Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Onsemi KAF-50100-CAA-JD-AA is a CCD image sensor with 6x6 um pixel size, offering a dynamic range of 70.2 dB. With a resolution of 8176x6132 pixels, it operates b/w 0-60 °C and supports data rates up to 18 Mbps. Ideal for high-resolution imaging applications in various industries.
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Having a small pixel size of 6x6 um allows for high resolution and detailed images to be captured by this image sensor.
The high maximum supply voltage of 15.5 V ensures reliable and stable operation of the image sensor under varying power conditions.
The compact body width of 50.8 inch makes this image sensor suitable for integration into various devices or systems with space constraints.
Being a CCD image sensor, it offers high-quality and low-noise image capture, making it ideal for applications that require accurate image reproduction.
The low profile body height of 3.46 mm enables the image sensor to be easily incorporated into thin devices or modules.
The rectangular package shape allows for easy and secure mounting of the image sensor in various orientations, enhancing its versatility.
The low minimum supply voltage requirement of 14.5 V helps in reducing power consumption and extending the battery life of devices using this image sensor.
With a high maximum operating temperature of 60 °C, this image sensor can withstand elevated temperatures and harsh environmental conditions.
The high horizontal pixel count of 8176 results in detailed and high-resolution image output, making it suitable for applications requiring precise image capture.
The low minimum operating temperature of 0 °C ensures the image sensor can function reliably in cold environments without performance degradation.
The ceramic housing provides excellent thermal conductivity and durability, offering optimal protection for the sensitive components within the image sensor.
The high dynamic range of 70.2 dB enables this image sensor to capture a wide range of light intensities accurately, resulting in well-exposed images with detailed shadows and highlights.
With a vertical pixel count of 6132, this image sensor delivers high-quality images with precise details and smooth gradients, making it ideal for imaging applications.
The moderate body length/diameter of 59.61 mm strikes a balance between compactness and functionality, allowing for easy integration and handling of the image sensor.
The wide spectral response range of 350-1100 nm enables the image sensor to capture a broad spectrum of light, making it versatile for various imaging applications across different wavelengths.
With a high data rate of 18 Mbps, this image sensor can rapidly transmit image data, enabling real-time image processing and high-speed imaging applications.
The solder termination type provides a reliable and secure connection for the image sensor, ensuring stable operation and durability in demanding environments.
Being a full-frame array type, this image sensor offers uniform pixel distribution across the entire imaging area, resulting in consistent image quality and improved signal-to-noise ratio.
The through-hole mounting feature simplifies the installation process of the image sensor, enabling easy and secure attachment to circuit boards or mounting surfaces.
Image Sensors KAF-50100-CAA-JD-AA attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Height:
Body Length/Diameter:
Data Rate:
Dynamic Range:
Horizontal Pixel:
Housing:
Mounting Feature:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Shape or Style:
Pixel Size (um):
Sensors or Transducers Type:
Spectral Response (nm):
Maximum Supply Voltage:
Minimum Supply Voltage:
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Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
STM32H743BIT6
STMicroelectronics
STM32H743BIT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 208 terminals, and 1085440 bytes of RAM. It features 2 DAC channels, 32 ADC channels, and operates at a max clock frequency of 48 MHz. Ideal for industrial applications requiring high-speed processing and extensive peripheral connectivity.
MBRA340T3G
Onsemi
MBRA340T3G by Onsemi is a Schottky rectifier diode with 40V reverse test voltage and 3A max output current. Ideal for power applications, it operates b/w -55 to 150°C, features matte tin terminal finish, and comes in a small outline package.
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
2N2222A
Hi-tron Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
2N7002
Supertex
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Maximum Feedback Capacitance (Crss): 5 pF;
LL4148
Rfe International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM555CN
Rca Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
CRCW04020000Z0EDHP
Vishay Intertechnology
Vishay Intertechnology's CRCW04020000Z0EDHP is a 0402 SMT resistor with 0 ohm resistance, rated for temperatures from -55°C to 155°C. Ideal for jumper applications in automotive electronics due to AEC-Q200 compliance and compact size of 1mm x 0.5mm x 0.3mm.
FDN306P
FDN306P by Onsemi is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration with BUILT-IN DIODE and GULL WING terminals. Operating in ENHANCEMENT MODE, it has a max ID of 2.6A and 0.04 ohm RDS(on), suitable for small outline packages at temperatures ranging from -55 to 150°C.
Semicoa
ECA2DHG4R7
Panasonic
ECA2DHG4R7 by Panasonic is a 4.7uF aluminum electrolytic capacitor with 200V rated DC voltage. It features tan delta of 0.15, leakage current of 0.0664mA, and ripple current of 50mA, making it ideal for applications requiring high capacitance stability and low leakage in through-hole mounting setups at temperatures ranging from -25 to 105°C.
NDT2955
NDT2955 by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 15A and EAS of 174mJ, suitable for ENHANCEMENT MODE operation. With a compact SMALL OUTLINE package and -55 to 150 °C operating range, it offers efficient power dissipation up to 3W.
SS14
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
General Semiconductor
DRV5053VAQLPG
Texas Instruments
Texas Instruments DRV5053VAQLPG is a magnetic field sensor with 2.5-38V supply voltage range, -40 to 125°C operating temperature, and 0-2V output. Ideal for applications requiring Hall effect sensors like automotive, industrial automation, and robotics due to its compact size (1.52" x 4mm) and high output current capability of 2.3A.
LM358N
Silicon Group
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
New Jersey Semiconductor Products
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Package Shape: ROUND;
DP83848IVVX/NOPB
National Semiconductor
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: QFP; Package Shape: SQUARE;
Cobham Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 100; Maximum Turn Off Time (toff): 300 ns;
LM2931AZ-5.0G
LM2931AZ-5.0G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 5V and max output current of 0.1A. It has a max dropout voltage of 0.6V, making it suitable for applications requiring stable power supply in temperature-sensitive environments up to 125°C. The package style is cylindrical with wire terminals, ideal for rail packing methods in various electronic devices.
OV07740-A32A
Omnivision Technologies
IMAGE SENSOR,CMOS;
KAI-29052-FXA-JD-AE
KAI-29052-FXA-JD-AE by Onsemi is an image sensor with 5.5x5.5 um pixel size, 6576 horizontal pixels, and 4384 vertical pixels. It operates at a max supply voltage of 15.5 V and has a dynamic range of 66 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
AR0147ATSC00XUEG0-TPBR
Onsemi's AR0147ATSC00XUEG0-TPBR is a 3x3 um CMOS image sensor with 1344H x 968V pixels, offering a dynamic range of 140 dB. Operating at -40 to 110 °C, it has a max supply voltage of 1.26 V and output interface type of 2-WIRE INTERFACE. Ideal for applications requiring high-resolution imaging and low-light sensitivity in compact devices.
KAI-16070-FXA-JD-B2
KAI-16070-FXA-JD-B2 by Onsemi is an image sensor with 7.4x7.4 um pixel size, 40 MHz master clock, and 70.5 dB dynamic range. Ideal for applications requiring high-resolution imaging in industrial cameras or scientific instruments due to its 4864x3232 pixel resolution and INTERLINE array type.
MT9V011P11STC-B-DP
MT9V011P11STC-B-DP by Onsemi is a 640x480 CMOS image sensor with 5.60um pixel size, 27 MHz master clock, and 60dB dynamic range. Ideal for digital cameras, surveillance systems, and automotive applications due to its high resolution and low power consumption.
AR0323ATSB17XUEA0-DPBR-E
Onsemi's AR0323ATSB17XUEA0-DPBR-E is a CMOS image sensor with 3x3 um pixel size, 64 MHz master clock, and 1.26V max supply voltage. Ideal for digital cameras, surveillance systems, and automotive applications due to its high dynamic range of 120 dB and frame rate of 45 fps.
CYII4SC014KAA-GAC
CYII4SC014KAA-GAC by Onsemi is an 8x8 um CMOS image sensor with a max supply voltage of 3.3V and a master clock of 15 MHz. It offers a dynamic range of 65 dB, operates b/w 0-50 °C, and outputs analog voltage from 0.50-3V. Ideal for applications requiring full-frame array type sensors with SPI interface and through-hole mounting features at a frame rate of 3.25 fps.
KAI-04022-FBA-CR-BA
KAI-04022-FBA-CR-BA by Onsemi is an image sensor with 2048x2048 pixels, 7.4um pixel size, and 72dB dynamic range. Ideal for applications requiring high-resolution imaging in a compact form factor, such as industrial machine vision systems or scientific cameras.
KAI-2001M
Image Sensors;
KAI-16000-AAA-JP-B2
KAI-16000-AAA-JP-B2 by Onsemi is an image sensor with 7.4x7.4 um pixel size, 4872 horizontal pixels, and 3248 vertical pixels. It operates b/w -50 to 70 °C with a dynamic range of 65 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
KAI-08670-AXA-JD-B2
Onsemi's KAI-08670-AXA-JD-B2 image sensor features 7.4x7.4 um pixel size, 40 MHz master clock, and 3600 horizontal pixels. Ideal for applications requiring high-quality imaging with a dynamic range of 82 dB, such as industrial machine vision systems or surveillance cameras.
AR0234CSSC00SUKA0-CP1
The Onsemi AR0234CSSC00SUKA0-CP1 image sensor features 1920x1200 resolution, 3x3 um pixel size, and 71.4 dB dynamic range. It is ideal for applications requiring high-quality digital imaging such as surveillance cameras, automotive vision systems, and drones due to its compact rectangular package and 120 fps frame rate.
NOIH2SM1000T-HHC
NOIH2SM1000T-HHC by Onsemi is a CMOS image sensor with 1024x1024 pixels, 18x18 um pixel size, and operates at temperatures from -40 to 85 °C. It has a digital voltage output range of 2.20-2.60V and requires a 3.3V power supply. Ideal for applications requiring high-resolution imaging in a compact square ceramic package for surface mount assembly.
MT9T031C12STC
Onsemi's MT9T031C12STC is a 3.20x3.20 um CMOS image sensor with 2048H x 1536V pixels, operating at 48 MHz clock speed and offering a dynamic range of 61 dB. It has a digital voltage output interface, operates b/w 0-60°C, and is commonly used in frame array applications for capturing images with high resolution and clarity.
AMIS-710225
Image Sensors; Horizontal Pixel: 832; Power Supplies (V): 5; Maximum Operating Temperature: 50 Cel; Minimum Operating Temperature: 0 Cel;
KLI-4104-AAA-CB-AE
KLI-4104-AAA-CB-AE by Onsemi is an Image Sensor with 10x10 um pixel size, 4134 horizontal and vertical pixels. It operates b/w 0 to 70 °C, with a dynamic range of 60 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
KAI-0340-AAA-CP-AA
KAI-0340-AAA-CP-AA by Onsemi is an image sensor with 7.4x7.4 um pixel size, 640 horizontal pixels, and 480 vertical pixels. It operates b/w -50 to 70 °C with a dynamic range of 62 dB. Ideal for applications requiring high-quality imaging in industrial or scientific settings.
KAI-16050-PXA-JD-B1
Onsemi's KAI-16050-PXA-JD-B1 is a 5.5X5.5 um CCD image sensor with 4896x3264 pixels, offering a dynamic range of 64 dB. It operates at temperatures ranging from -50 to 70 °C and requires a 15V power supply. Ideal for applications requiring high-resolution imaging in various industries.
MT9V131C12STCES
Onsemi's MT9V131C12STCES image sensor features 5.6x5.6 um pixel size, 640x480 resolution, and 27 MHz master clock. Ideal for digital cameras, surveillance systems, and machine vision applications due to its high sensitivity of 1.9 V/lx.s and frame rate of 30 fps.
TC236
TC236 by Texas Instruments is an image sensor with 7.4x7.4 um pixel size, 22V power supply, and 496x658 horizontal/vertical pixels. It operates b/w -10 to 45 °C and features THROUGH HOLE MOUNTing. Ideal for applications requiring high-resolution imaging in various temperature conditions.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
KAF-50100-AAA-JD-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Body Width: 50.8 inch; Termination Type: SOLDER; Body Length/Diameter: 59.61 mm;
KAF-50100-AAA-JD-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Data Rate: 18 Mbps; Body Height: 3.46 mm; Maximum Operating Temperature: 60 Cel;
KAF-50100-ABA-JP-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Spectral Response (nm): 350-1100; Maximum Supply Voltage: 15.5 V; Minimum Supply Voltage: 14.5 V;
KAF-50100-ABA-JP-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Horizontal Pixel: 8176; Vertical Pixel: 6132; Minimum Supply Voltage: 14.5 V;
KAF-50100-ABA-JR-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 15.5 V; Body Width: 50.8 inch; Dynamic Range: 70.2 dB;
KAF-50100-ABA-JR-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Minimum Supply Voltage: 14.5 V; Maximum Operating Temperature: 60 Cel; Body Width: 50.8 inch;
KAF-50100-CAA-JD-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Data Rate: 18 Mbps; Spectral Response (nm): 350-1100; Body Width: 50.8 inch;
KAF-5101CE
Truesense Imaging
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Horizontal Pixel: 8176; Minimum Operating Temperature: 0 Cel; Vertical Pixel: 6132;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Housing: CERAMIC; Pixel Size (um): 6X6; Termination Type: SOLDER;
KAF-50100-CAA-JD-AA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Termination Type: SOLDER; Maximum Supply Voltage: 15.5 V; Array Type: FULL FRAME;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Minimum Supply Voltage: 14.5 V; Horizontal Pixel: 8176; Data Rate: 18 Mbps;
Supply Digital Components
$106.00
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Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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