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KAI-43140-AXA-JD-AE

Onsemi

KAI-43140-AXA-JD-AE by Onsemi

Onsemi's KAI-43140-AXA-JD-AE is a 4.5x4.5 um CCD image sensor with 8040 (H) x 5360 (V) pixels, offering a dynamic range of 60 dB. Operating b/w -50 to 70 °C, it has a data rate of 60 Mbps and is ideal for high-resolution imaging applications in industrial and scientific fields.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,361 parts In-Stock

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Vyrian

USA . 1,566 parts In-Stock

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Kulean Microsystems

USA . 6,942 parts In-Stock

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SupplyDigital Components

Austria . 3,133 parts In-Stock

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Problanco Electronics

Mexico . 2,905 parts In-Stock

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TANS Electronics

Latvia . 2,585 parts In-Stock

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Corphita

USA . 426 parts In-Stock

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Corohmni

South Africa . 400 parts In-Stock

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UHIMA Technologies

Türkiye . 166 parts In-Stock

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Overview

Capture every detail with the KAI-43140-AXA-JD-AE by Onsemi, a high-quality image sensor that exceeds industry standards. Onsemi is renowned for its innovative technology and precision engineering, making this product a top choice for professional photographers, security systems, and industrial applications. With a wide range of benefits including superior image quality, high dynamic range, and easy integration, customers can trust in the reliability and performance of the KAI-43140-AXA-JD-AE to deliver exceptional results every time. Elevate your projects with Onsemi's cutting-edge image sensor technology.

Feature Benefit Bullets

Pixel Size (um): 4.5X4.5

Small pixel size allows for high resolution images to be captured with fine detail.

Maximum Supply Voltage: 15.5 V

Higher supply voltage allows for better sensitivity and signal to noise ratio.

Body Width: 45.34 inch

Compact body width makes it easy to integrate into various devices and systems.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors are known for their high image quality and low noise performance.

Body Height: 3.61 mm

Low body height allows for slim design and integration into compact devices.

Package Shape or Style: RECTANGULAR

Rectangular shape provides easy mounting and alignment within systems.

Minimum Supply Voltage: 14.5 V

Relatively low minimum supply voltage helps in energy efficiency.

Maximum Operating Temperature: 70 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Horizontal Pixel: 8040

High horizontal pixel count results in detailed and sharp images.

Minimum Operating Temperature: -50 °C

Low minimum operating temperature allows for use in extreme cold conditions.

Maximum Operating Current: 11 mA

Low operating current ensures energy efficiency and less heat generation.

Dynamic Range: 60 dB

High dynamic range captures both bright and dark areas accurately in the same image.

Vertical Pixel: 5360

High vertical pixel count allows for capturing detailed images with good resolution.

Body Length/Diameter: 47.24 mm

Standard body length/diameter for easy integration into existing systems.

Optical Format (inch): 1.7

Optical format suitable for various applications requiring specific lens compatibility.

Data Rate: 60 Mbps

High data rate facilitates fast transfer of image data for real-time processing.

Termination Type: SOLDER

Solder termination ensures secure and reliable connection within systems.

Array Type: INTERLINE

Interline array offers high-speed image capture suitable for dynamic scenes.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting provides sturdy attachment and stability within systems.

Technical Specifications

Image Sensors KAI-43140-AXA-JD-AE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT AS OUTPUT SENSITIVITY OF 42 MICRO VOLT PER ELECTRON

Array Type:

INTERLINE

Body Width:

45.34 inch

Body Height:

3.61 mm

Body Length/Diameter:

47.24 mm

Data Rate:

60 Mbps

Dynamic Range:

60 dB

Horizontal Pixel:

8040

Mounting Feature:

Maximum Operating Current:

11 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

1.7

Package Shape or Style:

Pixel Size (um):

4.5X4.5

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

5360

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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