Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MT9P031I12STC-DP by Onsemi is an image sensor with 2.2x2.2 um pixel size, 96 MHz master clock, and 70.1 dB dynamic range. Ideal for applications requiring a square CMOS image sensor with a digital voltage output interface and frame array type at temperatures ranging from -30 to 70 °C.
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2.2X2.2 - Small pixel size allows for high resolution images to be captured, making this sensor suitable for applications requiring detailed image quality.
1.9 V - Operating within a low maximum supply voltage range helps in reducing power consumption, making this sensor energy-efficient.
96 MHz - The high master clock frequency enables fast image processing and data transfer, making this sensor ideal for real-time imaging applications.
10 inch - The compact body width of the sensor allows for easy integration into various devices and systems, offering flexibility in design.
IMAGE SENSOR,CMOS - Being a CMOS image sensor, it provides low noise operation and high sensitivity, ensuring high-quality images in various lighting conditions.
1.25 mm - The slim body height of the sensor makes it suitable for applications where thin profile devices are required.
SQUARE - The square package shape provides a symmetrical layout for easy mounting and alignment in devices, ensuring a stable and secure fit.
1.7 V - Operating at a low minimum supply voltage ensures compatibility with a wide range of power sources, enhancing the sensor's versatility.
70 °C - With a high maximum operating temperature range, this sensor can withstand harsh environmental conditions, making it reliable for outdoor use.
2592 - The high horizontal pixel count allows for detailed and sharp image capture, making this sensor suitable for high-resolution imaging applications.
0.60-2.30V - The wide output range provides flexibility in signal processing and compatibility with various types of systems, enhancing the sensor's usability.
DIGITAL VOLTAGE - The digital voltage output simplifies signal processing and integration with digital systems, making this sensor easy to use and interface with other components.
30 °C - Operating at a low minimum temperature range ensures reliable performance in cold environments, making this sensor suitable for outdoor and industrial applications.
35 mA - With a low maximum operating current, this sensor consumes minimal power, contributing to energy efficiency and prolonged battery life.
70.1 dB - The high dynamic range allows for capturing images with a wide range of brightness levels, ensuring accurate and detailed image reproduction.
1944 - The high vertical pixel count complements the horizontal resolution, enabling the sensor to capture high-quality images with excellent clarity and sharpness.
10 mm - The compact body length/diameter size of the sensor contributes to its versatility and ease of integration into various devices and systems.
1/2.5 - The optical format specification provides compatibility with a wide range of lenses, offering flexibility in choosing optics for different imaging needs.
SOLDER - The solder termination type enables secure and reliable connections, ensuring stable operation and durability in various environmental conditions.
2-WIRE INTERFACE - The 2-wire interface simplifies communication and connectivity with external systems, making this sensor easy to integrate into existing setups.
14 fps - With a moderate frame rate, this sensor is suitable for applications requiring real-time or near-real-time imaging capabilities.
FRAME - The frame array type facilitates simultaneous capture of multiple pixels, enabling fast and efficient image processing, making this sensor suitable for dynamic imaging applications.
SURFACE MOUNT - The surface mounting feature allows for easy and secure installation on PCBs, ensuring stable operation and reliability in various applications.
Image Sensors MT9P031I12STC-DP attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Height:
Body Length/Diameter:
Dynamic Range:
Frame Rate:
Horizontal Pixel:
Master Clock:
Mounting Feature:
Maximum Operating Current:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optical Format (inch):
Output Interface Type:
Output Range:
Output Type:
Package Shape or Style:
Pixel Size (um):
Sensors or Transducers Type:
Maximum Supply Voltage:
Minimum Supply Voltage:
Termination Type:
Vertical Pixel:
PCN Obsolescence/ EOL - Mult Dev EOL 30/Sep/2022
PCN Design/Specification - Mult Dev 10/Feb/2023
PCN Assembly/Origin - AR013xCS/AR02x/ASX350/MT9P 30/Jun/2022
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
2N7002
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; No. of Elements: 1; Transistor Application: SWITCHING;
LM555CM
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Secos
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .3 W; Maximum Drain Current (ID): .115 A; Maximum Drain-Source On Resistance: 7.5 ohm;
2N2222A
Shanghai Lunsure Electronic Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
BAV99
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-PSFM-T3; Adjustability: ADJUSTABLE; Package Equivalence Code: SIP3,.1TB;
Samsung
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel; Maximum Line Regulation (%/V): .07;
M39029/56-351
Defense Logistics Agency
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Mating Contacts: M39029/58-363; Removal Tool Sources: MILITARY; Alternate Contact Sources: MILITARY;
TM4C1294NCPDTI3
Texas Instruments
TM4C1294NCPDTI3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 8KB data EEPROM, 20-Ch 12-Bit ADC channels, and 32 DMA channels. Ideal for industrial applications requiring high-speed processing, it offers connectivity options like CAN, Ethernet, I2C, SPI, UART, and USB.
SS495ASP
Micro Switch
The Micro Switch SS495ASP is an analog circuit IC with a supply voltage range of 4.5V to 10.5V, suitable for automotive applications. Its package body material is plastic/epoxy, and it has a rectangular shape with three terminals. Operating temperature ranges from -40°C to 125°C, making it ideal for various automotive sensor and control systems.
1N4148
Panjit International
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Rfe International
Itt Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Package Shape: RECTANGULAR;
MMBF170LT1G
Rochester Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;
M85049/85-08W02
Glenair
CONNECTOR ACCESSORY; MIL Conformity: YES; Material: ALUMINIUM ALLOY; Associated Backshell Military - Specifications: MIL-DTL-38999; Shell Sizes: 08; DIN Conformity: NO;
SS14+
Multicomp Pro
SS14+ by Multicomp Pro is a Schottky rectifier diode with a max output current of 1A and a reverse test voltage of 40V. It is designed for surface mount applications in electronic circuits, offering a small outline package style and dual terminal position. With a temperature range from -65°C to 150°C, it is suitable for various industrial and consumer electronics.
M24308/2-1F
Cristek Interconnects
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; No. of Rows Loaded: 2; Shell Size: 1/E; Filter Feature: NO;
Tyco Electronics Amp
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; IEC Conformity: NO; Mixed Contacts: NO; Empty Shell: NO;
LM358AN
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Diotec Semiconductor Ag
KAI-47051-FXA-JD-B2
The Onsemi KAI-47051-FXA-JD-B2 is an image sensor with 5.5x5.5 um pixel size, 40 MHz master clock, and 66 dB dynamic range. Ideal for applications requiring high-resolution imaging in a compact form factor, such as industrial machine vision systems or medical imaging devices.
MT9M001C12STM-DP
MT9M001C12STM-DP by Onsemi is an image sensor with 5.2x5.2 um pixel size, 48 MHz master clock, and 1280x1024 resolution. Ideal for digital cameras, surveillance systems, and industrial imaging applications due to its high dynamic range of 68.2 dB and frame rate of 30 fps.
OV02720-A50A
Omnivision Technologies
Image Sensors;
KAI-02150-AAA-JP-BA
Onsemi's KAI-02150-AAA-JP-BA is a 2/3 inch CCD image sensor with 1920x1080 pixels, 5.5um pixel size, and 64dB dynamic range. Operating b/w -50 to 70°C, it requires 14.5-15.5V supply voltage and features through-hole mounting. Ideal for high-resolution imaging applications in various industries.
KAE-02152-FBB-SP-EE
Onsemi's KAE-02152-FBB-SP-EE is a 5.5x5.5 um CCD image sensor with 1920x1080 pixels, offering a dynamic range of 86 dB. Ideal for applications requiring high-resolution imaging in industrial and scientific fields due to its rectangular package style and through-hole mounting feature.
KAI-02150-CBA-JD-BA
Truesense Imaging
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Optical Format (inch): 2/3; Pixel Size (um): 5.5X5.5; Additional Features: IT HAS OUTPUT SENSITIVITY OF 34 MICRO VOLT PER ELECTRON;
KAI-08052-ABA-JD-BA
KAI-08052-ABA-JD-BA by Onsemi is an image sensor with 5.5x5.5 um pixel size, 3296 horizontal pixels, and 2472 vertical pixels. It operates b/w -50 to 70 °C and has a dynamic range of 66 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
AR0130CSSC00SPCA0-DPBR2
Onsemi's AR0130CSSC00SPCA0-DPBR2 is a 1/3-inch CMOS image sensor with 1280x960 resolution, 3.75um pixel size, and 50MHz master clock. Ideal for applications requiring high sensitivity (5.6 V/lx.s) and a wide dynamic range of 82dB. Suitable for use in digital cameras, surveillance systems, and automotive imaging.
KAI-1010M
KAI-1010M by Onsemi is an image sensor with 9x9 um pixel size, 1008 horizontal pixels, and 1018 vertical pixels. It operates b/w -50 to 70 °C and has a dynamic range of 60 dB. Ideal for applications requiring high-resolution imaging in industrial automation and surveillance systems.
KAI-2093-ABA-CK-AE
KAI-2093-ABA-CK-AE by Onsemi is an image sensor with 7.4x7.4 um pixel size, 1920x1080 resolution, and 60 dB dynamic range. It is used in applications requiring high-quality imaging such as surveillance cameras, industrial inspection systems, and medical imaging devices.
KAI-16000-AXA-JD-BX
KAI-16000-AXA-JD-BX by Onsemi is an image sensor with 7.4x7.4 um pixel size, 65 dB dynamic range, and 4872 horizontal pixels. It operates b/w -50 to 70 °C and has a data rate of 30 Mbps. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
TC277-10
TC277-10 by Texas Instruments is an image sensor with 699x288 pixels, 9.2x16.8um size, and operates at -30 to 85°C. It requires a 12V power supply and features THROUGH HOLE MOUNTing. Ideal for applications requiring high-resolution imaging in varying temperature environments.
NOIP1SE5000A-LTI
NOIP1SE5000A-LTI by Onsemi is a 4.8x4.8 um CMOS image sensor with 2592H x 2048V pixels, operating at 100 fps with a dynamic range of 60 dB. It has a spectral response of 400-1000 nm and sensitivity of 7.5 V/lx.s, suitable for frame array applications in various industries like surveillance and automotive systems.
AR0431CSSC14SMRA0-DR1
Onsemi's AR0431CSSC14SMRA0-DR1 is a 10.16mm x 10.16mm CMOS image sensor with 2312x1746 resolution, offering 120fps frame rate. Ideal for surface mount applications in devices requiring high-quality imaging capabilities in a compact form factor.
AMIS-710214
Image Sensors; Maximum Operating Temperature: 50 Cel; Minimum Operating Temperature: 0 Cel; Power Supplies (V): 5; Horizontal Pixel: 1728;
KAI-16000-CXA-JD-B2
KAI-16000-CXA-JD-B2 by Onsemi is an image sensor with 7.4x7.4 um pixel size, 4872 horizontal pixels, and 3248 vertical pixels. It operates at a max supply voltage of 15.5 V and has a dynamic range of 65 dB. This rectangular CCD sensor is ideal for applications requiring high-resolution imaging in industrial or scientific settings.
OVM7695-RYEA
IMAGE SENSOR,CMOS;
KAI-43140-FXA-JD-B2
KAI-43140-FXA-JD-B2 by Onsemi is an image sensor with 4.5x4.5 um pixel size, 8040 horizontal pixels, and 5360 vertical pixels. It operates b/w -50 to 70 °C with a dynamic range of 60 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
KAF-8300-AXC-CP-AA
The Onsemi KAF-8300-AXC-CP-AA is an image sensor with 5.4x5.4 um pixel size, offering a dynamic range of 64.4 dB and 3326 horizontal pixels. It operates b/w -10 to 70 °C, making it suitable for high-resolution imaging applications in various industries such as astronomy and microscopy.
NOIP1FN012KA-GTI
NOIP1FN012KA-GTI by Onsemi is a 4.5x4.5 um CMOS image sensor with 4096x3072 resolution, 59 dB dynamic range, and 160 fps frame rate. It operates b/w -40 to 85 °C and has a supply voltage range of 1.7-1.9 V. Ideal for high-speed imaging applications in industrial automation and surveillance systems due to its high sensitivity and fast frame rate capabilities.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
MT9P031I12STM-DP1
MT9P031I12STM-DP1 by Onsemi is a 2.2x2.2 um CMOS image sensor with 2592x1944 pixels, 96 MHz master clock, and 70.1 dB dynamic range. Ideal for applications requiring high-resolution imaging at frame rates up to 14 fps in a compact square package suitable for surface mounting.
MT9P031I12STM-DP
Onsemi's MT9P031I12STM-DP is a 2.2x2.2um CMOS image sensor with 2592Hx1944V pixels, offering a dynamic range of 70.1dB and operating at temperatures from -30 to 70°C. It has a digital voltage output interface, operates on 1.7-1.9V supply voltage, and is suitable for frame array applications in various industries like surveillance and automotive systems.
MT9P031I12STM-DR1
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.35-2.30V; Minimum Operating Temperature: -30 Cel;
MT9P031I12STC-DR1
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.60-2.30V; Master Clock: 96 MHz;
MT9P031I12STM
Aptina
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.60-2.30V; Array Type: FULL FRAME;
MT9P031I12STC-DR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.60-2.30V; Maximum Supply Voltage: 1.9 V;
MT9P031I12STM-TP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.16-1.82V; Horizontal Pixel: 2592;
MT9P031I12STC-TP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.60-2.30V; Pixel Size (um): 2.2X2.2;
MT9P031I12STM-DR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.35-2.30V; Horizontal Pixel: 2592;
MT9P031I12STC
Micron Technology
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Additional Features: ELECTRONIC ROLLING SHUTTER, GLOBAL RESET RELEASE, IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 2.6-3.1V; Horizontal Pixel: 2592; Output Interface Type: 2-WIRE INTERFACE;
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.60-2.30V; Body Height: 1.25 mm;
MT9P001I12STC-B-DR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL CURRENT; Output Range: 2.60-22.30mA; Maximum Operating Current: 35 mA; Pixel Size (um): 2.20X2.20;
MT9P006I12STCU-DP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.16-1.82V; Termination Type: SOLDER;
MT9P001I12-N4005-DR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL CURRENT; Output Range: 2.60-22.30mA; Master Clock: 48 MHz; Array Type: FRAME;
MT9P011D00STC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: UNSPECIFIED; Maximum Supply Voltage: 1.9 V; Vertical Pixel: 1944;
MT9P031D00STMC18BC1-200
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Output Range: 0.35-2.30V; Array Type: FRAME; Maximum Supply Voltage: 1.9 V;
MT9P014D00STC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: UNSPECIFIED; Optical Format (inch): 1/2.5; Frame Rate: 15 fps;
MT9P006I12STCU
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.16-1.82V; Minimum Supply Voltage: 1.7 V;
MT9P031I12STCES
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.35-1.3V; Vertical Pixel: 1944;
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