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KAI-1020

Onsemi

KAI-1020 by Onsemi

KAI-1020 by Onsemi is an image sensor with 7.4x7.4 um pixel size, 40 MHz master clock, and 1000x1000 resolution. It is used in applications requiring high-quality digital imaging with a dynamic range of 60 dB, such as industrial machine vision systems and scientific cameras.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,615 parts In-Stock

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Vyrian

USA . 1,249 parts In-Stock

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1,249

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SupplyDigital Components

Austria . 6,330 parts In-Stock

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Problanco Electronics

Mexico . 5,610 parts In-Stock

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TANS Electronics

Latvia . 3,136 parts In-Stock

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Kulean Microsystems

USA . 2,085 parts In-Stock

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UHIMA Technologies

Türkiye . 465 parts In-Stock

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465

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Corphita

USA . 387 parts In-Stock

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387

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Corohmni

South Africa . 212 parts In-Stock

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Overview

Experience crystal-clear imaging like never before with the Onsemi KAI-1020 image sensor. Known for their cutting-edge technology and superior quality, Onsemi delivers top-of-the-line sensors that excel in various applications. From industrial to medical imaging, this sensor offers unmatched precision and reliability. With a wide range of operating temperatures and exceptional dynamic range, the KAI-1020 ensures optimal performance in any environment. Elevate your imaging experience with Onsemi's KAI-1020 - where innovation meets excellence.

Feature Benefit Bullets

Pixel Size (um): 7.4X7.4

The small pixel size allows for high resolution images to be captured, making this sensor ideal for applications requiring detailed imaging.

Master Clock: 40 MHz

The high master clock frequency enables fast data readout and processing, resulting in efficient performance of the sensor.

Body Width: 27.94 inch

The compact body width of the sensor makes it suitable for integration into various systems and applications with limited space.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors are known for their high image quality and sensitivity, making this sensor a good choice for demanding imaging tasks.

Body Height: 3.429 mm

The low body height allows for easy integration and compatibility with different setups and configurations.

Package Shape or Style: SQUARE

The square package shape provides a uniform and symmetrical design, enhancing the ease of mounting and alignment in systems.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range ensures reliable performance in various environmental conditions.

Horizontal Pixel: 1000

The high number of horizontal pixels results in high-resolution images with detailed information and clarity.

Output Type: DIGITAL VOLTAGE

The digital voltage output simplifies the data transfer process and allows for easy integration with digital processing systems.

Minimum Operating Temperature: -50 °C

The low minimum operating temperature range indicates the sensor's ability to operate in extreme cold environments without any performance issues.

Dynamic Range: 60 dB

The wide dynamic range ensures that the sensor can capture both bright and dark areas in the image accurately, resulting in high-quality imaging.

Vertical Pixel: 1000

The high number of vertical pixels complements the horizontal resolution, resulting in sharp and detailed images in both dimensions.

Body Length/Diameter: 27.94 mm

The compact body length/diameter allows for a streamlined design and efficient integration of the sensor into different systems.

Termination Type: SOLDER

The solder termination type ensures a secure and reliable connection, enhancing the overall durability and longevity of the sensor.

Frame Rate: 49 fps

The high frame rate enables the sensor to capture fast-moving objects or scenes with smooth and clear motion, making it suitable for dynamic imaging applications.

Array Type: INTERLINE

The interline array type offers efficient image capture and readout, reducing potential image distortion or artifacts in demanding imaging scenarios.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature provides a sturdy and reliable mounting option, ensuring the sensor stays securely in place during operation.

Technical Specifications

Image Sensors KAI-1020 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTORNIC SHUTTER

Array Type:

INTERLINE

Body Width:

27.94 inch

Body Height:

3.429 mm

Body Length/Diameter:

27.94 mm

Dynamic Range:

60 dB

Frame Rate:

49 fps

Horizontal Pixel:

1000

Master Clock:

40 MHz

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Output Type:

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Termination Type:

SOLDER

Vertical Pixel:

1000

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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