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AR0430CSSC34SMD10

Onsemi

AR0430CSSC34SMD10 by Onsemi

The Onsemi AR0430CSSC34SMD10 is a 1/3-inch CMOS image sensor with a frame rate of 120 fps. It features a surface mounting feature and solder termination type, making it ideal for applications in surveillance cameras, automotive cameras, and drones.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

AR0430CSSC34SMD10 by Onsemi
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Flip Electronics (Authorized)

USA . 5,786 parts In-Stock

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Flip Electronics

USA . 5,786 parts In-Stock

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Vyrian

USA . 2,204 parts In-Stock

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Digiode

USA . 1,152 parts In-Stock

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Native Components

USA . 588 parts In-Stock

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$22.183

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Northwest PG Solutions

USA . 571 parts In-Stock

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$24.402

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$21.962

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Problanco Electronics

Mexico . 7,650 parts In-Stock

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Kulean Microsystems

USA . 6,206 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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SupplyDigital Components

Austria . 4,159 parts In-Stock

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TANS Electronics

Latvia . 2,639 parts In-Stock

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Corphita

USA . 1,886 parts In-Stock

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UHIMA Technologies

Türkiye . 885 parts In-Stock

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Corohmni

South Africa . 387 parts In-Stock

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Overview

Capture breathtaking moments with the AR0430CSSC34SMD10 image sensor by Onsemi. Known for their top-notch quality and reliability, Onsemi delivers cutting-edge technology in the field of image sensors. Perfect for a wide range of applications, this sensor offers clear and detailed images with a high frame rate of 120 fps. Its compact size and surface mounting feature make it easy to integrate into any project. Experience the value and benefits of this exceptional product and elevate your imaging experience today.

Feature Benefit Bullets

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors are known for their low power consumption, making this product energy-efficient and suitable for portable devices.

Optical Format (inch): 1/3

1/3 inch optical format provides a good balance between image quality and sensor size, making this product suitable for a variety of applications.

Termination Type: SOLDER

Solder termination ensures a secure and reliable connection, enhancing the durability and longevity of the product.

Frame Rate: 120 fps

A high frame rate of 120 fps allows for smooth and detailed image capture, making this product ideal for applications that require fast motion tracking or high-speed imaging.

Array Type: FRAME

The frame array type provides a structured layout for the sensors, optimizing the image capture process and improving overall image quality.

Mounting Feature: SURFACE MOUNT

Surface mount installation offers easy and hassle-free integration into electronic devices, making this product user-friendly and suitable for compact designs.

Technical Specifications

Image Sensors AR0430CSSC34SMD10 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

FRAME

Frame Rate:

120 fps

Mounting Feature:

Optical Format (inch):

1/3

Sensors or Transducers Type:

Termination Type:

SOLDER

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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