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AR0431CSSC14SMRA0-DR

Onsemi

AR0431CSSC14SMRA0-DR by Onsemi

Onsemi's AR0431CSSC14SMRA0-DR is a 10.16mm x 10.16mm CMOS image sensor with 2312x1746 resolution, offering high-quality imaging for applications like surveillance cameras and automotive vision systems at 120fps frame rate.

Median Price

$12.290

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5 parts In-Stock

1+ parts

-

100+ parts

$12.290

1k+ parts

$11.000

10k+ parts

$10.350

5

-

$12.290

$11.000

$10.350

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,169 parts In-Stock

1+ parts

$13.015

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2,169

$13.015

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Vyrian

USA . 3,294 parts In-Stock

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3,294

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Flip Electronics

USA . 732 parts In-Stock

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732

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Distributors (Availability)

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AZTECH Wire

Italy . 844 parts In-Stock

1+ parts

$11.390

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844

$11.390

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Corphita

USA . 619 parts In-Stock

1+ parts

$12.330

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619

$12.330

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Corohmni

South Africa . 95 parts In-Stock

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$13.700

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95

$13.700

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Native Components

USA . 555 parts In-Stock

1+ parts

$27.394

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555

$27.394

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Northwest PG Solutions

USA . 1,258 parts In-Stock

1+ parts

$30.133

100+ parts

$27.120

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1,258

$30.133

$27.120

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Kulean Microsystems

USA . 6,839 parts In-Stock

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6,839

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Perfect Parts

USA . 5,365 parts In-Stock

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TANS Electronics

Latvia . 3,973 parts In-Stock

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3,973

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Problanco Electronics

Mexico . 3,580 parts In-Stock

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3,580

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SupplyDigital Components

Austria . 459 parts In-Stock

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459

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UHIMA Technologies

Türkiye . 74 parts In-Stock

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Overview

Capture every moment in stunning detail with the AR0431CSSC14SMRA0-DR image sensor by Onsemi. As a leading manufacturer in the industry, Onsemi delivers unparalleled quality and reliability in their products. This sensor is perfect for a wide range of applications, from automotive cameras to security systems. With its high resolution and fast frame rate, this sensor ensures crisp and clear images every time. Trust Onsemi to provide you with the cutting-edge technology you need to elevate your projects to the next level.

Feature Benefit Bullets

Body Width: 10.16 inch

The large body width allows for a wide coverage area, making it suitable for capturing detailed images.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

CMOS sensors are known for low power consumption and high image quality, making this image sensor a reliable choice for various applications.

Body Height: 1.625 mm

The slim body height enables compact integration into devices without adding bulk.

Package Shape or Style: SQUARE

The square package shape provides easy alignment and mounting, ensuring convenient installation.

Horizontal Pixel: 2312

The high horizontal pixel count results in sharp and detailed images with good resolution.

Housing: PLASTIC

Plastic housing offers a lightweight and durable solution for protecting the image sensor.

Vertical Pixel: 1746

The vertical pixel count enhances the image quality by providing additional detail and clarity.

Body Length/Diameter: 10.16 mm

The compact body length/diameter facilitates easy integration into various devices while maintaining a sleek design.

Optical Format (inch): 1/3.2

The optical format of 1/3.2 ensures compatibility with a wide range of lenses, allowing for versatile imaging options.

Termination Type: SOLDER

The solder termination type offers a secure and reliable connection for seamless operation and longevity.

Frame Rate: 120 fps

The high frame rate of 120 fps enables smooth and fluid video recording, ideal for fast-paced scenes.

Array Type: FRAME

The frame array type provides a structured layout for efficient image capture, ensuring consistent and accurate results.

Mounting Feature: SURFACE MOUNT

The surface mounting feature simplifies the installation process and enhances overall flexibility in device design.

Technical Specifications

Image Sensors AR0431CSSC14SMRA0-DR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

FRAME

Body Width:

10.16 inch

Body Height:

1.625 mm

Body Length/Diameter:

10.16 mm

Frame Rate:

120 fps

Horizontal Pixel:

2312

Housing:

PLASTIC

Mounting Feature:

Optical Format (inch):

1/3.2

Package Shape or Style:

Sensors or Transducers Type:

Termination Type:

SOLDER

Vertical Pixel:

1746

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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