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AR0430CSSC14SMRA0-DP

Onsemi

AR0430CSSC14SMRA0-DP by Onsemi

The Onsemi AR0430CSSC14SMRA0-DP is a 1/3 inch CMOS image sensor with a frame rate of 120 fps. It features a square plastic package, suitable for surface mount applications. With dimensions of 10.16mm x 10.16mm x 1.625mm, it is ideal for compact imaging devices like smartphones and action cameras.

Median Price

$10.518

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Avnet

USA . 2,400 parts In-Stock

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$9.888

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$9.888

Verical

USA . 2,400 parts In-Stock

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$10.518

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Arrow

USA . 2,400 parts In-Stock

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$10.518

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$10.518

Chip1Stop

Japan . 2,400 parts In-Stock

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$12.381

2,400

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Rochester

USA . 838 parts In-Stock

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$16.630

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$14.880

10k+ parts

$14.010

838

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$16.630

$14.880

$14.010

Distributors (In-Stock)

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Digiode

USA . 547 parts In-Stock

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$17.604

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547

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Chip Stock

USA . 2,400 parts In-Stock

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2,400

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Vyrian

USA . 2,051 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 101 parts In-Stock

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$8.620

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101

$8.620

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Corohmni

South Africa . 394 parts In-Stock

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$12.381

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394

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Corphita

USA . 189 parts In-Stock

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$16.677

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Native Components

USA . 517 parts In-Stock

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$55.550

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$53.328

517

$55.550

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$53.328

Northwest PG Solutions

USA . 1,191 parts In-Stock

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$61.105

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$61.105

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SupplyDigital Components

Austria . 7,989 parts In-Stock

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Perfect Parts

USA . 5,376 parts In-Stock

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Kulean Microsystems

USA . 4,959 parts In-Stock

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4,959

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Problanco Electronics

Mexico . 2,901 parts In-Stock

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TANS Electronics

Latvia . 2,747 parts In-Stock

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2,747

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GreenTree Electronics

Israel . 2,400 parts In-Stock

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2,400

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UHIMA Technologies

Türkiye . 189 parts In-Stock

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189

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Overview

Unleash the power of cutting-edge imaging technology with the AR0430CSSC14SMRA0-DP by Onsemi. As a leader in the industry, Onsemi ensures top-notch quality and reliability in every product they create. Image sensors are essential for a wide range of applications, from security cameras to medical devices. With the AR0430CSSC14SMRA0-DP, customers can expect crisp, clear images and seamless performance. Elevate your projects with this superior image sensor and experience the difference in quality and precision.

Feature Benefit Bullets

Body Width: 10.16 inch

The large body width allows for a larger sensor size, providing better image quality and resolution.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

CMOS sensors are known for their low power consumption, making the product energy efficient.

Body Height: 1.625 mm

The low body height allows for the sensor to be compact, making it ideal for small devices or applications with limited space.

Package Shape or Style: SQUARE

The square package shape is easy to handle and mount, providing convenience during installation.

Housing: PLASTIC

Plastic housing reduces the overall weight of the product, making it lightweight and portable.

Body Length/Diameter: 10.16 mm

The square body shape with this length/diameter ratio provides a balanced design for efficient performance.

Optical Format (inch): 1/3

1/3 inch optical format is a common size for image sensors, offering a good balance between image quality and cost.

Termination Type: SOLDER

Solder termination ensures a secure connection, enhancing the durability and reliability of the product.

Frame Rate: 120 fps

With a high frame rate of 120 fps, the sensor can capture fast-moving objects or scenes with smooth motion.

Array Type: FRAME

Frame array type allows for efficient data processing and image capture, improving overall performance.

Mounting Feature: SURFACE MOUNT

Surface mounting feature simplifies installation and maintenance, making it suitable for a variety of applications.

Technical Specifications

Image Sensors AR0430CSSC14SMRA0-DP attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

FRAME

Body Width:

10.16 inch

Body Height:

1.625 mm

Body Length/Diameter:

10.16 mm

Frame Rate:

120 fps

Housing:

PLASTIC

Mounting Feature:

Optical Format (inch):

1/3

Package Shape or Style:

Sensors or Transducers Type:

Termination Type:

SOLDER

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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