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KAI-11002-CBA-CD-AE

Onsemi

KAI-11002-CBA-CD-AE by Onsemi

KAI-11002-CBA-CD-AE by Onsemi is an image sensor with 9x9 um pixel size, 4008 horizontal pixels, and 2672 vertical pixels. It operates b/w -50 to 70 °C and has a dynamic range of 66 dB. Ideal for digital imaging applications requiring high-resolution and low-light performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

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1k+

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Austria . 7,422 parts In-Stock

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TANS Electronics

Latvia . 4,035 parts In-Stock

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Problanco Electronics

Mexico . 2,191 parts In-Stock

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Kulean Microsystems

USA . 1,419 parts In-Stock

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Corphita

USA . 571 parts In-Stock

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UHIMA Technologies

Türkiye . 308 parts In-Stock

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Corohmni

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Overview

Experience crystal clear imaging like never before with the KAI-11002-CBA-CD-AE by Onsemi. As a leading manufacturer in image sensors, Onsemi ensures top-notch quality and reliability in all their products. This CCD image sensor boasts a wide range of applications, from industrial inspection to medical imaging. With a high dynamic range and fast data rate, this sensor provides unparalleled value and performance for your imaging needs. Upgrade your technology today with the KAI-11002-CBA-CD-AE and see the world in a whole new light.

Feature Benefit Bullets

Pixel Size (um): 9X9

With a small pixel size of 9X9 um, this image sensor can capture detailed images with high resolution, making it a great choice for applications requiring sharp and clear images.

Maximum Supply Voltage: 15.5 V

The high maximum supply voltage of 15.5 V allows for efficient power usage and can handle voltage fluctuations, ensuring reliable performance in various operating conditions.

Body Width: 32.64 inch

The compact body width of 32.64 inch makes this image sensor easy to integrate into different devices or systems without taking up much space, providing flexibility in design.

Sensors or Transducers Type: IMAGE SENSOR,CCD

Being a CCD type image sensor, it offers high-quality image capture with low noise levels, making it suitable for applications where image quality is crucial.

Body Height: 5.97 mm

The low body height of 5.97 mm contributes to a sleek and slim design, making it suitable for applications where space is limited or where a compact form factor is desired.

Package Shape or Style: RECTANGULAR

The rectangular package shape or style provides ease of mounting and integration into different devices or systems, ensuring compatibility and ease of use.

Minimum Supply Voltage: 14.5 V

The low minimum supply voltage of 14.5 V ensures efficient power usage and can help extend the battery life of devices using this image sensor.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70 °C, this image sensor can withstand elevated temperatures, making it suitable for use in various environmental conditions.

Horizontal Pixel: 4008

The high horizontal pixel count of 4008 allows for detailed and wide-angle image capture, making it ideal for applications that require high-resolution images with a broad field of view.

Output Type: DIGITAL VOLTAGE

The digital voltage output type simplifies data processing and transmission, making it easier to integrate this image sensor into digital systems for seamless operation.

Minimum Operating Temperature: -50 °C

With a low minimum operating temperature of -50 °C, this image sensor can function reliably in cold environments, expanding its usability in a wide range of applications.

Housing: CERAMIC

The ceramic housing provides durability and protection to the image sensor, ensuring long-term performance and reliability in challenging operating conditions.

Dynamic Range: 66 dB

The high dynamic range of 66 dB allows the image sensor to capture a wide range of light intensities accurately, making it suitable for applications with varying light conditions.

Vertical Pixel: 2672

With a vertical pixel count of 2672, this image sensor can capture detailed images in a vertical orientation, providing versatility in image capture for different applications.

Body Length/Diameter: 44.45 mm

The moderate body length/diameter of 44.45 mm offers a balance between compactness and functionality, making this image sensor suitable for a wide range of applications.

Data Rate: 28 Mbps

The high data rate of 28 Mbps enables fast and efficient data transfer, ensuring real-time image processing and transmission, making it suitable for applications requiring rapid data transfer.

Termination Type: SOLDER

The solder termination type simplifies the installation and connection of the image sensor, ensuring a secure and reliable connection for consistent performance.

Array Type: INTERLINE

The interline array type offers fast readout speeds and reduced image lag, making it suitable for applications requiring high-speed image capture and processing.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature provides a secure and stable installation for the image sensor, ensuring precise alignment and operation in various devices or systems.

Technical Specifications

Image Sensors KAI-11002-CBA-CD-AE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 13 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

32.64 inch

Body Height:

5.97 mm

Body Length/Diameter:

44.45 mm

Data Rate:

28 Mbps

Dynamic Range:

66 dB

Horizontal Pixel:

4008

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Output Type:

Package Shape or Style:

Pixel Size (um):

9X9

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

2672

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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