Loading...

MT9P006I12STCU

Onsemi

MT9P006I12STCU by Onsemi

The Onsemi MT9P006I12STCU image sensor features 2.2x2.2 um pixel size, 27 MHz master clock, and 2592 horizontal pixels. Ideal for applications requiring a digital voltage output interface, such as surveillance cameras and industrial imaging systems.

Median Price

$8.000

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,216 parts In-Stock

1+ parts

$8.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,216

$8.000

-

-

-

Digiode

USA . 852 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

852

-

-

-

-

NexGen Digital

USA . 9 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 7,902 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,902

-

-

-

-

TANS Electronics

Latvia . 6,287 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,287

-

-

-

-

Kulean Microsystems

USA . 4,743 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,743

-

-

-

-

SupplyDigital Components

Austria . 3,407 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,407

-

-

-

-

Perfect Parts

USA . 2,626 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,626

-

-

-

-

Corphita

USA . 1,301 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,301

-

-

-

-

UHIMA Technologies

Türkiye . 244 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

244

-

-

-

-

Corohmni

South Africa . 182 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

182

-

-

-

-

Kepictronics

USA . 91 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

91

-

-

-

-

Overview

Capture every moment in stunning clarity with the MT9P006I12STCU Image Sensor by Onsemi. Renowned for their exceptional quality and reliability, Onsemi delivers cutting-edge technology that is perfect for a wide range of applications. Whether you're looking to enhance your security system, upgrade your smartphone camera, or revolutionize your medical imaging equipment, this image sensor offers unmatched value, benefits, and advantages. Trust Onsemi to provide the best in image sensor technology and take your projects to the next level.

Feature Benefit Bullets

Pixel Size (um): 2.2X2.2

Smaller pixel size allows for higher resolution images with more detail and clarity.

Maximum Supply Voltage: 1.9 V

Higher maximum supply voltage ensures stable and efficient performance of the image sensor.

Master Clock: 27 MHz

High master clock frequency enables fast data processing and image capturing.

Body Width: 10 inch

Compact body width allows for easy integration into various devices and systems.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors offer low power consumption and high image quality, making them ideal for a wide range of applications.

Body Height: 1.25 mm

Low body height enables slim and sleek design possibilities for devices equipped with this image sensor.

Package Shape or Style: SQUARE

Square package shape provides uniform dimensions for easy mounting and alignment in electronic devices.

Minimum Supply Voltage: 1.7 V

Low minimum supply voltage ensures energy efficiency and extends the battery life of devices using this image sensor.

Maximum Operating Temperature: 70 °C

High maximum operating temperature range ensures reliable performance even in extreme environmental conditions.

Horizontal Pixel: 2592

High horizontal pixel count allows for detailed and high-resolution images with crisp image quality.

Output Range: 0.16-1.82V

Wide output range provides flexibility in signal processing and compatibility with various signal processing circuits.

Output Type: DIGITAL VOLTAGE

Digital voltage output simplifies signal processing and data transmission for efficient operation.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature ensures reliable performance even in cold conditions.

Maximum Operating Current: 35 mA

Low maximum operating current helps reduce power consumption and heat generation for improved energy efficiency.

Dynamic Range: 67.74 dB

High dynamic range allows for capturing both bright and dark areas in an image with details and clarity.

Vertical Pixel: 1944

High vertical pixel count contributes to the overall image resolution and quality for capturing detailed images.

Body Length/Diameter: 10 mm

Compact body length/diameter facilitates space-saving design solutions in devices equipped with this image sensor.

Optical Format (inch): 1/2.5

Standard optical format for compatibility with various lenses and optical systems for enhanced imaging capabilities.

Termination Type: SOLDER

Solder termination provides secure and reliable electrical connections for stable performance and durability.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies communication and data transfer between the image sensor and external devices.

Frame Rate: 15 fps

Frame rate of 15 frames per second allows for smooth and real-time image capture for various applications.

Array Type: SINGLE FRAME

Single frame array design simplifies the image capturing process and reduces complexity in image processing.

Mounting Feature: SURFACE MOUNT

Surface mounting feature allows for easy and secure attachment to PCBs or other surfaces for quick installation.

Technical Specifications

Image Sensors MT9P006I12STCU attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER, IT ALSO OPERATES AT 2.60-3.10 V ANALOG SUPPLY VOLATGE

Array Type:

SINGLE FRAME

Body Width:

10 inch

Body Height:

1.25 mm

Body Length/Diameter:

10 mm

Dynamic Range:

67.74 dB

Frame Rate:

15 fps

Horizontal Pixel:

2592

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

35 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/2.5

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

2.2X2.2

Sensors or Transducers Type:

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Termination Type:

SOLDER

Vertical Pixel:

1944

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19