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MT9V128IA3XTC-DP

Onsemi

MT9V128IA3XTC-DP by Onsemi

MT9V128IA3XTC-DP by Onsemi is a 5.6x5.6 um CMOS image sensor with 680H x 512V pixels, offering a dynamic range of 74.8 dB and operating at temperatures from -40 to 105 °C. Ideal for applications requiring a digital voltage output interface, such as surveillance cameras or industrial imaging systems.

Median Price

$18.195

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,082 parts In-Stock

1+ parts

$21.630

100+ parts

$17.135

1k+ parts

$16.081

10k+ parts

-

1,082

$21.630

$17.135

$16.081

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Rochester

USA . 65 parts In-Stock

1+ parts

-

100+ parts

$14.760

1k+ parts

$13.210

10k+ parts

$12.430

65

-

$14.760

$13.210

$12.430

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 744 parts In-Stock

1+ parts

$15.618

100+ parts

-

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744

$15.618

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-

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Nova Conductors

Japan . 81 parts In-Stock

1+ parts

$16.568

100+ parts

-

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81

$16.568

-

-

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Flip Electronics

USA . 2,710 parts In-Stock

1+ parts

-

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2,710

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Vyrian

USA . 476 parts In-Stock

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476

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Distributors (Availability)

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Ampacity Inc.

Singapore . 697 parts In-Stock

1+ parts

$13.970

100+ parts

-

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697

$13.970

-

-

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Semicontronic

India . 439 parts In-Stock

1+ parts

$13.970

100+ parts

$13.621

1k+ parts

$13.551

10k+ parts

-

439

$13.970

$13.621

$13.551

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Corphita

USA . 397 parts In-Stock

1+ parts

$14.796

100+ parts

-

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397

$14.796

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Corohmni

South Africa . 493 parts In-Stock

1+ parts

$16.237

100+ parts

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493

$16.237

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Continental Prestige Electronics

USA . 1,684 parts In-Stock

1+ parts

$16.568

100+ parts

-

1k+ parts

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10k+ parts

$16.237

1,684

$16.568

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-

$16.237

Netroflash

USA . 100 parts In-Stock

1+ parts

$16.568

100+ parts

$16.237

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-

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100

$16.568

$16.237

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TANS Electronics

Latvia . 5,844 parts In-Stock

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5,844

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Kulean Microsystems

USA . 4,854 parts In-Stock

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4,854

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Argo Parts USA

USA . 2,478 parts In-Stock

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2,478

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SupplyDigital Components

Austria . 2,357 parts In-Stock

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2,357

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

1+ parts

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1,500

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UHIMA Technologies

Türkiye . 874 parts In-Stock

1+ parts

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874

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Problanco Electronics

Mexico . 760 parts In-Stock

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760

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Overview

Capture every moment in stunning detail with the MT9V128IA3XTC-DP Image Sensor by Onsemi. Known for their top-quality products, Onsemi delivers exceptional performance and reliability. Whether you're creating a cutting-edge security system, a high-resolution camera, or a state-of-the-art medical imaging device, this image sensor will exceed your expectations. With its advanced features and impressive dynamic range, this sensor offers unparalleled value and benefits to customers looking for the best in image capture technology. Trust Onsemi to provide the tools you need to bring your vision to life.

Feature Benefit Bullets

Pixel Size (um): 5.6X5.6

Small pixel size allows for high resolution images to be captured

Maximum Supply Voltage: 1.9 V

Efficient power usage with a relatively low maximum supply voltage

Master Clock: 27 MHz

High master clock frequency enables fast data processing

Body Width: 9 inch

Compact body size for easy integration into devices

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensor technology provides high-quality image capture

Package Shape or Style: SQUARE

Square package shape allows for efficient use of space on circuit boards

Minimum Supply Voltage: 1.7 V

Low minimum supply voltage for energy efficiency

Maximum Operating Temperature: 105 °C

Wide operating temperature range for versatility in different environments

Horizontal Pixel: 680

High horizontal pixel count for detailed images

Output Type: DIGITAL VOLTAGE

Digital voltage output for easy integration with digital systems

Minimum Operating Temperature: -40 °C

Ability to operate in extreme cold temperatures

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Durable terminal finish for long-term reliability

Maximum Operating Current: 50 mA

Low operating current for energy efficiency

Dynamic Range: 74.8 dB

High dynamic range for capturing both bright and dark areas in an image

Vertical Pixel: 512

High vertical pixel count for detailed images

Body Length/Diameter: 9 mm

Compact body size for easy integration into devices

Optical Format (inch): 1/4

Standard optical format for compatibility with various lenses

Termination Type: SOLDER

Solder termination for secure connection to circuit boards

Output Interface Type: 2-WIRE INTERFACE

2-wire interface for easy connectivity to other components

Frame Rate: 60 fps

High frame rate for smooth video capture

Array Type: FRAME

Frame array type for organized image capture

Mounting Feature: SURFACE MOUNT

Surface mount capability for easy installation on circuit boards

Technical Specifications

Image Sensors MT9V128IA3XTC-DP attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

FRAME

Body Width:

9 inch

Body Height:

1.4 mm

Body Length/Diameter:

9 mm

Dynamic Range:

74.8 dB

Frame Rate:

60 fps

Horizontal Pixel:

680

JESD-609 Code:

e1

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

50 mA

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/4

Output Interface Type:

2-WIRE INTERFACE

Output Type:

Package Shape or Style:

Pixel Size (um):

5.6X5.6

Sensors or Transducers Type:

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

512

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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