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MT9V024IA7XTC-DP

Onsemi

MT9V024IA7XTC-DP by Onsemi

Onsemi's MT9V024IA7XTC-DP image sensor features 6x6 um pixel size, 27 MHz master clock, and 752 horizontal pixels. Ideal for applications requiring a digital voltage output interface, such as frame arrays in surveillance cameras or industrial imaging systems.

Median Price

$21.054

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$21.054

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300

$21.054

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Vyrian

USA . 8,346 parts In-Stock

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8,346

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Chip Stock

USA . 6,700 parts In-Stock

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6,700

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Cyclops Electronics Ltd

UK . 5,200 parts In-Stock

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5,200

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Flip Electronics

USA . 2,325 parts In-Stock

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2,325

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Digiode

USA . 1,691 parts In-Stock

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1,691

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Distributors (Availability)

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Ampacity Inc.

Singapore . 406 parts In-Stock

1+ parts

$1.750

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406

$1.750

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Aztec Data Supply Inc.

USA . 368 parts In-Stock

1+ parts

$1.824

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368

$1.824

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AZTECH Wire

Italy . 558 parts In-Stock

1+ parts

$6.763

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558

$6.763

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Corohmni

South Africa . 488 parts In-Stock

1+ parts

$20.633

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488

$20.633

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$21.054

100+ parts

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$20.002

10k+ parts

$19.581

1,000

$21.054

-

$20.002

$19.581

Continental Prestige Electronics

USA . 35 parts In-Stock

1+ parts

$21.054

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$20.633

35

$21.054

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$20.633

Semicontronic

India . 950 parts In-Stock

1+ parts

$22.750

100+ parts

$22.181

1k+ parts

$22.068

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950

$22.750

$22.181

$22.068

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Kulean Microsystems

USA . 6,529 parts In-Stock

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6,529

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GreenTree Electronics

Israel . 5,200 parts In-Stock

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Problanco Electronics

Mexico . 5,188 parts In-Stock

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Futuretech Components

Singapore . 4,000 parts In-Stock

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Lixinc

USA . 3,750 parts In-Stock

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3,750

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Argo Parts USA

USA . 3,541 parts In-Stock

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S.R.D Solutions

India . 2,500 parts In-Stock

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2,500

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A-Z Elektronik GmbH

Germany . 2,500 parts In-Stock

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2,500

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SupplyDigital Components

Austria . 2,157 parts In-Stock

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Corphita

USA . 1,818 parts In-Stock

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UHIMA Technologies

Türkiye . 804 parts In-Stock

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804

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Authorized Procurement Solutions

USA . 780 parts In-Stock

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780

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TANS Electronics

Latvia . 372 parts In-Stock

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372

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Overview

Enhance your imaging solutions with the MT9V024IA7XTC-DP Image Sensor by Onsemi. With cutting-edge technology and superior quality, Onsemi is a trusted manufacturer known for delivering top-notch products in the industry. Ideal for a wide range of applications, this image sensor offers unmatched performance, reliability, and precision. Capture stunning images with ease and experience the value and benefits that this product brings to your projects. Upgrade to the MT9V024IA7XTC-DP and take your imaging capabilities to the next level.

Feature Benefit Bullets

Pixel Size (um): 6X6

The small pixel size allows for high-resolution images with sharp details.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures stable operation and reliable performance.

Master Clock: 27 MHz

The high master clock frequency enables fast data processing and high-speed image capture.

Body Width: 9 inch

The compact body width makes the image sensor suitable for various applications where space is limited.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors offer low power consumption, high sensitivity, and excellent image quality.

Body Height: 1.3 mm

The slim body height allows for easy integration into compact electronic devices.

Package Shape or Style: SQUARE

The square package shape provides a stable and secure mounting option for the image sensor.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures efficient power utilization and extends battery life.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range makes the image sensor suitable for use in various environmental conditions.

Horizontal Pixel: 752

The high horizontal pixel count allows for detailed and high-resolution image capture.

Output Range: 0.30-3V

The wide output voltage range offers flexibility in signal processing and compatibility with different electronic systems.

Output Type: DIGITAL VOLTAGE

The digital voltage output simplifies signal processing and reduces noise interference.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures reliable performance even in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides excellent conductivity and corrosion resistance for long-lasting performance.

Maximum Operating Current: 60 mA

The low maximum operating current ensures energy efficiency and prevents overheating during extended use.

Dynamic Range: 100 dB

The high dynamic range allows the image sensor to capture a wide range of light intensities without losing details.

Vertical Pixel: 480

The vertical pixel count contributes to the overall image resolution and clarity.

Body Length/Diameter: 9 mm

The compact body length/diameter allows for easy installation and integration into various devices.

Optical Format (inch): 1/3

The 1/3 inch optical format is commonly used in image sensors for high-quality imaging.

Termination Type: SOLDER

The solder termination type ensures secure and reliable connections for stable signal transmission.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface simplifies connectivity with other electronic components and systems.

Frame Rate: 60 fps

The high frame rate of 60 frames per second allows for smooth and fluid motion capture in videos and fast-moving scenes.

Array Type: FRAME

The frame array type provides detailed and high-quality image capture for various applications.

Mounting Feature: SURFACE MOUNT

The surface mounting feature offers easy and convenient installation of the image sensor on PCBs and electronic devices.

Technical Specifications

Image Sensors MT9V024IA7XTC-DP attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

GLOBAL SHUTTER

Array Type:

FRAME

Body Width:

9 inch

Body Height:

1.3 mm

Body Length/Diameter:

9 mm

Dynamic Range:

100 dB

Frame Rate:

60 fps

Horizontal Pixel:

752

JESD-609 Code:

e1

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

60 mA

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

6X6

Sensors or Transducers Type:

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Terminal Finish:

TIN SILVER COPPER

Termination Type:

SOLDER

Vertical Pixel:

480

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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