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NOM02A6-AR77G

Onsemi

NOM02A6-AR77G by Onsemi

NOM02A6-AR77G by Onsemi is a CMOS image sensor with 3.1-3.5V supply voltage range, operating at 0-50 °C. It outputs analog voltage in the range of 2.40-2.60V, suitable for applications requiring precise imaging in compact spaces like panel-mounted devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,336 parts In-Stock

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Vyrian

USA . 340 parts In-Stock

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340

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SupplyDigital Components

Austria . 6,968 parts In-Stock

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Kulean Microsystems

USA . 5,350 parts In-Stock

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TANS Electronics

Latvia . 4,316 parts In-Stock

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Problanco Electronics

Mexico . 4,307 parts In-Stock

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Corphita

USA . 413 parts In-Stock

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UHIMA Technologies

Türkiye . 300 parts In-Stock

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Corohmni

South Africa . 188 parts In-Stock

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Overview

Enhance your imaging experience with the NOM02A6-AR77G by Onsemi, a top-of-the-line image sensor that delivers unparalleled quality and reliability. Manufactured by Onsemi, a trusted industry leader, this sensor is perfect for a wide range of applications. From security cameras to medical imaging equipment, the possibilities are endless. With a sleek design and advanced technology, this sensor offers exceptional value and performance to meet all your imaging needs. Upgrade your devices today with the NOM02A6-AR77G and experience the difference!

Feature Benefit Bullets

Maximum Supply Voltage: 3.5 V

A high maximum supply voltage allows for flexibility in power source options and can support various applications without the risk of overloading the sensor.

Body Width: 21 inch

The compact body width of 21 inches makes the sensor suitable for applications where space is limited, providing versatility in installation and integration.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

Being a CMOS image sensor ensures high-quality image capture with low power consumption, making it an efficient choice for imaging applications.

Body Height: 12 mm

The slim body height of 12mm allows for easy integration into devices or systems where space constraints exist, making it a versatile choice for compact setups.

Package Shape or Style: RECTANGULAR

The rectangular package shape provides a standardized form factor for easy mounting and compatibility with various systems, ensuring seamless integration.

Minimum Supply Voltage: 3.1 V

A low minimum supply voltage ensures efficient power usage and compatibility with a range of power sources, making it a versatile choice for different applications.

Maximum Operating Temperature: 50 °C

With a high maximum operating temperature of 50 °C, the sensor can withstand a wide range of environmental conditions, making it suitable for various applications.

Output Range: 2.40-2.60V

The specified output voltage range of 2.40-2.60V ensures consistent and reliable signal output, making it ideal for accurate image processing and analysis.

Output Type: ANALOG VOLTAGE

An analog voltage output type provides compatibility with a wide range of systems and allows for easy integration, making it a versatile choice for different applications.

Minimum Operating Temperature: 0 °C

With a low minimum operating temperature of 0 °C, the sensor can function reliably in colder environments, expanding its usability across various applications.

Maximum Operating Current: 14.5 mA

The specified maximum operating current of 14.5 mA indicates efficient power consumption, making it an energy-efficient choice for continuous operation.

Housing: PLASTIC

A plastic housing offers durability and lightweight design, making the sensor resistant to impact and suitable for portable or rugged applications.

Body Length/Diameter: 124 mm

The body length of 124mm provides ample space for sensor components, ensuring reliable performance and accurate image capture in various applications.

Termination Type: SOLDER

Solder termination ensures secure and reliable connections, minimizing the risk of signal loss or interference, making it a robust choice for long-term use.

Mounting Feature: PANEL MOUNT

The panel mount feature allows for easy and secure installation on various surfaces, providing flexibility in mounting options and ensuring stability in operation.

Technical Specifications

Image Sensors NOM02A6-AR77G attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Body Width:

21 inch

Body Height:

12 mm

Body Length/Diameter:

124 mm

Housing:

PLASTIC

Mounting Feature:

Maximum Operating Current:

14.5 mA

Maximum Operating Temperature:

50 Cel

Minimum Operating Temperature:

0 Cel

Output Range:

Output Type:

Package Shape or Style:

Sensors or Transducers Type:

Maximum Supply Voltage:

3.5 V

Minimum Supply Voltage:

3.1 V

Termination Type:

SOLDER

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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