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AR0521SR2C09SURA0-DP1

Onsemi

AR0521SR2C09SURA0-DP1 by Onsemi

Onsemi's AR0521SR2C09SURA0-DP1 is a 12x12x1.62mm CMOS image sensor with 2592x1944 resolution, 1/2.5" optical format, and 60fps frame rate. It features a square package style, solder termination, and 2-wire interface for surface mount applications in various imaging devices.

Median Price

$18.488

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

AR0521SR2C09SURA0-DP1 by Onsemi
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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

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$18.488

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10

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Vyrian

USA . 7,170 parts In-Stock

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7,170

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Digiode

USA . 2,405 parts In-Stock

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Flip Electronics

USA . 1,600 parts In-Stock

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VNN

France . 200 parts In-Stock

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200

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,477 parts In-Stock

1+ parts

$3.230

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$3.230

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AZTECH Wire

Italy . 291 parts In-Stock

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$13.027

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291

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Continental Prestige Electronics

USA . 5,919 parts In-Stock

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$18.488

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$18.119

5,919

$18.488

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$18.119

Ampacity Inc.

Singapore . 138 parts In-Stock

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$18.750

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138

$18.750

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Semicontronic

India . 798 parts In-Stock

1+ parts

$35.750

100+ parts

$34.856

1k+ parts

$34.678

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798

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Perfect Parts

USA . 11,394 parts In-Stock

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Problanco Electronics

Mexico . 4,455 parts In-Stock

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Kulean Microsystems

USA . 3,138 parts In-Stock

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Argo Parts USA

USA . 2,173 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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GreenTree Electronics

Israel . 1,414 parts In-Stock

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Corphita

USA . 1,257 parts In-Stock

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TANS Electronics

Latvia . 699 parts In-Stock

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699

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Netroflash

USA . 500 parts In-Stock

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$18.119

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$17.564

10k+ parts

$17.194

500

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$18.119

$17.564

$17.194

SupplyDigital Components

Austria . 277 parts In-Stock

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Corohmni

South Africa . 143 parts In-Stock

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UHIMA Technologies

Türkiye . 9 parts In-Stock

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Overview

Upgrade your imaging experience with the AR0521SR2C09SURA0-DP1 image sensor by Onsemi. Known for their high-quality products, Onsemi delivers cutting-edge technology that exceeds industry standards. Ideal for a wide range of applications, this image sensor offers unparalleled performance and reliability. From surveillance systems to automotive cameras, the AR0521SR2C09SURA0-DP1 provides exceptional value, delivering crisp, clear images at an impressive frame rate. Experience the difference with Onsemi's top-of-the-line image sensor today.

Feature Benefit Bullets

Body Width: 12 inch

The wide body makes it easier to handle and install in various devices, providing versatility in application.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

CMOS sensors are known for their low power consumption and high image quality, making them suitable for a wide range of applications.

Body Height: 1.62 mm

The slim body height allows for compact integration in devices without adding bulkiness, ideal for sleek and slim designs.

Package Shape or Style: SQUARE

The square package shape provides ease of mounting and alignment, making it suitable for applications where space is limited.

Horizontal Pixel: 2592

High horizontal pixel count results in detailed and sharp images, essential for applications where image quality is crucial.

Vertical Pixel: 1944

With a high vertical pixel count, this sensor can capture clear and precise images, making it ideal for professional-grade photography and imaging applications.

Body Length/Diameter: 12 mm

The compact body length allows for easy integration in small devices or spaces, ensuring versatility in application.

Optical Format (inch): 1/2.5

The optical format of 1/2.5 inch offers a good balance between image quality and sensor size, making it suitable for a wide range of applications.

Termination Type: SOLDER

Solder termination ensures secure and reliable connection, minimizing the risk of signal loss or interference for stable performance.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface simplifies the connectivity process and allows for easy integration with other devices, making it user-friendly.

Frame Rate: 60 fps

A high frame rate of 60 fps enables smooth and real-time video capture, essential for applications where motion detection or fast-moving subjects are involved.

Array Type: FRAME

The frame array type ensures consistent image quality across the entire sensor area, producing uniform and accurate results in imaging applications.

Mounting Feature: SURFACE MOUNT

The surface mount feature allows for quick and easy installation on circuit boards or devices, making it convenient for manufacturing and assembly processes.

Technical Specifications

Image Sensors AR0521SR2C09SURA0-DP1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

FRAME

Body Width:

12 inch

Body Height:

1.62 mm

Body Length/Diameter:

12 mm

Frame Rate:

60 fps

Horizontal Pixel:

2592

Mounting Feature:

Optical Format (inch):

1/2.5

Output Interface Type:

2-WIRE INTERFACE

Package Shape or Style:

Sensors or Transducers Type:

Termination Type:

SOLDER

Vertical Pixel:

1944

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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