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AR0431CSSC14SMRA0-DP

Onsemi

AR0431CSSC14SMRA0-DP by Onsemi

Onsemi's AR0431CSSC14SMRA0-DP is a 10.16mm x 10.16mm CMOS image sensor with 2312x1746 resolution, offering high-quality imaging for applications like surveillance cameras and automotive vision systems at a frame rate of 120 fps.

Median Price

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Lifecycle Status

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In-Stock Inventory

1k+

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VNN

France . 13,563 parts In-Stock

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Vyrian

USA . 6,862 parts In-Stock

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Digiode

USA . 2,284 parts In-Stock

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Nova Conductors

Japan . 200 parts In-Stock

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AZTECH Wire

Italy . 903 parts In-Stock

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$17.420

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903

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Ampacity Inc.

Singapore . 289 parts In-Stock

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$26.750

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Kulean Microsystems

USA . 4,509 parts In-Stock

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SupplyDigital Components

Austria . 4,335 parts In-Stock

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Argo Parts USA

USA . 2,457 parts In-Stock

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Continental Prestige Electronics

USA . 2,172 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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TANS Electronics

Latvia . 1,936 parts In-Stock

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Problanco Electronics

Mexico . 1,400 parts In-Stock

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Corphita

USA . 1,338 parts In-Stock

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UHIMA Technologies

Türkiye . 465 parts In-Stock

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Corohmni

South Africa . 89 parts In-Stock

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Overview

Capture life's moments with crystal clear precision using the AR0431CSSC14SMRA0-DP image sensor by Onsemi. Known for its top-notch quality and reliability, Onsemi has designed this sensor to deliver exceptional performance in various applications. Whether you're capturing breathtaking landscapes or fast-paced action shots, this sensor offers unparalleled value, providing customers with sharp images, vibrant colors, and smooth video footage. Elevate your photography and imaging projects with the AR0431CSSC14SMRA0-DP and experience the difference that superior technology can make.

Feature Benefit Bullets

Body Width: 10.16 inch

The wide body width allows for a larger image sensor which can capture more details in the image.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors are known for their low power consumption and high image quality, making them a great choice for various applications.

Body Height: 1.625 mm

The low body height allows for a compact design which can be easily integrated into different devices.

Package Shape or Style: SQUARE

The square package shape provides a stable and easy mounting option for the sensor.

Horizontal Pixel: 2312

With a high horizontal pixel count, this image sensor can capture high-resolution images with sharp details.

Housing: PLASTIC

Plastic housing is lightweight, cost-effective, and durable, making it a practical choice for various applications.

Vertical Pixel: 1746

The high vertical pixel count allows for capturing detailed images with good clarity and sharpness.

Body Length/Diameter: 10.16 mm

The compact body length/diameter makes it easy to integrate this image sensor into small devices or systems.

Optical Format (inch): 1/3.2

The optical format determines the size of the image sensor and influences its performance in capturing light and producing high-quality images.

Termination Type: SOLDER

Solder termination ensures a secure connection and reliable performance, especially in applications with frequent movement or vibrations.

Frame Rate: 120 fps

A high frame rate of 120 fps allows for capturing fast-moving objects or scenes with smooth, fluid motion.

Array Type: FRAME

A frame array type provides a structured arrangement of pixels for efficient image capturing and processing.

Mounting Feature: SURFACE MOUNT

Surface mount allows for easy and secure installation of the image sensor onto circuit boards or other surfaces, enhancing overall product reliability.

Technical Specifications

Image Sensors AR0431CSSC14SMRA0-DP attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

FRAME

Body Width:

10.16 inch

Body Height:

1.625 mm

Body Length/Diameter:

10.16 mm

Frame Rate:

120 fps

Horizontal Pixel:

2312

Housing:

PLASTIC

Mounting Feature:

Optical Format (inch):

1/3.2

Package Shape or Style:

Sensors or Transducers Type:

Termination Type:

SOLDER

Vertical Pixel:

1746

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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