Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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KAI-11002-CBA-CD-AE by Onsemi is an image sensor with 9x9 um pixel size, 4008 horizontal pixels, and 2672 vertical pixels. It operates b/w -50 to 70 °C and has a dynamic range of 66 dB. Ideal for digital imaging applications requiring high-resolution and low-light performance.
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With a small pixel size of 9X9 um, this image sensor can capture detailed images with high resolution, making it a great choice for applications requiring sharp and clear images.
The high maximum supply voltage of 15.5 V allows for efficient power usage and can handle voltage fluctuations, ensuring reliable performance in various operating conditions.
The compact body width of 32.64 inch makes this image sensor easy to integrate into different devices or systems without taking up much space, providing flexibility in design.
Being a CCD type image sensor, it offers high-quality image capture with low noise levels, making it suitable for applications where image quality is crucial.
The low body height of 5.97 mm contributes to a sleek and slim design, making it suitable for applications where space is limited or where a compact form factor is desired.
The rectangular package shape or style provides ease of mounting and integration into different devices or systems, ensuring compatibility and ease of use.
The low minimum supply voltage of 14.5 V ensures efficient power usage and can help extend the battery life of devices using this image sensor.
With a high maximum operating temperature of 70 °C, this image sensor can withstand elevated temperatures, making it suitable for use in various environmental conditions.
The high horizontal pixel count of 4008 allows for detailed and wide-angle image capture, making it ideal for applications that require high-resolution images with a broad field of view.
The digital voltage output type simplifies data processing and transmission, making it easier to integrate this image sensor into digital systems for seamless operation.
With a low minimum operating temperature of -50 °C, this image sensor can function reliably in cold environments, expanding its usability in a wide range of applications.
The ceramic housing provides durability and protection to the image sensor, ensuring long-term performance and reliability in challenging operating conditions.
The high dynamic range of 66 dB allows the image sensor to capture a wide range of light intensities accurately, making it suitable for applications with varying light conditions.
With a vertical pixel count of 2672, this image sensor can capture detailed images in a vertical orientation, providing versatility in image capture for different applications.
The moderate body length/diameter of 44.45 mm offers a balance between compactness and functionality, making this image sensor suitable for a wide range of applications.
The high data rate of 28 Mbps enables fast and efficient data transfer, ensuring real-time image processing and transmission, making it suitable for applications requiring rapid data transfer.
The solder termination type simplifies the installation and connection of the image sensor, ensuring a secure and reliable connection for consistent performance.
The interline array type offers fast readout speeds and reduced image lag, making it suitable for applications requiring high-speed image capture and processing.
The through-hole mounting feature provides a secure and stable installation for the image sensor, ensuring precise alignment and operation in various devices or systems.
Image Sensors KAI-11002-CBA-CD-AE attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Height:
Body Length/Diameter:
Data Rate:
Dynamic Range:
Horizontal Pixel:
Housing:
Mounting Feature:
Maximum Operating Temperature:
Minimum Operating Temperature:
Output Type:
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Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
NE555D
Philips Semiconductors
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
BSS138
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Feedback Capacitance (Crss): 10 pF; JEDEC-95 Code: TO-236AB;
2N2222A
Nte Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Terminal Form: WIRE;
0460-202-16141
TE Connectivity
TE Connectivity's 0460-202-16141 contact features a crimp terminal type, machined contact design, and rated AC voltage of 1500V. With a wire gauge range of 20-16 AWG, it is ideal for applications requiring a male round pin-socket contact style in assembly products.
Ksl Microdevices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
General Diode
2N7002
STMicroelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .2 A; Transistor Application: SWITCHING;
SMBJ18CA
Secos
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SZNUP2105LT1G
Onsemi
SZNUP2105LT1G by Onsemi is a Transient Suppression Device with 2 elements in a common anode configuration. It has a max non-repetitive peak reverse power dissipation of 350W and breakdown voltage of 29.1V. Ideal for applications requiring bidirectional polarity protection, such as automotive electronics and industrial equipment due to its AEC-Q101 compliance and high clamping voltage of 44V.
Vishay Intertechnology
Vishay Intertechnology's SMBJ18CA is a bidirectional TRANS VOLTAGE SUPPRESSOR DIODE with a max clamping voltage of 29.2 V and a breakdown voltage of 21.05 V. It is surface mountable and commonly used in transient suppression applications.
SS14
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Synsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Lite-on Semiconductor
NDT2955
NDT2955 by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 15A and EAS of 174mJ, suitable for ENHANCEMENT MODE operation. With a compact SMALL OUTLINE package and -55 to 150 °C operating range, it offers efficient power dissipation up to 3W.
NUP2105LT1G
NUP2105LT1G by Onsemi is a Transient Suppression Device with 350W power dissipation, 29.1V breakdown voltage, and 44V clamping voltage. Commonly used in electronic circuits for surge protection due to its bidirectional polarity and silicon diode element material.
Sun Wai Electronic
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Reverse Recovery Time: .004 us; Maximum Repetitive Peak Reverse Voltage: 100 V;
BSS84-7-F
Diodes Incorporated
Diodes Inc. BSS84-7-F is a P-channel FET with 50V DS breakdown voltage, 0.13A max drain current, and 10 ohm RDS(on). Ideal for switching applications, it features a single configuration with built-in diode in a small outline package. Operating in enhancement mode at up to 150°C, it has Gull Wing terminals and matte tin finish.
KSZ9031RNXIA
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
STM32F405RGT6
STM32F405RGT6 by STMicroelectronics is a 32-bit microcontroller with 2/3.3V power supplies, 16 external interrupts, and 196608 RAM bytes. Ideal for industrial applications, it features CAN(2), I2C(3), SPI(3) connectivity options and operates at a max clock frequency of 26 MHz. With low power mode and DMA support, it offers versatile performance in compact dimensions.
TSL1401CL
Ams Ag
TSL1401CL by Ams Ag is a linear image sensor with 128 horizontal pixels, offering a spectral response of 300-1100nm. It operates b/w 0-70°C, with an output range of 1.60-2.40V and a dynamic range of 72dB. Ideal for applications requiring precise imaging in various environments due to its compact size and surface mounting feature.
KAI-16050-CXA-JD-B1
The Onsemi KAI-16050-CXA-JD-B1 is a 5.5x5.5 um CCD image sensor with 4896 (H) x 3264 (V) pixels, offering a dynamic range of 64 dB. It operates at temperatures ranging from -50 to 70 °C and requires a power supply of 15V. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
KAF-09000-ABA-DP-AE
Onsemi's KAF-09000-ABA-DP-AE is a 3056x3056 full-frame CCD image sensor with 12x12 um pixel size. It operates b/w -60 to 60 °C and offers a dynamic range of 84 dB. Ideal for high-resolution imaging applications requiring precise color reproduction and low light sensitivity.
NOIP1SN0500A-QTI
NOIP1SN0500A-QTI by Onsemi is an Image Sensor with 4.80X4.80 um pixel size, 72 MHz master clock, and 800x600 resolution. Ideal for digital imaging applications requiring high frame rates up to 545 fps in a compact SQUARE package suitable for SURFACE mounting.
AR0234CSSM00SUKA0-CP
Onsemi's AR0234CSSM00SUKA0-CP is a CMOS image sensor with 1920x1200 resolution, 3x3 um pixel size, and 71.4 dB dynamic range. It operates at -40 to 85 °C, outputs digital voltage from 0.4-1.26V, and has a frame rate of 120 fps. Ideal for applications requiring high-resolution imaging in automotive or surveillance systems.
11KAI-04070-FBA-JD-AE
The Onsemi 11KAI-04070-FBA-JD-AE is an image sensor with 2048x2048 pixels, 7.4um pixel size, and 70.5dB dynamic range. It operates b/w -50 to 70 °C and has a max supply voltage of 15.5V. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
KAI-0340-CBA-CB-AE
KAI-0340-CBA-CB-AE by Onsemi is a 640x480 CCD image sensor with 7.4um pixel size and 62dB dynamic range. It operates b/w -50 to 70 °C, with supply voltage ranging from 14.75V to 15.25V. Ideal for applications requiring high-quality analog voltage output in a compact rectangular package.
AR0234CSSC00SUKA0-CP
The Onsemi AR0234CSSC00SUKA0-CP image sensor features 1920x1200 resolution, 3x3 um pixel size, and a 54 MHz master clock. Ideal for applications requiring high-quality digital imaging with a frame rate of up to 120 fps.
AR0234CSSC00SUKA0-CR
Onsemi's AR0234CSSC00SUKA0-CR image sensor features 1920x1200 resolution, 3x3 um pixel size, and 54 MHz master clock. Ideal for high-speed imaging applications with a frame rate of 120 fps, this CMOS sensor offers a dynamic range of 71.4 dB and operates b/w -40 to 85 °C.
AR0330CM1C12SHKA0-CP
The Onsemi AR0330CM1C12SHKA0-CP is a 1/3-inch CMOS image sensor with 2304 (H) x 1296 (V) pixels. It operates at a max supply voltage of 1.9V and has a master clock of 27 MHz, offering a dynamic range of 69.5 dB. Ideal for applications requiring high-resolution imaging at up to 60 fps, such as surveillance cameras and industrial machine vision systems.
OVM7695-RYEA
Omnivision Technologies
IMAGE SENSOR,CMOS;
KAI-0330-AAA-CP-BA-DUALOUTPUT
KAI-0330-AAA-CP-BA-DUALOUTPUT by Onsemi is an image sensor with 9x9 um pixel size, 648 horizontal pixels, and 484 vertical pixels. It operates at a max supply voltage of 15.5V and min supply voltage of 12V. Ideal for applications requiring high-quality imaging in a compact form factor.
KAI-08050-CBA-JB-AE
KAI-08050-CBA-JB-AE by Onsemi is a 5.5x5.5 um CCD image sensor with 3296 (H) x 2472 (V) pixels, offering a dynamic range of 64 dB. Its rectangular package style and solder termination make it suitable for industrial machine vision applications requiring high-resolution imaging in a 4/3 optical format.
KAE-04472-FBA-SD-FA
KAE-04472-FBA-SD-FA by Onsemi is an image sensor with 7.4x7.4 um pixel size, 2096 horizontal and vertical pixels, and a dynamic range of 92 dB. It operates b/w -50 to 60 °C, outputs current, and has a data rate of 40 Mbps. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
AR0135CS2M00SUEA0-DPBR2
Onsemi's AR0135CS2M00SUEA0-DPBR2 is a 1/3 inch CMOS image sensor with a 9mm square package. It features solder termination, frame array type, and surface mounting feature. Ideal for applications requiring high-quality imaging in compact spaces like mobile devices and security cameras.
AR0233ATSC17XUEA1-DPBR-E
Onsemi's AR0233ATSC17XUEA1-DPBR-E is a CMOS image sensor with 2048x1280 resolution, 140 dB dynamic range, and 1/2.5-inch optical format. It operates at 45 fps and is suitable for applications requiring high-quality imaging such as surveillance cameras or industrial machine vision systems.
NOIP3FN1300A-QDI
NOIP3FN1300A-QDI by Onsemi is an Image Sensor with 4.80X4.80 um pixel size, 1.9V max supply voltage, and 72 MHz master clock. Ideal for applications requiring high-speed digital imaging with a resolution of 1280x1024 pixels at a frame rate of 210 fps.
NOIV2SN1300A-QDC
NOIV2SN1300A-QDC by Onsemi features 4.80X4.80 um pixel size, 62 MHz master clock, and 1280x1024 resolution. Ideal for image sensing applications due to its CMOS sensor type and 1/2 inch optical format, with a frame rate of 37 fps.
MT9P401I12STC-DP1
The Onsemi MT9P401I12STC-DP1 is a CMOS image sensor with 2.2x2.2 um pixel size, offering 2592x1944 resolution and 70.1 dB dynamic range. It operates at 48 MHz master clock, suitable for applications requiring high-quality digital imaging in a compact form factor.
TC240-80
Texas Instruments
TC240-80 by Texas Instruments is an image sensor with 754x244 pixels, pixel size of 11.5X27 um, and operates at temperatures from -10 to 45 °C. It requires a 12V power supply and features THROUGH HOLE MOUNTing. Ideal for applications requiring high-resolution imaging in various environments.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
KAI-16000-AAA-JD-B1
Kodak Image Sensor Solutions
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Additional Features: SENSITIVITY IS 30 UV/ELECTRON; Minimum Supply Voltage: 14.5 V;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Dynamic Range: 65 dB; Termination Type: SOLDER;
Truesense Imaging
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Data Rate: 30 Mbps; Array Type: INTERLINE;
KAI-16000-AAA-JR-B1
KAI-16000-AAA-JR-B1 by Onsemi is an image sensor with 7.4x7.4 um pixel size, 4872 horizontal pixels, and 3248 vertical pixels. It has a dynamic range of 65 dB and outputs analog voltage. Ideal for applications requiring high-resolution imaging with precise color reproduction.
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Minimum Supply Voltage: 14.5 V; Termination Type: SOLDER;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Body Height: 4.88 mm; Body Length/Diameter: 44.45 mm;
KAI-16000-AAA-JD-B2
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Dynamic Range: 65 dB; Maximum Supply Voltage: 15.5 V;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Body Width: 45.34 inch; Additional Features: SENSITIVITY IS 30 UV/ELECTRON;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Additional Features: SENSITIVITY IS 30 UV/ELECTRON; Body Height: 4.88 mm;
KAI-1003-AAA-CR-B2
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Array Type: INTERLINE; Horizontal Pixel: 1024; Minimum Operating Temperature: 0 Cel;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Housing: CERAMIC; Maximum Supply Voltage: 15.5 V; Pixel Size (um): 12.8X12.8;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Horizontal Pixel: 1024; Maximum Supply Voltage: 15.5 V; Housing: CERAMIC;
KAI-1010-ABA-CD-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 15 V; Pixel Size (um): 9X9;
KAI-1003-ABA-CR-B2
Image Sensors;
KAI-1010-ABA-CR-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Dynamic Range: 60 dB; Horizontal Pixel: 1008;
KAI-1010-ABA-CR-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Additional Features: SENSITIVITY IS 12 MICRO V/ELECTRON; Vertical Pixel: 1018;
KAI-1003M
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1.30V; Spectral Response (nm): 400-700;
KAI-1010M
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Vertical Pixel: 1018; Maximum Supply Voltage: 15 V; Minimum Operating Temperature: -50 Cel;
KAI-1010
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Pixel Size (um): 9X9; Horizontal Pixel: 1008; Maximum Supply Voltage: 15 V;
KAI-1020
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Master Clock: 40 MHz; Array Type: INTERLINE;
Supply Digital Components
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