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TC215-50

Texas Instruments

TC215-50 by Texas Instruments

TC215-50 by Texas Instruments is an image sensor with 12x12 um pixel size, 1000 horizontal pixels, and 1018 vertical pixels. It operates at temperatures from -10 to 40 °C and requires a 12V power supply. Ideal for applications requiring high-resolution imaging in various environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,256 parts In-Stock

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Digiode

USA . 1,255 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,017 parts In-Stock

1+ parts

$2.335

100+ parts

$216.874

1k+ parts

$2.102

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-

1,017

$2.335

$216.874

$2.102

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DigiPath Technology Company

USA . 1,137 parts In-Stock

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$2.572

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1,137

$2.572

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ChromeModa Solutions

Germany . 5,300 parts In-Stock

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$2.624

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$2.152

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5,300

$2.624

$2.152

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IDEA Electronic Components Group

UK . 468 parts In-Stock

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$2.624

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$2.362

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468

$2.624

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$2.362

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One Stop Electronics

USA . 1,276 parts In-Stock

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$3.750

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$3.750

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AZTECH Wire

Italy . 353 parts In-Stock

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$19.280

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353

$19.280

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Ampacity Inc.

Singapore . 1,387 parts In-Stock

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$20.750

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$20.750

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Semicontronic

India . 680 parts In-Stock

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$48.750

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$47.531

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$47.288

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680

$48.750

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$47.288

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Corphita

USA . 3,414 parts In-Stock

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Corohmni

South Africa . 124 parts In-Stock

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Overview

Experience the superior quality and reliability of Texas Instruments with the TC215-50 Image Sensor. Designed for various applications, this sensor offers unmatched performance and precision, making it the perfect choice for your imaging needs. With a pixel size of 12x12um and a maximum operating temperature of 40°C, you can trust that this sensor will deliver exceptional results every time. Trust Texas Instruments to provide you with the cutting-edge technology you need to stay ahead in your industry. Choose the TC215-50 for unparalleled value and benefits that will take your projects to the next level.

Feature Benefit Bullets

Pixel Size (um): 12X12

The small pixel size allows for high resolution imaging, capturing fine details with clarity.

Power Supplies (V): 12

The low power supply requirement of 12V makes this image sensor energy-efficient and suitable for various applications.

Maximum Operating Temperature: 40 °C

The high maximum operating temperature of 40°C ensures reliable performance in a range of environmental conditions.

Horizontal Pixel: 1000

With a horizontal resolution of 1000 pixels, this image sensor is capable of producing sharp and detailed images.

Minimum Operating Temperature: -10 °C

The low minimum operating temperature of -10°C allows this image sensor to function in colder environments without any issues.

Vertical Pixel: 1018

The vertical resolution of 1018 pixels provides additional detail in images, making it suitable for applications where precision is key.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature offers secure and stable installation of the image sensor, ensuring reliable performance in various setups.

Technical Specifications

Image Sensors TC215-50 attributes and parameters. Explore more Image Sensors devices from Texas Instruments

Specs

Horizontal Pixel:

1000

Mounting Feature:

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

-10 Cel

Pixel Size (um):

12X12

Power Supplies (V):

12

Sub-Category:

CCD Image Sensors

Vertical Pixel:

1018

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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