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KAF-37500-NXA-JH-AE

Onsemi

KAF-37500-NXA-JH-AE by Onsemi

Onsemi's KAF-37500-NXA-JH-AE is a 6x6 um pixel size image sensor with 7500 horizontal and 5000 vertical pixels. It operates b/w 0 to 60 °C, with a dynamic range of 69.3 dB. Ideal for applications requiring high-resolution imaging in industrial and scientific fields.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,217 parts In-Stock

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Digiode

USA . 798 parts In-Stock

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Problanco Electronics

Mexico . 8,214 parts In-Stock

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SupplyDigital Components

Austria . 7,278 parts In-Stock

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Kulean Microsystems

USA . 6,525 parts In-Stock

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TANS Electronics

Latvia . 6,169 parts In-Stock

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Corphita

USA . 1,548 parts In-Stock

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UHIMA Technologies

Türkiye . 268 parts In-Stock

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Corohmni

South Africa . 195 parts In-Stock

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Overview

Discover the cutting-edge KAF-37500-NXA-JH-AE Image Sensor by Onsemi, a top-tier manufacturer known for its superior quality and innovative technology. Perfect for a wide range of applications, this sensor offers unparalleled image clarity and precision. Experience the benefits of advanced imaging technology with this state-of-the-art product, providing customers with exceptional value and performance. Elevate your projects to new heights with the KAF-37500-NXA-JH-AE Image Sensor from Onsemi.

Feature Benefit Bullets

Pixel Size (um): 6X6

Smaller pixel size allows for higher resolution images to be captured with greater detail and clarity.

Maximum Supply Voltage: 15.5 V

Higher maximum supply voltage allows for increased flexibility in power supply options and compatibility with various systems.

Body Width: 40.5 inch

Compact body width makes the image sensor suitable for applications where space is limited.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD image sensors are known for their high-quality image output and low noise, making them ideal for demanding imaging applications.

Body Height: 1.7 mm

Low body height enables integration into slim devices and systems without adding bulk.

Package Shape or Style: RECTANGULAR

Rectangular shape allows for easy integration into electronic systems and PCB designs.

Minimum Supply Voltage: 14.5 V

Lower minimum supply voltage helps reduce power consumption and extends the lifespan of the image sensor.

Maximum Operating Temperature: 60 °C

High maximum operating temperature ensures reliable performance in a wide range of environmental conditions.

Horizontal Pixel: 7500

High horizontal pixel count enables capturing detailed and high-resolution images with sharpness and clarity.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows the image sensor to function effectively in cold environments without performance degradation.

Dynamic Range: 69.3 dB

Wide dynamic range capability ensures accurate representation of both dark and bright areas in the captured images.

Vertical Pixel: 5000

Generous vertical pixel count allows for high-quality images with rich detail and depth.

Body Length/Diameter: 60.5 mm

Moderate body length/diameter provides a balance between compact size and performance functionality.

Termination Type: SOLDER

Solder termination offers a reliable and durable connection for seamless integration into electronic assemblies.

Array Type: FULL FRAME

Full-frame array setup maximizes light capture and imaging area for comprehensive and detailed image acquisition.

Mounting Feature: THROUGH HOLE MOUNT

Through-hole mounting feature ensures secure and stable attachment to PCBs and other mounting surfaces.

Technical Specifications

Image Sensors KAF-37500-NXA-JH-AE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT ALSO HAVE ESTIMATED LINEAR DYNAMIC RANGE 68.4 DB

Array Type:

FULL FRAME

Body Width:

40.5 inch

Body Height:

1.7 mm

Body Length/Diameter:

60.5 mm

Dynamic Range:

69.3 dB

Horizontal Pixel:

7500

Mounting Feature:

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

0 Cel

Package Shape or Style:

Pixel Size (um):

6X6

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

5000

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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