Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Onsemi MT9P401I12STC is a 2.2x2.2um image sensor with 2592H x 1944V pixels, operating at -30 to 70 °C. It requires a 2.8V power supply and features surface mounting, making it ideal for high-resolution imaging applications in various industries.
Median Price
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4
In-Stock Inventory
1k+
Chip Stock
1+ parts
100+ parts
1k+ parts
10k+ parts
Vyrian
Digiode
Bristol Electronics
Metaverse IC Inc.
SupplyDigital Components
TANS Electronics
Corphita
Authorized Procurement Solutions
Kulean Microsystems
Problanco Electronics
Futuretech Components
Corohmni
UHIMA Technologies
Kepictronics
The small pixel size allows for high resolution and detailed images to be captured, making it ideal for applications requiring precision.
The low power supply requirement of 2.8V ensures energy efficiency and can be easily integrated into various electronic systems.
With a high maximum operating temperature of 70 °C, this image sensor can withstand harsh environmental conditions, increasing its durability and versatility.
The high horizontal pixel count of 2592 results in high-quality images with rich detail and clarity, making it suitable for professional photography and industrial imaging applications.
The low minimum operating temperature of -30 °C ensures reliable performance even in cold climates, making it a great choice for outdoor and remote sensing applications.
The vertical pixel count of 1944 contributes to the overall high resolution and image quality, allowing for crisp and clear images to be captured in various settings.
The surface mount feature enables easy and secure installation of the image sensor onto circuit boards or other surfaces, simplifying the manufacturing and integration process.
Image Sensors MT9P401I12STC attributes and parameters. Explore more Image Sensors devices from Onsemi
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Mounting Feature:
Maximum Operating Temperature:
Minimum Operating Temperature:
Pixel Size (um):
Power Supplies (V):
Sub-Category:
Vertical Pixel:
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
LM358M
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
BAV99
Panasonic
MIXER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
M24308/2-1F
Amphenol
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Body or Shell Style: RECEPTACLE; Body Length: 1.228 inch; No. of Rows Loaded: 2;
BSS138
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; No. of Elements: 1; Maximum Drain Current (Abs) (ID): .2 A;
CRG0805F10K
TE Connectivity
TE Connectivity's CRG0805F10K is a 10000 ohm fixed resistor with 1% tolerance. It operates b/w -55 to 155 °C and has a power dissipation of 0.125 W. Ideal for surface mount applications in various electronic circuits due to its compact size and high temperature rating.
Dc Components
Onsemi
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Finish: Matte Tin (Sn) - annealed;
Lite-on Semiconductor
BSS138-TP
Micro Commercial Components
BSS138-TP by Micro Commercial Components is a N-channel small signal FET with a min DS breakdown voltage of 50V and max drain current of 0.22A. It is commonly used in applications requiring enhancement mode operation, such as power management and switching circuits.
2N7002
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Style (Meter): SMALL OUTLINE; Terminal Position: DUAL;
FDLL4148
FDLL4148 by Onsemi is a single rectifier diode with a max reverse recovery time of 0.004 us. With a max forward voltage of 1V and output current of 0.2A, it is ideal for applications requiring fast switching speeds in electronic circuits. The diode's glass package body material and isolated case connection make it suitable for surface mount designs operating at temperatures up to 175°C.
Rectron
Capar Components
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Forward Voltage (VF): 1 V; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Output Current: .15 A;
LL4148
Leshan Radio
RECTIFIER DIODE; Surface Mount: YES; Maximum Non Repetitive Peak Forward Current: 2 A; Maximum Reverse Recovery Time: .004 us; No. of Phases: 1; Maximum Operating Temperature: 175 Cel;
SMBJ18CA
Sangdest Microelectronics (Nanjing)
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138LT1G
BSS138LT1G by Onsemi is a N-CHANNEL FET with 50V DS Breakdown Voltage, 0.2A Drain Current, and 3.5 ohm On Resistance. Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and built-in DIODE. Operates b/w -55 to 150 °C with small outline package style for surface mount assembly.
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
AR0238CSSC12SHRA0-DR1
Onsemi's AR0238CSSC12SHRA0-DR1 is a 3x3 um CMOS image sensor with 1928H x 1088V pixels. It operates at 48 MHz master clock, offers a dynamic range of 96 dB, and supports a frame rate of 60 fps. Ideal for applications requiring high-resolution imaging in automotive, surveillance, and industrial sectors.
KLI-2104-DAA-ED-AE
The Onsemi KLI-2104-DAA-ED-AE is a CCD image sensor with 14x7 um pixel size, offering a dynamic range of 80 dB. Housed in ceramic, it operates b/w -25 to 80 °C and features through-hole mounting. Ideal for applications requiring high-quality linear array imaging with precise solder terminations.
MT9M413C36STC
The Onsemi MT9M413C36STC is a CMOS image sensor with 12x12 um pixel size, 1280H x 1024V resolution, and 66 MHz master clock. It operates at a voltage range of 3-3.6V, with a max current of 165mA. Ideal for high-speed imaging applications requiring digital output in industrial settings.
OVM9724-RADA
Omnivision Technologies
Omnivision Technologies' OVM9724-RADA is a CMOS image sensor with 1.4X1.4 um pixel size and 70.4 dB dynamic range. It operates b/w -30 to 70 °C, offering 30 fps frame rate for applications requiring high sensitivity at 0.74 V/lx.s, such as surveillance cameras and automotive vision systems.
KAI-2020-ABA-CR-AE
KAI-2020-ABA-CR-AE by Onsemi is an image sensor with 7.4x7.4 um pixel size, 1600 horizontal pixels, and 1200 vertical pixels. It has a dynamic range of 60 dB and outputs analog voltage at a data rate of 40 Mbps. This rectangular CCD sensor is ideal for applications requiring high-resolution imaging in industrial or scientific settings.
AS0142ATSC00XUSM0-TRBR-E
AS0142ATSC00XUSM0-TRBR-E by Onsemi is a 3x3 um CMOS image sensor with 1280H x 800V pixels, offering a dynamic range of 93 dB. Operating at -40 to 105 °C, it has a digital voltage output interface and supports a frame rate of 60 fps. Ideal for applications requiring high-quality imaging in compact devices.
LM9618IEA
LM9618IEA by National Semiconductor is a 7.5x7.5 um CMOS image sensor with 664H x 504V pixels, operating at -40 to 85°C. It has a digital output via I2C interface, and offers sensitivity of 5 V/lx.s. Ideal for full-frame applications requiring a max supply voltage of 3.63V and min of 2.97V in a ceramic-metal sealed co-fired housing.
AR0144ATSM20XUEA0-DPBR
Onsemi's AR0144ATSM20XUEA0-DPBR is a 1/4 inch CMOS image sensor with 1280x800 resolution, 3x3 um pixel size, and 60 fps frame rate. Ideal for surface mount applications, it features a square package style and solder termination type. Perfect for high-quality imaging in compact devices.
KAI-2020-AAA-CR-BA
The Onsemi KAI-2020-AAA-CR-BA is an image sensor with 7.4x7.4 um pixel size, 1600 horizontal pixels, and 1200 vertical pixels. It operates at a max supply voltage of 15.5V and min supply voltage of 14.5V, providing a dynamic range of 60 dB. This rectangular CCD sensor with analog voltage output is ideal for applications requiring high-resolution imaging in industrial or scientific settings.
NOIP1SN010KA-GDI
IMAGE SENSOR,CMOS;
VG6640CB1M
STMicroelectronics
STMicroelectronics VG6640CB1M is a 3.75X3.75 um CMOS image sensor with 132 dB dynamic range and 60 fps frame rate. It operates b/w -40 to 125 °C, suitable for surface mount applications in devices requiring high-quality imaging capabilities.
AR0135CS2C00SUD20
The Onsemi AR0135CS2C00SUD20 is a 1/3 inch CMOS image sensor with 1280x960 resolution. It operates at -30 to 70 °C, with a pixel size of 3.75μm and a max supply voltage of 1.95V. Ideal for applications requiring high-resolution imaging in varying temperature conditions.
KAI-16050-AXA-JD-B1
Onsemi's KAI-16050-AXA-JD-B1 is a 5.5X5.5 um pixel size CCD image sensor with 4896 horizontal and 3264 vertical pixels. It operates at temperatures from -50 to 70 °C, with a dynamic range of 64 dB. Ideal for applications requiring high-resolution imaging in various environments.
AMIS-710200
Image Sensors; Horizontal Pixel: 1728; Minimum Operating Temperature: 0 Cel; Vertical Pixel: 1; Maximum Operating Temperature: 50 Cel; Power Supplies (V): 5;
KAI-1003-AAA-CR-AE
KAI-1003-AAA-CR-AE by Onsemi is an image sensor with 1024x1024 pixels, 12.8um pixel size, and 72dB dynamic range. It operates b/w 0 to 40 °C, suitable for industrial imaging applications requiring high-resolution and sensitivity. The rectangular CCD sensor has a ceramic housing and through-hole mounting feature for robust performance.
MT9M034I12STC-DPBR1
MT9M034I12STC-DPBR1 by Onsemi is an image sensor with 1280x960 resolution, 3.75um pixel size, and 115dB dynamic range. It operates at -30 to 70°C, with a supply voltage of 1.7-1.95V, making it ideal for high-quality digital imaging applications requiring precise color reproduction and low-light performance.
MT9M001C12STC-TP
The Onsemi MT9M001C12STC-TP is a CMOS image sensor with 1280x1024 pixels, 5.2um pixel size, and 48MHz master clock. It operates at temperatures from 0 to 70°C and has a dynamic range of 68.2dB. Ideal for digital imaging applications requiring high-resolution and fast frame rates.
NOIP1SN0480A-STI
NOIP1SN0480A-STI by Onsemi features 4.80X4.80 um pixel size, 68 MHz master clock, and 808 (H) x 608 (V) resolution. This image sensor is ideal for applications requiring high-speed imaging with a frame rate of up to 120 fps in a compact surface-mount package.
AR0521SR2C09SURA0-DP1
Onsemi's AR0521SR2C09SURA0-DP1 is a 12x12x1.62mm CMOS image sensor with 2592x1944 resolution, 1/2.5" optical format, and 60fps frame rate. It features a square package style, solder termination, and 2-wire interface for surface mount applications in various imaging devices.
KAI-43140-FXA-JD-AE
KAI-43140-FXA-JD-AE by Onsemi is an image sensor with 4.5x4.5 um pixel size, 8040 horizontal pixels, and 5360 vertical pixels. It operates b/w -50 to 70 °C with a dynamic range of 60 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
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MT9P031I12STM-DP1
MT9P031I12STM-DP1 by Onsemi is a 2.2x2.2 um CMOS image sensor with 2592x1944 pixels, 96 MHz master clock, and 70.1 dB dynamic range. Ideal for applications requiring high-resolution imaging at frame rates up to 14 fps in a compact square package suitable for surface mounting.
MT9P031I12STM-DP
Onsemi's MT9P031I12STM-DP is a 2.2x2.2um CMOS image sensor with 2592Hx1944V pixels, offering a dynamic range of 70.1dB and operating at temperatures from -30 to 70°C. It has a digital voltage output interface, operates on 1.7-1.9V supply voltage, and is suitable for frame array applications in various industries like surveillance and automotive systems.
MT9P031I12STC-DP
MT9P031I12STC-DP by Onsemi is an image sensor with 2.2x2.2 um pixel size, 96 MHz master clock, and 70.1 dB dynamic range. Ideal for applications requiring a square CMOS image sensor with a digital voltage output interface and frame array type at temperatures ranging from -30 to 70 °C.
MT9P031I12STM-DR1
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.35-2.30V; Minimum Operating Temperature: -30 Cel;
MT9P031I12STC-DR1
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.60-2.30V; Master Clock: 96 MHz;
MT9P031I12STM
Aptina
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.60-2.30V; Array Type: FULL FRAME;
MT9P031I12STC-DR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.60-2.30V; Maximum Supply Voltage: 1.9 V;
MT9P031I12STM-TP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.16-1.82V; Horizontal Pixel: 2592;
MT9P031I12STC-TP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.60-2.30V; Pixel Size (um): 2.2X2.2;
MT9P031I12STM-DR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.35-2.30V; Horizontal Pixel: 2592;
MT9P031I12STC
Micron Technology
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Additional Features: ELECTRONIC ROLLING SHUTTER, GLOBAL RESET RELEASE, IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 2.6-3.1V; Horizontal Pixel: 2592; Output Interface Type: 2-WIRE INTERFACE;
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.60-2.30V; Body Height: 1.25 mm;
MT9P001I12STC-B-DR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL CURRENT; Output Range: 2.60-22.30mA; Maximum Operating Current: 35 mA; Pixel Size (um): 2.20X2.20;
MT9P006I12STCU-DP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.16-1.82V; Termination Type: SOLDER;
MT9P001I12-N4005-DR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL CURRENT; Output Range: 2.60-22.30mA; Master Clock: 48 MHz; Array Type: FRAME;
MT9P011D00STC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: UNSPECIFIED; Maximum Supply Voltage: 1.9 V; Vertical Pixel: 1944;
MT9P031D00STMC18BC1-200
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Output Range: 0.35-2.30V; Array Type: FRAME; Maximum Supply Voltage: 1.9 V;
MT9P014D00STC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: UNSPECIFIED; Optical Format (inch): 1/2.5; Frame Rate: 15 fps;
MT9P006I12STCU
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.16-1.82V; Minimum Supply Voltage: 1.7 V;
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