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KAI-29050-FXA-JD-B2

Onsemi

KAI-29050-FXA-JD-B2 by Onsemi

The Onsemi KAI-29050-FXA-JD-B2 is an image sensor with 5.5x5.5 um pixel size, 15.5 V max supply voltage, and 6644 horizontal pixels. Ideal for applications requiring high-resolution imaging in a compact form factor, such as industrial machine vision systems or medical imaging devices.

Median Price

$4,031.178

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 18 parts In-Stock

1+ parts

$3,583.270

100+ parts

$3,368.270

1k+ parts

$3,153.280

10k+ parts

-

18

$3,583.270

$3,368.270

$3,153.280

-

Verical

USA . 18 parts In-Stock

1+ parts

$4,479.087

100+ parts

$4,210.337

1k+ parts

$3,941.600

10k+ parts

-

18

$4,479.087

$4,210.337

$3,941.600

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,252 parts In-Stock

1+ parts

$3,962.450

100+ parts

-

1k+ parts

-

10k+ parts

-

1,252

$3,962.450

-

-

-

Vyrian

USA . 6,249 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,249

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,012 parts In-Stock

1+ parts

$9.040

100+ parts

-

1k+ parts

-

10k+ parts

-

1,012

$9.040

-

-

-

Continental Prestige Electronics

USA . 20 parts In-Stock

1+ parts

$3,541.000

100+ parts

-

1k+ parts

-

10k+ parts

-

20

$3,541.000

-

-

-

Corphita

USA . 1,553 parts In-Stock

1+ parts

$3,753.900

100+ parts

-

1k+ parts

-

10k+ parts

-

1,553

$3,753.900

-

-

-

Corohmni

South Africa . 320 parts In-Stock

1+ parts

$4,171.000

100+ parts

-

1k+ parts

-

10k+ parts

-

320

$4,171.000

-

-

-

TANS Electronics

Latvia . 7,350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,350

-

-

-

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SupplyDigital Components

Austria . 5,520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,520

-

-

-

-

Problanco Electronics

Mexico . 3,138 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,138

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-

-

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Kulean Microsystems

USA . 412 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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412

-

-

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UHIMA Technologies

Türkiye . 292 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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292

-

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-

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Overview

Dive into a world of crystal-clear images and superior performance with the KAI-29050-FXA-JD-B2 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality image sensors that set the standard for excellence. With a wide range of applications in various industries, this cutting-edge product offers unmatched value and benefits to customers. Elevate your imaging experience and discover the advantages of choosing Onsemi for all your image sensor needs.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

Smaller pixel size allows for higher resolution images to be captured with great detail.

Maximum Supply Voltage: 15.5 V

High maximum supply voltage provides flexibility in power supply options.

Body Width: 45.34 inch

Compact body width makes it suitable for integration into various devices and systems.

Power Supplies (V): 15

Standard power supply voltage requirement for ease of integration.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors ensure high-quality image capture with low noise.

Body Height: 3.61 mm

Low profile design allows for easy integration into slim devices and systems.

Package Shape or Style: RECTANGULAR

Rectangular shape provides versatility in mounting options.

Minimum Supply Voltage: 14.5 V

Low minimum supply voltage helps in reducing power consumption.

Maximum Operating Temperature: 70 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Horizontal Pixel: 6644

High horizontal pixel count enables capturing wide images with fine details.

Minimum Operating Temperature: -50 °C

Low minimum operating temperature allows for use in extreme cold conditions.

Maximum Operating Current: 11 mA

Low operating current helps in reducing power consumption and heat generation.

Dynamic Range: 64 dB

Wide dynamic range ensures accurate representation of both bright and dark areas in images.

Vertical Pixel: 4452

High vertical pixel count enables capturing detailed images in portrait orientation.

Body Length/Diameter: 47.24 mm

Compact body length allows for easy integration into space-constrained devices.

Optical Format (inch): 11/8

Standard optical format for compatibility with various lenses and optical systems.

Data Rate: 40 Mbps

High data rate enables fast transfer of high-resolution images for real-time applications.

Termination Type: SOLDER

Solder termination ensures reliable electrical connections for stable performance.

Frame Rate: 4 fps

Decent frame rate for capturing video footage with smooth motion.

Array Type: INTERLINE

Interline array design minimizes blooming and smearing effects for high-quality images.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting makes it easy to securely attach the sensor to a circuit board or device.

Technical Specifications

Image Sensors KAI-29050-FXA-JD-B2 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 34 MICRO VOLT PER ELECTRON

Array Type:

INTERLINE

Body Width:

45.34 inch

Body Height:

3.61 mm

Body Length/Diameter:

47.24 mm

Data Rate:

40 Mbps

Dynamic Range:

64 dB

Frame Rate:

4 fps

Horizontal Pixel:

6644

Mounting Feature:

Maximum Operating Current:

11 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

11/8

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Power Supplies (V):

15

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

4452

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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