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CYII5SM1300AB-QWC

Onsemi

CYII5SM1300AB-QWC by Onsemi

CYII5SM1300AB-QWC by Onsemi is an image sensor with 1280x1024 pixels, 6.7um pixel size, and a max supply voltage of 4.5V. It is ideal for applications requiring a digital output interface, such as surveillance cameras or industrial imaging systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,322 parts In-Stock

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Vyrian

USA . 237 parts In-Stock

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TANS Electronics

Latvia . 2,754 parts In-Stock

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Kulean Microsystems

USA . 2,553 parts In-Stock

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SupplyDigital Components

Austria . 2,132 parts In-Stock

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Northwest PG Solutions

USA . 1,596 parts In-Stock

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Corphita

USA . 770 parts In-Stock

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Native Components

USA . 704 parts In-Stock

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Problanco Electronics

Mexico . 452 parts In-Stock

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UHIMA Technologies

Türkiye . 318 parts In-Stock

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Corohmni

South Africa . 52 parts In-Stock

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Overview

Capture the essence of every moment with the CYII5SM1300AB-QWC Image Sensor by Onsemi. Crafted with precision and expertise, this sensor provides unparalleled image quality and clarity for a wide range of applications. From security systems to medical imaging, this sensor offers superior performance, reliability, and versatility. Elevate your projects with the advanced features and exceptional value that only Onsemi can deliver. Trust in the CYII5SM1300AB-QWC to bring your visions to life with unmatched precision and detail.

Feature Benefit Bullets

Pixel Size (um) 6.7X6.7

Smaller pixel size allows for higher resolution images and better low light performance.

Maximum Supply Voltage 4.5 V

Higher supply voltage allows for better signal-to-noise ratio and improved performance.

Master Clock 40 MHz

Higher master clock frequency enables faster readout speeds and higher frame rates.

Body Width 15.24 inch

Compact body width allows for easy integration into various devices and systems.

Sensors or Transducers Type IMAGE SENSOR,CMOS

CMOS sensors provide low power consumption and high sensitivity, making them ideal for imaging applications.

Body Height 2.25 mm

Low body height enables slim design and easy installation in compact spaces.

Package Shape or Style SQUARE

Square package shape allows for efficient use of space and easy alignment during assembly.

Minimum Supply Voltage 3 V

Lower minimum supply voltage ensures compatibility with a wide range of systems and power sources.

Maximum Operating Temperature 65 °C

High maximum operating temperature ensures reliability in harsh environmental conditions.

Horizontal Pixel 1280

Higher horizontal pixel count provides detailed images with improved clarity and sharpness.

Output Range 0.50-2.20V

Wide output voltage range ensures compatibility with various signal processing systems.

Output Type DIGITAL VOLTAGE

Digital voltage output simplifies signal processing and reduces interference.

Minimum Operating Temperature -30 °C

Low minimum operating temperature allows for operation in cold environments without performance degradation.

Maximum Operating Current 60 mA

Low operating current minimizes power consumption and heat generation.

Housing CERAMIC

Ceramic housing provides durability and thermal stability for reliable long-term operation.

Dynamic Range 64 dB

Wide dynamic range captures both bright and dark areas in an image with detail and accuracy.

Vertical Pixel 1024

Higher vertical pixel count enhances image resolution and detail for better overall quality.

Body Length/Diameter 15.24 mm

Compact body length/diameter allows for flexibility in mounting and integration.

Optical Format (inch) 2/3

2/3 inch optical format is a standard size for compatibility with various lenses and imaging systems.

Data Rate 40 Mbps

High data rate enables fast and efficient data transfer for real-time imaging applications.

Termination Type SOLDER

Solder termination provides secure electrical connections for reliable signal transmission.

Output Interface Type 3-WIRE INTERFACE

3-wire interface simplifies connectivity and communication between the sensor and external devices.

Frame Rate 27 fps

High frame rate ensures smooth video capture and real-time imaging capabilities.

Array Type FULL FRAME

Full frame array design maximizes light sensitivity and image quality across the entire sensor area.

Sensitivity (V/lx.s) 8.4 V/lx.s

High sensitivity allows the sensor to capture clear and detailed images in low light conditions.

Mounting Feature SURFACE MOUNT

Surface mount design simplifies installation and integration into various devices and systems.

Technical Specifications

Image Sensors CYII5SM1300AB-QWC attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC SHUTTER, GLOBAL SHUTTER

Array Type:

FULL FRAME

Body Width:

15.24 inch

Body Height:

2.25 mm

Body Length/Diameter:

15.24 mm

Data Rate:

40 Mbps

Dynamic Range:

64 dB

Frame Rate:

27 fps

Horizontal Pixel:

1280

Housing:

CERAMIC

Master Clock:

40 MHz

Mounting Feature:

Maximum Operating Current:

60 mA

Maximum Operating Temperature:

65 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

2/3

Output Interface Type:

3-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

6.7X6.7

Sensitivity (V/lx.s):

8.4 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

4.5 V

Minimum Supply Voltage:

3 V

Termination Type:

SOLDER

Vertical Pixel:

1024

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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