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AR0220AT4R00XUEA1-TPBM

Onsemi

AR0220AT4R00XUEA1-TPBM by Onsemi

Onsemi's AR0220AT4R00XUEA1-TPBM is a CMOS image sensor with 1828x948 resolution, 1/1.8" optical format, and 60 fps frame rate. It features digital output via a 2-wire interface and is ideal for applications requiring high-quality imaging in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

AR0220AT4R00XUEA1-TPBM by Onsemi
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Distributors (In-Stock)

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Vyrian

USA . 7,481 parts In-Stock

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Digiode

USA . 2,195 parts In-Stock

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VNN

France . 25 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Ampacity Inc.

Singapore . 1,441 parts In-Stock

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$9.750

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AZTECH Wire

Italy . 648 parts In-Stock

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$20.040

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Problanco Electronics

Mexico . 6,652 parts In-Stock

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Continental Prestige Electronics

USA . 3,781 parts In-Stock

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SupplyDigital Components

Austria . 2,403 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Corphita

USA . 1,181 parts In-Stock

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Kulean Microsystems

USA . 1,033 parts In-Stock

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UHIMA Technologies

Türkiye . 901 parts In-Stock

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Argo Parts USA

USA . 560 parts In-Stock

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TANS Electronics

Latvia . 168 parts In-Stock

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Corohmni

South Africa . 62 parts In-Stock

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Overview

Capture every moment in stunning clarity with the AR0220AT4R00XUEA1-TPBM Image Sensor by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in all their products. Ideal for a wide range of applications, this CMOS image sensor delivers crisp, high-resolution images with a digital output. Whether you're designing security cameras, industrial equipment, or medical imaging devices, this sensor offers unmatched value, performance, and versatility. Elevate your projects to the next level with the AR0220AT4R00XUEA1-TPBM Image Sensor by Onsemi.

Feature Benefit Bullets

Body Width: 9 inch

The larger body width allows for more space for the sensors, resulting in better image quality and higher resolution.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors offer low power consumption, high-quality image output, and fast data readout, making them ideal for various applications.

Body Height: 1.675 mm

The low body height allows for a slim and compact design, making it suitable for use in small devices or applications with space constraints.

Package Shape or Style: RECTANGULAR

The rectangular package shape provides easy integration into electronic devices and simplifies the manufacturing process.

Horizontal Pixel: 1828

The high horizontal pixel count results in detailed and sharp images with rich color reproduction.

Output Type: DIGITAL OUTPUT

Digital output allows for easy interfacing with other digital devices such as microcontrollers or computers.

Vertical Pixel: 948

The vertical pixel count contributes to the overall image resolution and clarity of the captured images.

Body Length/Diameter: 12 mm

The compact body length/diameter makes the sensor easy to mount and integrate into various devices or systems.

Optical Format (inch): 1/1.8

The optical format of 1/1.8 inch ensures compatibility with a wide range of lenses, allowing for flexibility in image capturing and framing.

Termination Type: SOLDER

Solder termination ensures a secure and reliable connection, making the sensor durable and long-lasting.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface simplifies the communication and data transfer process, enhancing the overall usability of the sensor.

Frame Rate: 60 fps

A high frame rate of 60 fps enables smooth and real-time image capturing, making the sensor suitable for applications requiring fast image processing.

Array Type: FRAME

The frame array type allows for simultaneous capture of multiple frames, improving the efficiency and speed of image acquisition.

Mounting Feature: SURFACE MOUNT

The surface mount feature simplifies the installation and mounting process, making it easy to integrate the sensor into various electronic devices.

Technical Specifications

Image Sensors AR0220AT4R00XUEA1-TPBM attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

AEC-Q100, ROLLING SHUTTER

Array Type:

FRAME

Body Width:

9 inch

Body Height:

1.675 mm

Body Length/Diameter:

12 mm

Frame Rate:

60 fps

Horizontal Pixel:

1828

Mounting Feature:

Optical Format (inch):

1/1.8

Output Interface Type:

2-WIRE INTERFACE

Output Type:

Package Shape or Style:

Sensors or Transducers Type:

Termination Type:

SOLDER

Vertical Pixel:

948

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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