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KAE-02152-FBB-SP-EE

Onsemi

KAE-02152-FBB-SP-EE by Onsemi

Onsemi's KAE-02152-FBB-SP-EE is a 5.5x5.5 um CCD image sensor with 1920x1080 pixels, offering a dynamic range of 86 dB. Ideal for applications requiring high-resolution imaging in industrial and scientific fields due to its rectangular package style and through-hole mounting feature.

Median Price

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Lifecycle Status

Suppliers In-Stock

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Digiode

USA . 1,236 parts In-Stock

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Vyrian

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TANS Electronics

Latvia . 6,674 parts In-Stock

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SupplyDigital Components

Austria . 3,290 parts In-Stock

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Kulean Microsystems

USA . 2,923 parts In-Stock

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Problanco Electronics

Mexico . 2,357 parts In-Stock

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Corphita

USA . 1,349 parts In-Stock

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Corohmni

South Africa . 422 parts In-Stock

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UHIMA Technologies

Türkiye . 268 parts In-Stock

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Overview

Capture every moment with the KAE-02152-FBB-SP-EE by Onsemi. This top-of-the-line image sensor is designed for impeccable performance, delivering high-quality images with a wide dynamic range. Whether you're a professional photographer or a tech enthusiast, this CCD image sensor will exceed your expectations. With its advanced technology and reliable manufacturing by Onsemi, you can trust that your photos will always turn out stunning. Elevate your photography experience and unlock endless possibilities with the KAE-02152-FBB-SP-EE.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

The small pixel size allows for high resolution images with clear details.

Body Width: 29.97 inch

The compact body width makes it suitable for applications where space is limited.

Sensors or Transducers Type: IMAGE SENSOR, CCD

CCD image sensors are known for their high image quality and sensitivity, making this product ideal for imaging applications.

Body Height: 5.38 mm

The low body height allows for easy integration into different systems without taking up much space.

Package Shape or Style: RECTANGULAR

The rectangular shape makes it easy to mount and align in various setups.

Maximum Operating Temperature: 40 °C

With a high maximum operating temperature, this sensor can be used in a wide range of environments without overheating.

Horizontal Pixel: 1920

The high horizontal pixel count enables capturing detailed and sharp images.

Output Type: CURRENT OUTPUT

Current output provides a linear response, making it easier to interface with other electronics.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature means this sensor can also be used in extreme cold conditions.

Housing: CERAMIC

Ceramic housing provides durability and protection to the sensitive internal components of the sensor.

Dynamic Range: 86 dB

A high dynamic range allows the sensor to capture a wide range of light intensities, leading to accurate and vibrant images.

Vertical Pixel: 1080

The high vertical pixel count further enhances the image quality and detail captured by the sensor.

Body Length/Diameter: 33 mm

The moderate body length/diameter ensures a good balance between compactness and functionality.

Optical Format (inch): 2/3

The 2/3-inch optical format is a popular choice for imaging sensors, offering a good balance of size and performance.

Termination Type: SOLDER

Solder termination provides a secure and reliable connection for the sensor, ensuring consistent performance.

Array Type: INTERLINE

Interline arrays offer fast readout speeds, reducing motion blur in fast-moving scenes.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting makes installation and alignment of the sensor easier in various systems.

Technical Specifications

Image Sensors KAE-02152-FBB-SP-EE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAVE OUTPUT SENSTIVITY OF 44 MICRO VOLT PER ELECTRON

Array Type:

INTERLINE

Body Width:

29.97 inch

Body Height:

5.38 mm

Body Length/Diameter:

33 mm

Dynamic Range:

86 dB

Horizontal Pixel:

1920

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

2/3

Output Type:

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Sensors or Transducers Type:

Termination Type:

SOLDER

Vertical Pixel:

1080

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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