range for capturing detailed images in various lighting conditions.

Vertical Pixel: 960

Offers high-resolution vertical image capture for sharp and clear images.

Body Length/Diameter: 10 mm

Compact size for easy integration and space-saving design.

Optical Format (inch): 1/3

Matches industry-standard optical formats for compatibility with other components.

Termination Type: SOLDER

Secure solder termination ensures reliable connectivity for long-term usage.

Output Interface Type: 2-WIRE INTERFACE

Convenient 2-wire interface for easy connection with other devices.

Frame Rate: 60 fps

High frame rate enables smooth and fluid image capture for dynamic scenes.

Array Type: FRAME

Frame array design for efficient image sensing and processing.

Mounting Feature: SURFACE MOUNT

Surface mountable design for easy installation on PCBs.

Technical Specifications

Image Sensors AR0130CSSM00SPCA0-DRBR1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER, IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 2.5 TO 3.1 V

Array Type:

FRAME

Body Width:

10 inch

Body Height:

1.38 mm

Body Length/Diameter:

10 mm

Dynamic Range:

82 dB

Frame Rate:

60 fps

Horizontal Pixel:

1280

Housing:

PLASTIC

Master Clock:

50 MHz

Mounting Feature:

Maximum Operating Current:

65 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

3.75

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Termination Type:

SOLDER

Vertical Pixel:

960

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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