Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MT9P031I12STC-DP by Onsemi is an image sensor with 2.2x2.2 um pixel size, 96 MHz master clock, and 70.1 dB dynamic range. Ideal for applications requiring a square CMOS image sensor with a digital voltage output interface and frame array type at temperatures ranging from -30 to 70 °C.
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2.2X2.2 - Small pixel size allows for high resolution images to be captured, making this sensor suitable for applications requiring detailed image quality.
1.9 V - Operating within a low maximum supply voltage range helps in reducing power consumption, making this sensor energy-efficient.
96 MHz - The high master clock frequency enables fast image processing and data transfer, making this sensor ideal for real-time imaging applications.
10 inch - The compact body width of the sensor allows for easy integration into various devices and systems, offering flexibility in design.
IMAGE SENSOR,CMOS - Being a CMOS image sensor, it provides low noise operation and high sensitivity, ensuring high-quality images in various lighting conditions.
1.25 mm - The slim body height of the sensor makes it suitable for applications where thin profile devices are required.
SQUARE - The square package shape provides a symmetrical layout for easy mounting and alignment in devices, ensuring a stable and secure fit.
1.7 V - Operating at a low minimum supply voltage ensures compatibility with a wide range of power sources, enhancing the sensor's versatility.
70 °C - With a high maximum operating temperature range, this sensor can withstand harsh environmental conditions, making it reliable for outdoor use.
2592 - The high horizontal pixel count allows for detailed and sharp image capture, making this sensor suitable for high-resolution imaging applications.
0.60-2.30V - The wide output range provides flexibility in signal processing and compatibility with various types of systems, enhancing the sensor's usability.
DIGITAL VOLTAGE - The digital voltage output simplifies signal processing and integration with digital systems, making this sensor easy to use and interface with other components.
30 °C - Operating at a low minimum temperature range ensures reliable performance in cold environments, making this sensor suitable for outdoor and industrial applications.
35 mA - With a low maximum operating current, this sensor consumes minimal power, contributing to energy efficiency and prolonged battery life.
70.1 dB - The high dynamic range allows for capturing images with a wide range of brightness levels, ensuring accurate and detailed image reproduction.
1944 - The high vertical pixel count complements the horizontal resolution, enabling the sensor to capture high-quality images with excellent clarity and sharpness.
10 mm - The compact body length/diameter size of the sensor contributes to its versatility and ease of integration into various devices and systems.
1/2.5 - The optical format specification provides compatibility with a wide range of lenses, offering flexibility in choosing optics for different imaging needs.
SOLDER - The solder termination type enables secure and reliable connections, ensuring stable operation and durability in various environmental conditions.
2-WIRE INTERFACE - The 2-wire interface simplifies communication and connectivity with external systems, making this sensor easy to integrate into existing setups.
14 fps - With a moderate frame rate, this sensor is suitable for applications requiring real-time or near-real-time imaging capabilities.
FRAME - The frame array type facilitates simultaneous capture of multiple pixels, enabling fast and efficient image processing, making this sensor suitable for dynamic imaging applications.
SURFACE MOUNT - The surface mounting feature allows for easy and secure installation on PCBs, ensuring stable operation and reliability in various applications.
Image Sensors MT9P031I12STC-DP attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Height:
Body Length/Diameter:
Dynamic Range:
Frame Rate:
Horizontal Pixel:
Master Clock:
Mounting Feature:
Maximum Operating Current:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optical Format (inch):
Output Interface Type:
Output Range:
Output Type:
Package Shape or Style:
Pixel Size (um):
Sensors or Transducers Type:
Maximum Supply Voltage:
Minimum Supply Voltage:
Termination Type:
Vertical Pixel:
PCN Obsolescence/ EOL - Mult Dev EOL 30/Sep/2022
PCN Design/Specification - Mult Dev 10/Feb/2023
PCN Assembly/Origin - AR013xCS/AR02x/ASX350/MT9P 30/Jun/2022
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
1N4148
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
MBRS340T3G
Onsemi
MBRS340T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 4A. It operates b/w -65°C to 150°C, making it suitable for various applications requiring high-speed switching and low power loss in a small outline package. The diode's matte tin terminal finish and dual position make it ideal for surface mount PCB designs.
LM358N
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
M24308/2-1F
Defense Logistics Agency
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Type: CABLE AND PANEL; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Empty Shell: NO;
BSS138
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 240;
LL4148
Panjit International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SMBJ18CA
Alpha & Omega Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803A
STMicroelectronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; No. of Elements: 8; Minimum DC Current Gain (hFE): 1000;
SS14
Jinan Jingheng Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Frontier Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138K-13
Diodes Incorporated
BSS138K-13 by Diodes Inc. is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, operating in enhancement mode. With 3 terminals and 0.31A max drain current, it offers high performance in small outline package style.
BSS123NH6327XTSA1
Infineon Technologies
Infineon BSS123NH6327XTSA1 is a N-CHANNEL FET with 100V DS breakdown voltage, 0.19A ID, and 6 ohm RDS(on). Ideal for small outline applications requiring high drain current and low on-resistance. AEC-Q101 compliant for automotive use.
2N2222A
SPC TECHNOLOGY/ MULTICOMP
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Taitron Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
1N4148W-T
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Inter F E T
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 7.5 ohm; Maximum Drain Current (Abs) (ID): .115 A;
LM555CN
Texas Instruments
LM555CN by Texas Instruments is an Analog Waveform Generation IC with a supply voltage range of 4.5V to 16V. It operates b/w 0°C to 70°C, making it suitable for commercial applications. This rectangular package IC has dual terminals and uses bipolar technology for pulse generation in various electronic circuits.
International Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
Good-ark Electronics
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V; No. of Phases: 1;
AR0220AT3B00XUEA0-DPBR
The Onsemi AR0220AT3B00XUEA0-DPBR is an image sensor with 1828x948 pixels, offering a dynamic range of 120 dB. It operates at temperatures from -40 to 105 °C and has a max supply voltage of 1.26V. Ideal for applications requiring high-resolution imaging in varying environmental conditions.
NOIP1FN012KA-GTI
NOIP1FN012KA-GTI by Onsemi is a 4.5x4.5 um CMOS image sensor with 4096x3072 resolution, 59 dB dynamic range, and 160 fps frame rate. It operates b/w -40 to 85 °C and has a supply voltage range of 1.7-1.9 V. Ideal for high-speed imaging applications in industrial automation and surveillance systems due to its high sensitivity and fast frame rate capabilities.
MT9M032C12STMU
The Onsemi MT9M032C12STMU is an image sensor with 2.20x2.20 um pixel size, 49.5 MHz master clock, and 70.1 dB dynamic range. Ideal for applications requiring high-resolution imaging such as surveillance cameras, industrial inspection systems, and medical devices due to its high-quality digital voltage output interface and frame rate of 60 fps.
KAI-04070-PBA-JD-AE
The Onsemi KAI-04070-PBA-JD-AE is a 7.4x7.4 um CCD image sensor with 2048x2048 pixels, offering an optical format of 4/3 inch and a dynamic range of 82 dB. It features an interline array type, solder termination, and through-hole mounting, suitable for high-resolution imaging applications in various industries.
AR0233AT2B17XUEA0-DRBR-E
Onsemi's AR0233AT2B17XUEA0-DRBR-E is a CMOS image sensor with 2048x1280 resolution, 41.58 dB dynamic range, and MIPI output interface. Ideal for applications requiring high-quality imaging at 60 fps, such as surveillance cameras and automotive vision systems.
MT9V128IA3XTC-TP
MT9V128IA3XTC-TP by Onsemi is a 5.6x5.6 um CMOS image sensor with 680H x 512V pixels, offering a dynamic range of 74.8 dB and operating at up to 105°C. Ideal for applications requiring a digital voltage output interface, such as frame arrays in surveillance cameras or industrial imaging systems.
AR0431CSSC14SMRA0-DP
Onsemi's AR0431CSSC14SMRA0-DP is a 10.16mm x 10.16mm CMOS image sensor with 2312x1746 resolution, offering high-quality imaging for applications like surveillance cameras and automotive vision systems at a frame rate of 120 fps.
KAF-40000-CXA-JD-AE
The Onsemi KAF-40000-CXA-JD-AE is a CCD image sensor with 6x6 um pixel size, 7304 horizontal pixels, and 5478 vertical pixels. It operates b/w 0-60 °C with a dynamic range of 70.2 dB. Ideal for high-resolution imaging applications requiring precise color reproduction and low light sensitivity.
MT9D115W00STCK25AC1-750
MT9D115W00STCK25AC1-750 by Onsemi is an image sensor with 1.75um pixel size, 1600x1200 resolution, and 85MHz master clock. Ideal for digital cameras, surveillance systems, and industrial imaging applications due to its high dynamic range and frame rate of 15fps.
KAI-2093-CBA-CB-BA
KAI-2093-CBA-CB-BA by Onsemi is an image sensor with 7.4x7.4 um pixel size, 1920x1080 resolution, and 60 dB dynamic range. It is ideal for applications requiring high-quality imaging such as surveillance cameras, industrial inspection systems, and medical imaging devices.
KAI-29052-FXA-JD-B2
Onsemi's KAI-29052-FXA-JD-B2 is a 5.5X5.5 um pixel size CCD image sensor with 6576H x 4384V resolution, offering a dynamic range of 66 dB. It operates b/w -50 to 70 °C and has a max supply voltage of 15.5 V, making it suitable for applications requiring high-quality imaging in various lighting conditions.
AMIS-710208-A7
Image Sensors; Vertical Pixel: 1; Minimum Operating Temperature: 0 Cel; Horizontal Pixel: 704; Power Supplies (V): 5; Maximum Operating Temperature: 50 Cel;
KAI-2001-ABA-CD-AE
KAI-2001-ABA-CD-AE by Onsemi is an image sensor with 7.4um pixel size, 1600H x 1200V resolution, and 60dB dynamic range. It operates at supply voltages b/w 14.5V to 15.5V and outputs analog voltage signals. Ideal for applications requiring high-quality imaging in a compact form factor.
AR0237SRSC12SHRA0-DR
Onsemi's AR0237SRSC12SHRA0-DR is a 1/2.7 inch CMOS image sensor with 1928x1088 pixels, offering 60 fps frame rate. Housed in a square plastic package, it features a 2-wire interface for surface mount applications in various imaging devices.
TCD1304DG
Toshiba
Toshiba TCD1304DG is an 8x200 um image sensor with a 2 MHz master clock, ideal for applications requiring high sensitivity (160 V/lx.s) and a wide dynamic range (49.54 dB). With a spectral response of 400-1200 nm, this CCD sensor operates at temperatures from -25 to 60 °C, making it suitable for various imaging solutions.
KAI-1020-ABB-JP-AE
KAI-1020-ABB-JP-AE by Onsemi is an image sensor with 7.4x7.4 um pixel size, 1000x1000 resolution, and 60 dB dynamic range. It operates at a supply voltage range of 14.5V to 15.5V and has a data rate of 40 Mbps. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
KAE-02152-FBB-SD-EE
KAE-02152-FBB-SD-EE by Onsemi is a 2/3 inch CCD image sensor with 1920x1080 pixels, 5.5um pixel size, and 86dB dynamic range. Ideal for applications requiring high-quality imaging in industrial cameras, surveillance systems, and medical devices.
MT9M131C12STC-MI-DR
MT9M131C12STC-MI-DR by Onsemi is an image sensor with 1280x1024 resolution, 3.6um pixel size, and 54MHz master clock. Ideal for digital cameras, surveillance systems, and industrial imaging applications due to its high sensitivity (1V/lx.s), wide dynamic range (71dB), and compact square package design.
MT9V032
The Onsemi MT9V032 is a CMOS image sensor with 6x6 um pixel size, 752H x 480V resolution, and 100 dB dynamic range. Operating at temperatures from -30 to 70 °C, it has a max supply voltage of 3.6 V and supports a master clock of 26 MHz. Ideal for applications requiring high-quality imaging at up to 60 fps frame rate.
AR0238CSSC12SHRA0-DR1
Onsemi's AR0238CSSC12SHRA0-DR1 is a 3x3 um CMOS image sensor with 1928H x 1088V pixels. It operates at 48 MHz master clock, offers a dynamic range of 96 dB, and supports a frame rate of 60 fps. Ideal for applications requiring high-resolution imaging in automotive, surveillance, and industrial sectors.
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MT9P031I12STM-DP1
MT9P031I12STM-DP1 by Onsemi is a 2.2x2.2 um CMOS image sensor with 2592x1944 pixels, 96 MHz master clock, and 70.1 dB dynamic range. Ideal for applications requiring high-resolution imaging at frame rates up to 14 fps in a compact square package suitable for surface mounting.
MT9P031I12STM-DP
Onsemi's MT9P031I12STM-DP is a 2.2x2.2um CMOS image sensor with 2592Hx1944V pixels, offering a dynamic range of 70.1dB and operating at temperatures from -30 to 70°C. It has a digital voltage output interface, operates on 1.7-1.9V supply voltage, and is suitable for frame array applications in various industries like surveillance and automotive systems.
MT9P031I12STM-DR1
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.35-2.30V; Minimum Operating Temperature: -30 Cel;
MT9P031I12STC-DR1
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.60-2.30V; Master Clock: 96 MHz;
MT9P031I12STM
Aptina
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.60-2.30V; Array Type: FULL FRAME;
MT9P031I12STC-DR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.60-2.30V; Maximum Supply Voltage: 1.9 V;
MT9P031I12STM-TP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.16-1.82V; Horizontal Pixel: 2592;
MT9P031I12STC-TP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.60-2.30V; Pixel Size (um): 2.2X2.2;
MT9P031I12STM-DR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.35-2.30V; Horizontal Pixel: 2592;
MT9P031I12STC
Micron Technology
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Additional Features: ELECTRONIC ROLLING SHUTTER, GLOBAL RESET RELEASE, IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 2.6-3.1V; Horizontal Pixel: 2592; Output Interface Type: 2-WIRE INTERFACE;
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.60-2.30V; Body Height: 1.25 mm;
MT9P001I12STC-B-DR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL CURRENT; Output Range: 2.60-22.30mA; Maximum Operating Current: 35 mA; Pixel Size (um): 2.20X2.20;
MT9P006I12STCU-DP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.16-1.82V; Termination Type: SOLDER;
MT9P001I12-N4005-DR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL CURRENT; Output Range: 2.60-22.30mA; Master Clock: 48 MHz; Array Type: FRAME;
MT9P011D00STC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: UNSPECIFIED; Maximum Supply Voltage: 1.9 V; Vertical Pixel: 1944;
MT9P031D00STMC18BC1-200
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Output Range: 0.35-2.30V; Array Type: FRAME; Maximum Supply Voltage: 1.9 V;
MT9P014D00STC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: UNSPECIFIED; Optical Format (inch): 1/2.5; Frame Rate: 15 fps;
MT9P006I12STCU
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.16-1.82V; Minimum Supply Voltage: 1.7 V;
MT9P031I12STCES
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.35-1.3V; Vertical Pixel: 1944;
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