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KAE-08151-ABA-JP-FA

Onsemi

KAE-08151-ABA-JP-FA by Onsemi

The Onsemi KAE-08151-ABA-JP-FA is an image sensor with 5.5x5.5 um pixel size, 2856 horizontal and vertical pixels, and 86 dB dynamic range. It operates b/w -70 to 40 °C with a supply voltage range of 14.7V to 15V. Ideal for applications requiring high-resolution imaging in industrial cameras or surveillance systems due to its CCD sensor technology and rectangular package style.

Median Price

$6,525.690

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 8 parts In-Stock

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Verical

USA . 8 parts In-Stock

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$6,525.690

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Digiode

USA . 2,454 parts In-Stock

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$6,199.406

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Vyrian

USA . 4,627 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 251 parts In-Stock

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$15.510

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Corphita

USA . 806 parts In-Stock

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$5,873.121

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Corohmni

South Africa . 161 parts In-Stock

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$6,525.690

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TANS Electronics

Latvia . 5,479 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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SupplyDigital Components

Austria . 2,133 parts In-Stock

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Problanco Electronics

Mexico . 1,209 parts In-Stock

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Kulean Microsystems

USA . 813 parts In-Stock

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UHIMA Technologies

Türkiye . 59 parts In-Stock

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Overview

Capture the world with crystal-clear precision using the KAE-08151-ABA-JP-FA by Onsemi! This top-notch Image Sensor offers unparalleled quality and performance, making it a standout choice for a wide range of applications. From high-definition surveillance cameras to cutting-edge medical imaging devices, this sensor delivers exceptional value, reliability, and versatility. Trust Onsemi's expertise in manufacturing to bring you the best in image sensing technology. Elevate your projects with the KAE-08151-ABA-JP-FA and experience the difference today!

Feature Benefit Bullets

Pixel Size (um) 5.5X5.5

Smaller pixel size allows for higher resolution images to be captured, making this sensor suitable for applications requiring detailed imaging.

Maximum Supply Voltage 15 V

Allows for flexible power supply options and compatibility with a wide range of systems.

Body Width 41 inch

Compact body width makes it easy to integrate into various devices without taking up too much space.

Sensors or Transducers Type IMAGE SENSOR,CCD

CCD sensors are known for their high-quality image output and low noise performance, making this sensor a reliable choice for imaging applications.

Body Height 3.25 mm

Low body height allows for shallow camera designs, ideal for applications where space is limited.

Package Shape or Style RECTANGULAR

Rectangular package shape makes it easy to mount and align the sensor in various orientations.

Minimum Supply Voltage 14.7 V

Low minimum supply voltage helps in power efficiency and extends the battery life of devices using this sensor.

Maximum Operating Temperature 40 °C

Wide operating temperature range allows the sensor to function reliably in various environmental conditions.

Horizontal Pixel 2856

High horizontal pixel count enables detailed and high-resolution image capture.

Minimum Operating Temperature -70 °C

Wide temperature range ensures the sensor can operate in extreme cold conditions without compromising performance.

Maximum Operating Current 9 mA

Low operating current helps in power efficiency and reduces heat generation in devices using this sensor.

Dynamic Range 86 dB

High dynamic range allows the sensor to capture a wide range of light intensities, resulting in detailed images with accurate colors.

Vertical Pixel 2856

High vertical pixel count complements the high horizontal pixel count to deliver sharp and detailed images.

Body Length/Diameter 43.5 mm

Optimal body length for accommodating the sensor components and maintaining a sleek design in devices.

Optical Format (inch) 4/3

4/3 optical format is commonly used in digital cameras, providing compatibility with various lenses and accessories.

Termination Type SOLDER

Solder termination ensures secure and reliable electrical connections for the sensor, enhancing its durability.

Frame Rate 14 fps

Decent frame rate suitable for capturing smooth motion in videos and fast-moving subjects.

Array Type INTERLINE

Interline array type allows for faster readout speeds and reduced image lag, making it suitable for applications requiring quick image capture.

Mounting Feature THROUGH HOLE MOUNT

Through-hole mounting feature provides a secure and stable mounting option, ensuring proper alignment and integration of the sensor in various devices.

Technical Specifications

Image Sensors KAE-08151-ABA-JP-FA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS OUTPUT SENSITIVITY 44 MICRO VOLT PER ELECTRON; ELECTRONIC SHUTTER; GLOBAL SHUTTER

Array Type:

INTERLINE

Body Width:

41 inch

Body Height:

3.25 mm

Body Length/Diameter:

43.5 mm

Dynamic Range:

86 dB

Frame Rate:

14 fps

Horizontal Pixel:

2856

Mounting Feature:

Maximum Operating Current:

9 mA

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

-70 Cel

Optical Format (inch):

4/3

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Sensors or Transducers Type:

Maximum Supply Voltage:

15 V

Minimum Supply Voltage:

14.7 V

Termination Type:

SOLDER

Vertical Pixel:

2856

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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