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KAI-2001

Onsemi

KAI-2001 by Onsemi

KAI-2001 by Onsemi is an image sensor with 7.4x7.4 um pixel size, 40 MHz master clock, and 1600 horizontal pixels. It operates at a max supply voltage of 15.5 V and has a frame rate of 30 fps. Ideal for applications requiring high-resolution imaging in industrial automation and surveillance systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 745 parts In-Stock

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745

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Vyrian

USA . 324 parts In-Stock

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Problanco Electronics

Mexico . 7,178 parts In-Stock

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Kulean Microsystems

USA . 4,775 parts In-Stock

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SupplyDigital Components

Austria . 4,307 parts In-Stock

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Corphita

USA . 2,039 parts In-Stock

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TANS Electronics

Latvia . 1,283 parts In-Stock

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UHIMA Technologies

Türkiye . 536 parts In-Stock

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Corohmni

South Africa . 179 parts In-Stock

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Overview

Discover the power of the KAI-2001 Image Sensor by Onsemi, a cutting-edge technology that delivers unparalleled performance and reliability. With a sleek design and advanced features, this sensor is perfect for a wide range of applications. Trust in Onsemi's reputation for excellence in manufacturing to provide you with top-notch quality and precision. Elevate your projects with the KAI-2001 and experience the value and benefits it brings to your work.

Feature Benefit Bullets

Pixel Size (um) 7.4X7.4

Smaller pixel size allows for higher resolution images to be captured with more detail.

Maximum Supply Voltage 15.5 V

Higher supply voltage allows for better performance and flexibility in power management.

Master Clock 40 MHz

High master clock frequency enables fast data transfer and processing of images.

Body Width 20.07 inch

Compact body width makes it easy to integrate the sensor into various devices and applications.

Sensors or Transducers Type IMAGE SENSOR,CCD

CCD sensors are known for their high image quality and sensitivity, making them ideal for capturing detailed images.

Body Height 3.17 mm

Low body height allows for a slim design and easy integration into thin devices.

Package Shape or Style RECTANGULAR

Rectangular package shape provides a standard form factor for easy integration and compatibility with existing designs.

Minimum Supply Voltage 14.5 V

Low minimum supply voltage helps in power efficiency and reduces the risk of damage due to overvoltage.

Maximum Operating Temperature 70 °C

Wide operating temperature range allows the sensor to perform reliably in various environmental conditions.

Horizontal Pixel 1600

High horizontal pixel count enables capturing wider field of view and detailed images.

Output Type DIGITAL VOLTAGE

Digital voltage output simplifies the interface with other electronics and devices.

Minimum Operating Temperature -50 °C

Low minimum operating temperature ensures the sensor can still function in extreme cold conditions.

Dynamic Range 60 dB

Wide dynamic range allows the sensor to capture both bright and dark areas in a scene with detail.

Vertical Pixel 1200

High vertical pixel count enhances the sensor's ability to capture detailed and high-resolution images.

Body Length/Diameter 33.02 mm

Compact body length/diameter provides flexibility in design and integration into various devices.

Data Rate 40 Mbps

High data rate enables fast transmission of image data for real-time processing and analysis.

Termination Type SOLDER

Solder termination type ensures a secure and reliable electrical connection for consistent performance.

Frame Rate 30 fps

High frame rate allows for smooth and continuous video recording and playback.

Array Type INTERLINE

Interline array type provides faster readout speeds and reduced image lag for capturing moving objects.

Mounting Feature THROUGH HOLE MOUNT

Through hole mounting feature offers a secure and stable installation for the sensor in various devices and applications.

Technical Specifications

Image Sensors KAI-2001 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

INTERLINE

Body Width:

20.07 inch

Body Height:

3.17 mm

Body Length/Diameter:

33.02 mm

Data Rate:

40 Mbps

Dynamic Range:

60 dB

Frame Rate:

30 fps

Horizontal Pixel:

1600

Master Clock:

40 MHz

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Output Type:

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

1200

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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