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AR0543CSSC25SUD20

Onsemi

AR0543CSSC25SUD20 by Onsemi

The Onsemi AR0543CSSC25SUD20 image sensor features 2592x1944 pixels, 1.40um pixel size, and a 27 MHz master clock. Ideal for digital cameras, surveillance systems, and automotive applications due to its high sensitivity of 0.82 V/lx.s and compact rectangular package design.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,677 parts In-Stock

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Digiode

USA . 1,833 parts In-Stock

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Native Components

USA . 80 parts In-Stock

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$0.159

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$0.152

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$0.152

Northwest PG Solutions

USA . 1,009 parts In-Stock

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$0.175

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$0.154

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AZTECH Wire

Italy . 744 parts In-Stock

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$17.270

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Kulean Microsystems

USA . 6,251 parts In-Stock

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Problanco Electronics

Mexico . 5,978 parts In-Stock

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SupplyDigital Components

Austria . 3,635 parts In-Stock

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TANS Electronics

Latvia . 3,484 parts In-Stock

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Corphita

USA . 779 parts In-Stock

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UHIMA Technologies

Türkiye . 370 parts In-Stock

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Corohmni

South Africa . 366 parts In-Stock

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Overview

Elevate your imaging projects to the next level with the AR0543CSSC25SUD20 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality image sensors that offer unparalleled performance and reliability. Ideal for a wide range of applications, this sensor provides crystal-clear images and precise data. With advanced features and cutting-edge technology, the AR0543CSSC25SUD20 ensures optimal results every time. Experience the value and benefits of this exceptional product and elevate your projects to new heights.

Feature Benefit Bullets

Pixel Size (um) 1.40X1.40

Small pixel size allows for high resolution images with fine details.

Maximum Supply Voltage 1.25 V

Low maximum supply voltage helps in saving energy and reduces power consumption.

Master Clock 27 MHz

High master clock frequency enables fast data processing and improved performance.

Body Width 5.065 inch

Compact body width makes the sensor suitable for space-constrained applications.

Sensors or Transducers Type IMAGE SENSOR,CMOS

CMOS sensor technology provides high-quality image capture and low power consumption.

Package Shape or Style RECTANGULAR

Rectangular package shape allows for easy integration and mounting in various devices.

Minimum Supply Voltage 1.15 V

Low minimum supply voltage ensures stable operation and reduces the risk of damage due to overvoltage.

Maximum Operating Temperature 70 °C

High maximum operating temperature range allows for reliable performance in various environmental conditions.

Horizontal Pixel 2592

High horizontal pixel count enables the sensor to capture detailed and high-resolution images.

Output Type DIGITAL VOLTAGE

Digital voltage output simplifies data processing and transmission.

Minimum Operating Temperature -30 °C

Low minimum operating temperature range ensures the sensor can function in cold environments without issues.

Maximum Operating Current 44 mA

Low maximum operating current helps in reducing power consumption and prolonging battery life.

Dynamic Range 66 dB

High dynamic range allows the sensor to capture a wide range of light intensities for better image quality.

Vertical Pixel 1944

High vertical pixel count contributes to the sensor's ability to capture detailed images.

Body Length/Diameter 5.256 mm

Compact body length/diameter makes the sensor suitable for small and slim devices.

Optical Format (inch) 1/4

Common optical format allows for easy compatibility with various lenses and optical systems.

Data Rate 840 Mbps

High data rate enables fast transfer of image data for real-time processing and output.

Termination Type SOLDER

Solder termination type ensures secure and reliable connections for long-lasting performance.

Output Interface Type 2-WIRE INTERFACE

2-wire interface simplifies the connection of the sensor to external devices for easy data transfer.

Frame Rate 15 fps

Decent frame rate allows for smooth video recording and playback.

Array Type FRAME

Frame array type provides consistent and uniform image capture across the entire sensor surface.

Sensitivity (V/lx.s) 0.82 V/lx.s

High sensitivity allows the sensor to capture clear and sharp images even in low-light conditions.

Mounting Feature SURFACE MOUNT

Surface mounting feature makes it easy to install the sensor on circuit boards and other surfaces.

Technical Specifications

Image Sensors AR0543CSSC25SUD20 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER

Array Type:

FRAME

Body Width:

5.065 inch

Body Height:

.7 mm

Body Length/Diameter:

5.256 mm

Data Rate:

840 Mbps

Dynamic Range:

66 dB

Frame Rate:

15 fps

Horizontal Pixel:

2592

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

44 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/4

Output Interface Type:

2-WIRE INTERFACE

Output Type:

Package Shape or Style:

Pixel Size (um):

1.40X1.40

Sensitivity (V/lx.s):

.82 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

1.25 V

Minimum Supply Voltage:

1.15 V

Termination Type:

SOLDER

Vertical Pixel:

1944

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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