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AR0430CSSC14SMRA0-DR

Onsemi

AR0430CSSC14SMRA0-DR by Onsemi

The Onsemi AR0430CSSC14SMRA0-DR is a 1/3 inch CMOS image sensor with a frame rate of 120 fps. It features a square plastic housing, suitable for surface mount applications. With dimensions of 10.16mm x 10.16mm x 1.625mm, it offers high-quality imaging capabilities in compact designs.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

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Digiode

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Northwest PG Solutions

USA . 1,438 parts In-Stock

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AZTECH Wire

Italy . 713 parts In-Stock

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Perfect Parts

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Authorized Procurement Solutions

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TANS Electronics

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Kulean Microsystems

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Problanco Electronics

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SupplyDigital Components

Austria . 3,866 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 865 parts In-Stock

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Native Components

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South Africa . 325 parts In-Stock

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Overview

Capture life's precious moments in stunning detail with the AR0430CSSC14SMRA0-DR image sensor by Onsemi. As a trusted manufacturer of high-quality imaging solutions, Onsemi delivers exceptional performance and reliability. Ideal for a wide range of applications, this CMOS image sensor offers unparalleled value with its crisp images, fast frame rate, and easy surface mount installation. Elevate your projects with the AR0430CSSC14SMRA0-DR and experience the difference in quality and precision.

Feature Benefit Bullets

Body Width: 10.16 inch

The large body width allows for a greater surface area, which can lead to better heat dissipation and overall performance.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensors are known for their low power consumption and high image quality, making them a popular choice for various applications.

Body Height: 1.625 mm

The slim body height allows for easy integration into compact devices without adding bulk.

Package Shape or Style: SQUARE

The square shape provides a uniform design that can fit seamlessly into different types of setups.

Housing: PLASTIC

Plastic housing is lightweight and durable, making the sensor easy to handle and resistant to impact.

Body Length/Diameter: 10.16 mm

The compact body length/diameter makes the sensor versatile and suitable for a wide range of applications.

Optical Format (inch): 1/3

The 1/3 inch optical format ensures high-resolution images with excellent clarity and detail.

Termination Type: SOLDER

The solder termination type provides a reliable and secure connection for stable performance.

Frame Rate: 120 fps

With a high frame rate of 120 fps, the sensor can capture fast-moving subjects with smooth and clear motion.

Array Type: FRAME

The frame array type offers consistent and uniform image quality across the entire sensor surface.

Mounting Feature: SURFACE MOUNT

The surface mounting feature makes installation quick and easy, ensuring a hassle-free setup process.

Technical Specifications

Image Sensors AR0430CSSC14SMRA0-DR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

FRAME

Body Width:

10.16 inch

Body Height:

1.625 mm

Body Length/Diameter:

10.16 mm

Frame Rate:

120 fps

Housing:

PLASTIC

Mounting Feature:

Optical Format (inch):

1/3

Package Shape or Style:

Sensors or Transducers Type:

Termination Type:

SOLDER

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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