Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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MT9M034I12STC-DRBR by Onsemi is an image sensor with 1280x960 pixels, 3.75um pixel size, and 115dB dynamic range. It operates at -30 to 70 °C, has a digital current output type, and uses a 2-wire interface. Ideal for applications requiring high-resolution imaging in various lighting conditions.
Median Price
$20.846
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8
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1k+
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1+ parts
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100+ parts
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UHIMA Technologies
Smaller pixel size allows for higher resolution images to be captured with sharp details.
Efficient power usage and lower chance of damage due to overvoltage.
Fast master clock enables quick processing and capturing of images.
Compact and easy to integrate into various devices and systems.
CMOS technology offers high-quality image sensing capabilities with low power consumption.
Operates effectively in low temperature environments without performance degradation.
Easy connectivity options for seamless integration with other components or systems.
Image Sensors MT9M034I12STC-DRBR attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Height:
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Dynamic Range:
Frame Rate:
Horizontal Pixel:
Master Clock:
Mounting Feature:
Maximum Operating Current:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optical Format (inch):
Output Interface Type:
Output Range:
Output Type:
Package Shape or Style:
Pixel Size (um):
Sensors or Transducers Type:
Maximum Supply Voltage:
Minimum Supply Voltage:
Termination Type:
Vertical Pixel:
PCN Obsolescence/ EOL - Mult Dev EOL 29/Mar/2022
PCN Assembly/Origin - Update 05/Nov/2020
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
LL4148
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SMBJ18CA
Onsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Hi-tron Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Baneasa S A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; Qualification: Not Qualified;
1N4148
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
STM32H743BIT6
STMicroelectronics
STM32H743BIT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 208 terminals, and 1085440 bytes of RAM. It features 2 DAC channels, 32 ADC channels, and operates at a max clock frequency of 48 MHz. Ideal for industrial applications requiring high-speed processing and extensive peripheral connectivity.
Weitronic Enterprise
SS14
General Instrument
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Telcom Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; JESD-609 Code: e0;
PAP-06V-S
J S T Mfg
PAP-06V-S by J S T Mfg is a 6-contact BOARD CONNECTOR with 94V-0 UL Flammability Code. It has FEMALE contacts, CRIMP termination, and comes WITH CABLE ASSEMBLY for CABLE mounting applications.
Bytesonic Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Elements: 1;
LM358MX
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
1552200253
Molex
WIRE AND CABLE;
BSS138
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Qualification: Not Qualified;
1N4148WS
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SBAV99LT1G
SBAV99LT1G by Onsemi is a rectifier diode with a max repetitive peak reverse voltage of 100V. It has a small outline package style and a fast max reverse recovery time of 0.006 us. It is commonly used in applications requiring low power dissipation and high operating temperatures.
M39029/56-351
Amphenol
CONNECTOR ACCESSORY; Minimum Operating Temperature: -65 Cel; Additional Features: STANDARD: MIL-DTL-38999; Contact Gender: FEMALE; MIL-Connector Accessory Name: CONTACT; Associated Military - Specifications: MIL-DTL-38999;
LM107H/883C
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Wideband: NO;
SS495A-SP
Honeywell Sensing And Control
SS495A-SP by Honeywell is a magnetic field sensor with 10.5V max supply voltage, 3" body width, and 1.5% linearity. Ideal for applications requiring a Hall effect sensor with -40 to 150°C operating temperature range, such as position sensing in automotive or industrial systems.
C0603X104K5RACAUTO
KEMET Corporation
C0603X104K5RACAUTO by KEMET Corp is a ceramic capacitor with capacitance of 0.1 uF and rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate b/w -55 to 125 °C. This SMT package is commonly used in automotive applications due to its AEC-Q200 reference standard.
MT9V034C12STM
The Onsemi MT9V034C12STM is a 1/3-inch CMOS image sensor with 6x6 um pixel size, offering 752 (H) x 480 (V) resolution and a dynamic range of 110 dB. Operating at temperatures from -30 to 70°C, it has a max supply voltage of 3.6 V and supports a master clock of 27 MHz. Ideal for applications requiring high-quality imaging at up to 60 fps.
AMIS-710256-A6
Image Sensors; Horizontal Pixel: 832; Vertical Pixel: 1; Maximum Operating Temperature: 50 Cel; Minimum Operating Temperature: 0 Cel; Power Supplies (V): 5;
OV06930-A08A
Omnivision Technologies
Image Sensors;
AR0431CSSC14SMRA0-DR1
Onsemi's AR0431CSSC14SMRA0-DR1 is a 10.16mm x 10.16mm CMOS image sensor with 2312x1746 resolution, offering 120fps frame rate. Ideal for surface mount applications in devices requiring high-quality imaging capabilities in a compact form factor.
KAI-01050-ABA-FD-AE
Onsemi's KAI-01050-ABA-FD-AE image sensor features 5.5x5.5 um pixel size, 1024x1024 resolution, and 64 dB dynamic range. Ideal for digital imaging applications, this CCD sensor operates b/w -50 to 70 °C with a supply voltage range of 14.5V to 15.5V.
AR0331SRSC00XUEE0-DPBR
Onsemi's AR0331SRSC00XUEE0-DPBR is a 2.2x2.2 um CMOS image sensor with 2048H x 1536V pixels, offering a dynamic range of 100 dB and operating at temperatures from -30 to 85 °C. It has a digital voltage output interface, operates at a max supply voltage of 1.95V, and features a frame rate of 60 fps. Ideal for applications requiring high-resolution imaging in automotive cameras and surveillance systems.
NOIV2SE1300A-QDC
NOIV2SE1300A-QDC by Onsemi is an image sensor with 1280x1024 resolution, 4.80um pixel size, and 62 MHz master clock. Ideal for applications requiring high-quality imaging at a max supply voltage of 2V, such as surveillance cameras or industrial machine vision systems.
NOIH2SM1000T-HHC
NOIH2SM1000T-HHC by Onsemi is a CMOS image sensor with 1024x1024 pixels, 18x18 um pixel size, and operates at temperatures from -40 to 85 °C. It has a digital voltage output range of 2.20-2.60V and requires a 3.3V power supply. Ideal for applications requiring high-resolution imaging in a compact square ceramic package for surface mount assembly.
KAI-1003-ABA-CD-AE
Onsemi's KAI-1003-ABA-CD-AE is a 12.8X12.8 um CCD image sensor with 1024x1024 pixels, offering a dynamic range of 72 dB. Operating b/w 0 to 40 °C, it has a supply voltage range of 14.5V to 15.5V and comes in a rectangular ceramic housing for industrial imaging applications.
AS0140AT2C00XUSM0-DRBR
AS0140AT2C00XUSM0-DRBR by Onsemi is a 1/4 inch CMOS image sensor with 1280x800 resolution, 3x3 um pixel size, and 27 MHz master clock. Ideal for digital cameras, surveillance systems, and machine vision applications due to its high frame rate of 60 fps and digital voltage output interface.
KAI-43140-AXA-JD-B2
Onsemi's KAI-43140-AXA-JD-B2 is a 4.5x4.5 um CCD image sensor with 8040 (H) x 5360 (V) pixels, offering a dynamic range of 60 dB. Operating at temperatures from -50 to 70 °C, it has a data rate of 60 Mbps and is ideal for high-resolution imaging applications.
MT9P031I12STM-DP
Onsemi's MT9P031I12STM-DP is a 2.2x2.2um CMOS image sensor with 2592Hx1944V pixels, offering a dynamic range of 70.1dB and operating at temperatures from -30 to 70°C. It has a digital voltage output interface, operates on 1.7-1.9V supply voltage, and is suitable for frame array applications in various industries like surveillance and automotive systems.
KAE-02152-FBB-SD-EE
KAE-02152-FBB-SD-EE by Onsemi is a 2/3 inch CCD image sensor with 1920x1080 pixels, 5.5um pixel size, and 86dB dynamic range. Ideal for applications requiring high-quality imaging in industrial cameras, surveillance systems, and medical devices.
KAI-0330-AAA-CP-BA-DUALOUTPUT
KAI-0330-AAA-CP-BA-DUALOUTPUT by Onsemi is an image sensor with 9x9 um pixel size, 648 horizontal pixels, and 484 vertical pixels. It operates at a max supply voltage of 15.5V and min supply voltage of 12V. Ideal for applications requiring high-quality imaging in a compact form factor.
NOIP1SN016KA-GTI
NOIP1SN016KA-GTI by Onsemi is an Image Sensor with 4.5X4.5 um pixel size, 360 MHz master clock, and 4096x4096 resolution. It operates b/w -40 to 85 °C and has a dynamic range of 59 dB. Ideal for high-speed imaging applications requiring precise color reproduction and low-light performance.
CMV4000-3E5C1PP
Ams Ag
CMV4000-3E5C1PP by Ams Ag is a CMOS image sensor with a dynamic range of 60 dB and sensitivity of 5.56 V/lx.s. It operates b/w -30 to 70°C, offers SPI interface, and has a frame rate of 37 fps. Ideal for applications requiring high-quality imaging in varying temperature conditions.
TCD1254GFG(8Z,AA)
Toshiba
Toshiba TCD1254GFG(8Z,AA) Image Sensor features 5.25X64 um pixel size, 1.5-3.0V digital voltage output range, and 52.04 dB dynamic range. Ideal for applications requiring high sensitivity (103 V/lx.s), such as surface mount linear array CCD sensors in imaging systems with spectral response of 400-1100 nm.
KAF-3200E
The Onsemi KAF-3200E is a CCD image sensor with 6.8X6.8 um pixel size, offering 2184 (H) x 1472 (V) resolution and a dynamic range of 77 dB. With spectral response of 350-1100 nm, it operates at supply voltages b/w 14.5 V to 15.25 V, making it ideal for high-resolution imaging applications in various industries.
KAE-02150-ABB-JP-EE
KAE-02150-ABB-JP-EE by Onsemi is an image sensor with 5.5X5.5 um pixel size, 1920x1080 resolution, and 68 dB dynamic range. It operates b/w -70 to 40 °C and is ideal for high-quality imaging applications requiring a max supply voltage of 6V and min of 4.5V.
KAI-16050-AXA-JD-B2
KAI-16050-AXA-JD-B2 by Onsemi is an image sensor with 5.5X5.5 um pixel size, 4896 horizontal pixels, and 3264 vertical pixels. It operates at temperatures from -50 to 70 °C and has a dynamic range of 64 dB. Ideal for applications requiring high-resolution imaging in various environments.
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MT9M001C12STM
The Onsemi MT9M001C12STM image sensor features a pixel size of 5.2x5.2 um, operates at a max supply voltage of 3.6V, and has a master clock of 48 MHz. This CMOS sensor is commonly used in applications requiring high-quality digital imaging with an optical format of 1/2 inch and a frame rate of 30 fps.
Micron Technology
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.20-3.40V; Optical Format (inch): 1/2;
Aptina
IMAGE SENSOR,CMOS; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.20-3.40V; Termination Type: SOLDER; Frame Rate: 30 fps;
MT9M001C12STM-DP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Optical Format (inch): 1/2; Maximum Operating Temperature: 70 Cel;
MT9M001C12STM-TP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Body Width: 14.22 inch; Array Type: FRAME;
MT9M001C12STM-DR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Optical Format (inch): 1/2; Array Type: FRAME;
MT9M001C12STM-DR1
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Minimum Supply Voltage: 3 V; Body Height: 2.21 mm;
MT9M001C12STM-TR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Frame Rate: 30 fps; Array Type: FRAME;
MT9M001C12STC-DR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Body Height: 2.25 mm; Master Clock: 48 MHz;
MT9M001C12STC-TP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Frame Rate: 30 fps; Minimum Operating Temperature: 0 Cel;
MT9M021IA3XTM-DPBR1
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Minimum Operating Temperature: -30 Cel; Sensitivity (V/lx.s): 5.3 V/lx.s;
MT9M021IA3XTM-DPBR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Maximum Operating Current: 55 mA; Master Clock: 50 MHz;
MT9M032C12STMU
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.20-3.05V; Minimum Supply Voltage: 1.7 V;
MT9M034I12STC-DPBR1
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.40-2.50V; Minimum Supply Voltage: 1.7 V;
MT9M034I12STC-DPBR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL CURRENT; Package Shape or Style: SQUARE; Output Range: -22-22mA; Additional Features: DUAL OUTPUT;
MT9M114D00STCZK24BC1-200
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Output Range: 0.45-1.35V; Output Interface Type: 2-WIRE INTERFACE; Additional Features: ELECTRONIC ROLLING SHUTTER, IT ALSO OPERATES AT 2.50-3.10 V ANALOG SUPPLY VOLATGE;
MT9M114EBLSTCZ-CR1
MT9M114EBLSTCZ-CR1 by Onsemi is an image sensor with 1296x976 pixels, 1.90um pixel size, and 70.8dB dynamic range. It operates b/w -30 to 70°C and has a digital voltage output interface. Ideal for applications requiring high-quality imaging in compact devices like smartphones and tablets.
MT9M012D00STM
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -30 Cel; Maximum Operating Temperature: 70 Cel;
MT9M015D00STCC14EC1
IMAGE SENSOR,CMOS; Output Type: DIGITAL CURRENT; Output Range: 2.60-22.30mA; Horizontal Pixel: 1288; Maximum Operating Current: 30 mA; Array Type: FRAME;
MT9M002I12STC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL CURRENT; Package Shape or Style: SQUARE; Output Range: 0.012-0.014mA; Vertical Pixel: 1096;
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