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KAI-4011

Onsemi

KAI-4011 by Onsemi

The Onsemi KAI-4011 is an image sensor with 2048x2048 pixels, 7.4um pixel size, and 60dB dynamic range. It operates at supply voltages b/w 14.5V to 15.5V and outputs analog voltage data at a rate of 40Mbps. Ideal for applications requiring high-resolution imaging with precise color reproduction and low noise levels.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 746 parts In-Stock

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Digiode

USA . 704 parts In-Stock

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704

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Kulean Microsystems

USA . 8,340 parts In-Stock

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SupplyDigital Components

Austria . 4,764 parts In-Stock

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Corphita

USA . 2,421 parts In-Stock

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TANS Electronics

Latvia . 1,458 parts In-Stock

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Problanco Electronics

Mexico . 1,421 parts In-Stock

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Corohmni

South Africa . 148 parts In-Stock

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UHIMA Technologies

Türkiye . 125 parts In-Stock

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Overview

Experience unparalleled image quality and performance with the KAI-4011 by Onsemi. As a leading manufacturer of image sensors, Onsemi delivers cutting-edge technology that exceeds expectations. The KAI-4011 is perfect for a wide range of applications in industries such as medical imaging, industrial inspection, and security systems. With its impressive dynamic range and high-resolution capabilities, this sensor provides unmatched value and benefits to customers looking for top-of-the-line imaging solutions. Choose the KAI-4011 and elevate your imaging experience today!

Feature Benefit Bullets

Pixel Size (um): 7.4X7.4

Smaller pixel size allows for higher resolution images with more detail.

Maximum Supply Voltage: 15.5 V

Higher supply voltage allows for better performance and flexibility in power management.

Body Width: 25.65 inch

Compact body width makes it easier to integrate into various devices and systems.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors are known for their high-quality image capture capabilities.

Body Height: 4.95 mm

Low body height allows for slim design and easy integration into compact spaces.

Package Shape or Style: RECTANGULAR

Rectangular shape enables easy mounting and alignment in devices.

Minimum Supply Voltage: 14.5 V

Lower minimum supply voltage helps in power efficiency and extends battery life.

Horizontal Pixel: 2048

High horizontal pixel count allows for detailed and sharp images.

Output Type: ANALOG VOLTAGE

Analog output allows for smooth transition of image data with minimal loss of information.

Dynamic Range: 60 dB

High dynamic range enables capture of both bright and dark areas in a scene with detail.

Vertical Pixel: 2048

High vertical pixel count ensures high-resolution images in both horizontal and vertical directions.

Body Length/Diameter: 35.56 mm

Compact body length/diameter makes it versatile for integration in various devices.

Data Rate: 40 Mbps

High data rate enables fast transfer of image data for real-time applications.

Termination Type: SOLDER

Solder termination provides secure and reliable connection for long-term use.

Array Type: INTERLINE

Interline array type allows for faster readout and processing of image data.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature ensures secure and stable attachment to circuit boards or devices.

Technical Specifications

Image Sensors KAI-4011 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

SENSITIVITY 16 UV/ELECTRON, ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

25.65 inch

Body Height:

4.95 mm

Body Length/Diameter:

35.56 mm

Data Rate:

40 Mbps

Dynamic Range:

60 dB

Horizontal Pixel:

2048

Mounting Feature:

Output Type:

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

2048

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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