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KAI-2020

Onsemi

KAI-2020 by Onsemi

KAI-2020 by Onsemi is an image sensor with 7.4x7.4 um pixel size, 40 MHz master clock, and 1600 horizontal pixels. Ideal for applications requiring high-quality imaging such as industrial machine vision systems or medical imaging equipment due to its 68 dB dynamic range and 35 fps frame rate.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,667 parts In-Stock

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Digiode

USA . 932 parts In-Stock

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932

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Kulean Microsystems

USA . 7,791 parts In-Stock

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TANS Electronics

Latvia . 5,124 parts In-Stock

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SupplyDigital Components

Austria . 3,747 parts In-Stock

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Problanco Electronics

Mexico . 3,096 parts In-Stock

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Corphita

USA . 1,141 parts In-Stock

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UHIMA Technologies

Türkiye . 853 parts In-Stock

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Corohmni

South Africa . 172 parts In-Stock

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Overview

Experience the next level of imaging technology with the KAI-2020 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers superior quality and innovation in image sensors. The KAI-2020 offers unparalleled performance and reliability, making it ideal for a wide range of applications. From medical imaging to industrial automation, this cutting-edge sensor provides crystal-clear images with exceptional detail and accuracy. Elevate your projects with the KAI-2020 and unlock endless possibilities in imaging solutions.

Feature Benefit Bullets

Pixel Size (um): 7.4X7.4

The small pixel size allows for higher resolution images with more detail.

Maximum Supply Voltage: 15.5 V

Higher supply voltage allows for better performance and signal processing capabilities.

Master Clock: 40 MHz

High master clock frequency enables faster data readout and processing.

Body Width: 20.7 inch

Compact body width makes it easy to integrate into various devices.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD image sensors are known for their high-quality imaging and low noise performance.

Body Height: 3.17 mm

Low body height allows for slim designs and easy integration into thin devices.

Package Shape or Style: RECTANGULAR

Rectangular shape provides efficient use of space and easy mounting options.

Minimum Supply Voltage: 14.5 V

Low minimum supply voltage ensures energy efficiency and extends battery life.

Maximum Operating Temperature: 70 °C

Wide operating temperature range allows for use in various environmental conditions.

Horizontal Pixel: 1600

High horizontal pixel count results in detailed and high-resolution images.

Minimum Operating Temperature: -50 °C

Low minimum operating temperature ensures reliable performance even in extreme cold conditions.

Maximum Operating Current: 1 mA

Low operating current consumption results in energy efficiency and longer battery life.

Housing: CERAMIC

Ceramic housing provides durability and thermal stability for the image sensor.

Dynamic Range: 68 dB

High dynamic range allows for capturing both bright and dark areas in the image accurately.

Vertical Pixel: 1200

High vertical pixel count enhances image detail and clarity.

Body Length/Diameter: 33.02 mm

Compact body length/diameter ensures easy integration and space-saving design.

Termination Type: SOLDER

Solder termination ensures secure and reliable connections for the image sensor.

Frame Rate: 35 fps

High frame rate allows for smooth and fast image capture for real-time applications.

Array Type: INTERLINE

Interline array type provides efficient image capture and readout for high-quality imaging.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature offers secure attachment and easy installation of the image sensor.

Technical Specifications

Image Sensors KAI-2020 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELCTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

20.7 inch

Body Height:

3.17 mm

Body Length/Diameter:

33.02 mm

Dynamic Range:

68 dB

Frame Rate:

35 fps

Horizontal Pixel:

1600

Housing:

CERAMIC

Master Clock:

40 MHz

Mounting Feature:

Maximum Operating Current:

1 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

1200

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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