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AR0220AT4B00XUEA2-TPBR-E

Onsemi

AR0220AT4B00XUEA2-TPBR-E by Onsemi

Onsemi's AR0220AT4B00XUEA2-TPBR-E is a 1/1.8" CMOS image sensor with 1828x948 pixels, offering digital output via a 2-wire interface at 60 fps. Ideal for surface mount applications in frame arrays, this sensor measures 9"x12mm and has a height of 1.7mm, making it suitable for compact imaging devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,614 parts In-Stock

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Vyrian

USA . 1,034 parts In-Stock

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Native Components

USA . 35 parts In-Stock

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$0.672

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Northwest PG Solutions

USA . 2,342 parts In-Stock

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$0.739

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TANS Electronics

Latvia . 8,175 parts In-Stock

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Kulean Microsystems

USA . 4,503 parts In-Stock

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Problanco Electronics

Mexico . 2,279 parts In-Stock

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SupplyDigital Components

Austria . 1,836 parts In-Stock

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Corphita

USA . 1,344 parts In-Stock

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Corohmni

South Africa . 257 parts In-Stock

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UHIMA Technologies

Türkiye . 41 parts In-Stock

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Overview

Unlock the power of high-quality imaging with the AR0220AT4B00XUEA2-TPBR-E by Onsemi. As a leading manufacturer in image sensors, Onsemi delivers top-notch products that meet the demands of various applications. This innovative CMOS sensor offers clear digital output and a frame rate of 60 fps, making it ideal for surveillance systems, automotive cameras, and industrial imaging. Experience superior performance and reliability with Onsemi's AR0220AT4B00XUEA2-TPBR-E, providing customers with unmatched value and benefits in every use.

Feature Benefit Bullets

Body Width: 9 inch

Compact size makes it suitable for various applications where space is limited.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

CMOS sensors provide high-quality image capture with low power consumption.

Body Height: 1.7 mm

Low profile design allows for sleek and slim devices.

Package Shape or Style: RECTANGULAR

Rectangular shape provides easy integration into electronic devices.

Horizontal Pixel: 1828

High horizontal pixel count allows for detailed and sharp image capture.

Output Type: DIGITAL OUTPUT

Digital output simplifies data processing and transmission.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Durable terminal finish ensures reliable connectivity.

Vertical Pixel: 948

Good vertical pixel resolution for capturing clear images.

Body Length/Diameter: 12 mm

Balanced length for efficient installation in various devices.

Optical Format (inch): 1/1.8

Optical format suitable for capturing high-quality images.

Termination Type: SOLDER

Solder termination ensures secure connection for reliable performance.

Output Interface Type: 2-WIRE INTERFACE

Efficient output interface for seamless integration into electronic systems.

Frame Rate: 60 fps

High frame rate enables smooth and clear video recording and playback.

Array Type: FRAME

Frame array design for efficient image processing and analysis.

Mounting Feature: SURFACE MOUNT

Surface mount capability for easy and secure installation.

Technical Specifications

Image Sensors AR0220AT4B00XUEA2-TPBR-E attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ROLLING SHUTTER

Array Type:

FRAME

Body Width:

9 inch

Body Height:

1.7 mm

Body Length/Diameter:

12 mm

Frame Rate:

60 fps

Horizontal Pixel:

1828

JESD-609 Code:

e1

Mounting Feature:

Optical Format (inch):

1/1.8

Output Interface Type:

2-WIRE INTERFACE

Output Type:

Package Shape or Style:

Sensors or Transducers Type:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

948

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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